S3 Graphics Deployed Yield Closure Solution From Nannor Technologies.

SANTA CLARA, Calif. -- Nannor Technologies, Inc., a leading provider of yield closure solution, and S3 Graphics, a VIA Technologies joint venture company and a leading supplier to the 3D enabled PC graphics market, today announced the deployment of Acuma, a full chip layout optimization tool from Nannor Technologies, Inc., for their SoC design at sub 90 nanometer technologies.

"Our engineers continue to explore ways to achieve yield closure in a fast and efficient manner," said Michael Shiuan, vice president of Engineering at S3 Graphics. "Nannor's Acuma full chip layout optimization capabilities well suit our requirements for complex SoC designs with leading edge 90- and 65- nanometer processes. Acuma enables us to achieve yield closure while retaining time closure, signal integrity closure, and power closure."

"While most of the current DFM tools report yield problems, Acuma fixes the problems by via duplication and optimization, wire spreading and widening, lithography 'hot spots' elimination," said Yongbo Jia, president of Nannor Technologies, Inc. "With our patented technology, instead of performing those sometime conflicting operations in separate passes, Acuma makes the right trade offs in one pass. In addition to processing full chip with the unparalleled capacity and speed, Acuma provides the flexibility of incremental layout optimization targeting at low yielding area or lithography 'hot spots' to accelerate the convergence," Yongbo added. "Acuma provides designers a plug-in yield closure solution which can be seamlessly integrated with mainstream EDA design flows, via LEFF/DEF file interface, Synopsys Milkyway database, and Cadence Open Access database."

About Nannor

Headquartered in Santa Clara, California, Nannor Technologies, Inc. was founded in March 2003. Based on a patented technology, Acuma provides post placement and route full chip layout optimization tools for yield closure while keeping intact such as timing, signal integrity, and die size. For more information please visit the website www.nannor.com

About S3

A VIA Technologies, Inc. joint venture company, is a leading supplier in the 3D enabled PC graphics market. S3 Graphics ships low power, high performance, commercial grade 3D graphics sub-systems to top tier notebook manufacturers. In addition, S3 Graphics integrates market-leading chipset technology from VIA Technologies, Inc. (www.viatech.com) into shared memory architecture products for the high volume, value PC market. Headquartered in Fremont, California, S3 Graphics has a long-term commitment to top performance, quality and state-of-the-art features for desktop and mobile applications.