Rudolph Systems Detect New Class of Wafer Backside Defects and Correlate to Frontside Die; European Fab Prefers New B20 System Color Processing With Harmony ASR Auto-Die Classification; Places Multi-Unit Order.

SAN FRANCISCO -- Building on its leadership position in all-surface macro defect inspection, Rudolph Technologies, Inc. (NASDAQ: RTEC), today announced a multi-system order for its NSX(TM) and B20(TM) Systems to a major European semiconductor fab. The inspection tool-set, featuring new backside color processing capability and auto-die classification, will be used for outgoing quality assurance in back-end semiconductor manufacturing--the critical last opportunity to catch defects before the semiconductor ICs are diced and packaged. The configuration includes NSX Systems for frontside inspection, B20 Systems for backside inspection, and Harmony ASR(TM) (all-surface review) Software for defect analysis and management.

According to Mayson Brooks, vice president of global inspection sales for Rudolph Technologies, "Color processing capability on the B20 System allows our customer to detect a new class of subtle backside defects and correlate them to frontside die--both of which were key factors in the their purchase decision."

The NSX Series, when combined with the B20 Backside Inspection module, can detect defects on the backside and include them with the frontside inspection results. The B20 System has both brightfield and darkfield capabilities to detect a wide range of defects.

The innovative color processing capability increases the sensitivity of the system to subtle color defects, such as chemical stains and micro arcings, which are invisible to conventional light-scattering inspection system or review scopes. In addition to detecting defects, the B20 System can capture the coordinates and images of these defects and pass them on to the Harmony ASR Software. Rudolph's Harmony ASR allows the user to review frontside and backside images together, determine the severity of the defect, and "knock out" individual die based on defects on the front or back of that die. Unaffected die are retained, resulting in a significant improvement in process yield. This all-surface correlation allows a customer to scrap only problem die, rather than entire wafers.

Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection and data analysis systems used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph's strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company's web site at www.rudolphtech.com.

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The press releases in this July 11, 2006 Press Kit contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the "Act"). In some cases, you can identify those so-called "forward-looking statements" by words such as "may," "will," "would," "should," "expects," "plans," "anticipates," "believes," "feels," "estimates," "predicts," "potential," or "continue," or the negative of those words and other comparable words. Rudolph wishes to take advantage of the "safe harbor" provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph's control. Factors that could cause actual results to differ materially from the expectations expressed in such forward-looking statements, include, but are not limited to, the impact of the slowdown in the overall economy, the uncertainty of the current global political environment, the potential for terrorist attacks, the potential for business disruptions due to infectious diseases, changes in customer demands for our existing and new products, the timing, cancellation or delay of customer orders and shipments, the timing of revenue recognition of shipments, new product offerings from our competitors, changes in or an inability to execute Rudolph's business strategy, unanticipated manufacturing or supply problems and changes in tax rules. Rudolph cannot guarantee future results, levels of activity, performance, or achievements. The matters discussed in this press release also involve risks and uncertainties as summarized in Rudolph's Form 10-K report for the year ended December 31, 2005 and other filings with the Securities and Exchange Commission ("SEC"), which are available at http://www.sec.gov, the SEC's website, and at http://www.rudolphtech.com, the Rudolph website. While these factors may be updated from time to time through the filing of reports and registration statements with the SEC, Rudolph does not assume any obligation to update the forward-looking information contained in this press release.