Rodel Launches Full Suite of Copper CMP Integrated Process Solutions for 90nm.

Business Editors/High-Tech Writers

PHOENIX--(BUSINESS WIRE)--Sept. 16, 2002

To address the performance challenges of its customers in semiconductor manufacturing, Rodel, Inc., an innovator of integrated materials for the microelectronics industry, today announced that it has developed a complete suite of fully characterized copper CMP products and processes of record (PORs) that meet 90nm node ITRS and end-user performance requirements. The offerings include copper, barrier and dielectric polishing pads, and chemistries and conditioners that can be applied to multiple integration schemes and "tuned" for customer-specific applications. Experienced integration engineers are available to help implement these copper products and PORs on-site.

"Where copper is concerned, Rodel has the products, process and people to make it work for our customers. We have a solid understanding of copper CMP and the unique challenges it presents, and we have invested heavily in the necessary resources to develop products, processes and integrated solutions to meet industry needs," said Tony Corey, president and CEO, Rodel. "As a result, Rodel now has the systems and products in place to assure product performance reliability for copper CMP at the 130nm and 90nm nodes. In addition, our early performance data show signs of possible extendibility for meeting the 65nm node requirements."

Rodel's family of customized copper/barrier/dielectric polishing chemistries includes single component, silica-based copper bulk removal and clearing slurries, single component selective reactive liquid copper-clearing chemistries, single component selective and non-selective silica-based barrier and dielectric polishing and isolation slurries. In addition, porous ULK barrier and dielectric isolation chemistries are part of the family of offerings currently in development. Rodel's suite of viable pad options, which is the industry's broadest, features porous and non-porous polymerics, film-based poromerics, and multiple surface-modification options.

"Rodel has more customized copper CMP product options designed to meet customer performance and cost of ownership requirements than any other consumables supplier. Our engineers developed the copper products and PORs for high-volume manufacturing from a customer's perspective and tested the solutions on production equipment. Because of this expertise, we know how copper CMP works and how to adjust various product and process components, thereby enabling our customers success," said Dan Koharko, executive vice president, strategy and technology, Rodel.

Rodel, Inc. is an innovator of integrated materials for the microelectronics industry and global leader in polishing technology for semiconductors, silicon wafers and storage media substrates. The company has been a key supplier to the semiconductor industry since 1969. Rodel has operations throughout the United States, Asia and Europe with its global headquarters and Materials Integration Center in Phoenix, AZ, manufacturing operations and Materials Development Center in Newark, DE, and additional manufacturing facilities in Japan. Rodel is part of the Rohm and Haas Electronics Materials Group, which also includes the Shipley Company. Headquartered in Philadelphia, PA, Rohm and Haas is a $5.7 billion specialty chemical technology company. Rodel can be found on the Internet at www.rodel.com.