Rework system.The APR APR See: Annual Percentage Rate 5000 array package rework system offers repeatability, accuracy and thermal control needed for the safe and effective rework of current BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. , CSP, LGA LGA abbr. large for gestational age LGA Large for gestational age, see there , micro SMD (1) (Storage Module Device) A high-performance hard disk interface used with minis and mainframes that transfers data in the 1-4 MBytes/sec range (SMD-E provides highest rate). See hard disk. , MLF and bumped chip component packages. Capable of handling boards up to 203.2 x 254 mm, and with a placement accuracy to 0.001 in. and interconnection pitches as low as 0.3 mm, the system can be used to rework smaller PCBs, such as those found in cell phones and lap top computers. Metcal, Inc., Menlo Park, CA Booth #3947 Circle 109 [ILLUSTRATION OMITTED] |
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