Research and Markets : The Recent Announcement Of Samsung In 2006 Could Speed Up Micro-Via Technology Especially For The Memory Business - 3D Packaging Technologies- How It Will Impact The Semiconductor Food Chain ?DUBLIN, Ireland -- Research and Markets (http://www.researchandmarkets.com/reports/c49899) has announced the addition of Innovative 3D packaging technologies- How it will impact the semiconductor food chain? to their offering. This Report offers technical analyses of the different 3D packaging solutions and explains how they will impact the semiconductor food chain. Why buy this report? We are at the crossroads of numerous breakthroughs in 3D stacking! Although 3D ICs are at the R&D stage in the largest semiconductor companies today, the recent announcement of Samsung in 2006 could speed up micro-via technology especially for the memory business. By acquiring the new 3D IC report, you will have access to: * An overview of the different 3D packaging approaches (SoC, SiP O) * What are the market drivers and market forecasts for 3D ICs * The status of development for the different identified players (ICs, image sensors) * The evolution of the business models (OSAT OSAT On-Site Assessment and Training OSAT Office for the Study of Automotive Transportation OSAT One Step At a Time (outdoor activity club) OSAT One Step At a Time (George Strait album) , IDMs, wafer fabs O) * How the adoption of 3D stacking could significantly change the standard semiconductor process (FEOL FEOL Front End Of Line (semiconductor manufacturing) vs. BEOL BEOL Back-End-Of-Line BEOL Bent's Old Fort National Historic Site (La Junta, Colorado) BEOL Bent's Old Fort National Historic Site (US National Park Service) ) * The equipment and materials market forecasts for 3D integration (for DRIE v. t. 1. To endure. So causeless such drede for to drie. - Chaucer. , laser, bonders and materials) * An analyze of the different technical solutions * The TSVs (Through Silicon Vias) -- electrically isolated interconnections through the silicon, which requires laser or deep reactive ion etching (DRIE) to create through vias. * Filling the TSVs with different materials (copper, tungsten, polySi, conductive polymers O) * Thin wafers handling, usually below 50 om. * Alignment and bonding of wafer- to- wafer or chip- to- wafer or chip- to- chip. * Bonding technologies by silicon fusion, polymer bonding, direct copper- to- copper, copper- tin eutectic bonding. Who should buy this report? This report targets both devices manufacturers and packaging companies as 3D will be such a breakthrough for packaging than developments are running whatever the activity of the semiconductor companies. This report is of great interest for equipments manufacturers as well, as new investments are planned in a close future for implementing all the 3D technological steps. So, whatever is your responsibility, R&D, production, marketing or business development, this IC report will give you a deep insight for markets and technological challenges for 3D integration. Companies Mentioned: * 3D- Plus * All- via * Amkor * ASE (Adaptive Server Enterprise) A relational DBMS from Sybase that runs on Windows NT/2000, Linux and a variety of Unix platforms. ASE is a comprehensive and robust data management product with a long history dating back to the late 1980s. * ASM (1) (Association for Systems Management) An international membership organization based in Cleveland, Ohio. Founded in 1947 and disbanded in 1996, it sponsored conferences in all phases of administrative systems and management. International * Dow Corning * E2V * EM Microelectronics * Fraunhofer IZM * Freescale * Fujikura * Fujitsu * Hymite * Hynix Semiconductor * IMEC * Infineon * Intel * Leti * Matsushita Electric Works Matshushita Electric Works (MEW), Ltd. can trace its beginnings to a company that was founded in 1918 by Konosuke Matsushita. Matshushita began making the flashlight components for bicyles, then progressed to making lighting fixtures. * MEMSiC * Micron * MicroResist * NEC (NEC Corporation, Tokyo, www.nec.com, www.necus.com) An electronics conglomerate known in the U.S. for its monitors. In Japan, it had the lion's share of the PC market until the late 1990s (see PC 98). NEC was founded in Tokyo in 1899 as Nippon Electric Company, Ltd. * Nokia * Philips Image Sensors * Philips Semiconductors * Samsung * Semitool * SensoNor * Silex, * SPIL SPIL Signal Processor In the Loop SPIL Society of Petroleum Industry Leaders (Naked Gun 2½: The Smell of Fear) SPIL Siliconware Precision Industries Limited (Taiwan) * STMicroelectronics * SouSS microtec * Synova * Tessera * Texas Instruments * TSMC TSMC Taiwan Semiconductor Manufacturing Company, Ltd TSMC Taiwan Semiconductor Manufacturing Corporation TSMC Traffic Systems Management Center TSMC Toll Station Management Controller TSMC Transportation Supply Maintenance Command TSMC Technical Services Manager Code * VTI Technologies * VTT * Xintec * XSil * Ziptronix * Zycube For more information visit http://www.researchandmarkets.com/reports/c49899 |
|
||||||||||||
Printer friendly
Cite/link
Email
Feedback
Reader Opinion