Replisaurus Raises $14.4 Million; Replisaurus Technologies, Inc. Raises $14,400,000 in First-Round Funding to Commercialize Non Lithographic Micro Cell Plating Technology.

KISTA, Sweden -- Replisaurus Technologies, Inc. has raised a first round funding of $14,400,000 led by Wellington Partners and Northzone Ventures. The new investors were joined by seed investors KTH Seed Capital, FBBB (ForetagsByggarna) and Aumar - The Sixth AP Fund (AP6). The proceeds will be used by the company for commercialization of the proprietary ECPR (ElectroChemical Pattern Replication) technology.

As part of the investment the Board has appointed industry veteran James Quinn as CEO and Board member joining the Replisaurus founders Patrik Moller, Chief Technology Officer (CTO) and Mikael Fredenberg, Chief Operating Officer (COO). With this significant first round funding, Replisaurus will add to its Board of Directors, Bart Markus from Wellington Partners and Bjorn Stray from Northzone Ventures. Mr. Quinn will work closely with the Board and Venture Capital investors to develop and grow the company and strengthen Replisaurus Technologies position as an emerging key player in the advanced packaging market.

Before joining Replisaurus, Mr. Quinn was group vice president of SUSS MicroTec, where he held a variety of roles, including Managing Director of the company's Advanced Packaging business unit, Managing Director of North America and Group VP of Global Sales and Service. Mr. Quinn became part of the SUSS Group in 2001, when SUSS acquired his precision photomask company Image Technology, Inc., where he was President and CEO. In addition, Mr. Quinn was a founding member of SECAP (Semiconductor Equipment Consortium Advanced Packaging).

Replisaurus has developed a revolutionary metallization technology which enables a Non Lithographic MicroCell Plating process. The integrated "ElectroChemical Pattern Replication" (ECPR) process is an enabling technology targeted at key growth markets such as integrated passives, copper pillars and 3D integration. The Replisaurus ECPR process offers a simple and cost effective integrated solution eliminating several traditional process steps thereby reducing complexity. Replisaurus has won numerous technology, industry and venture awards and was selected by European Semiconductor Magazine (EuroAsia) as 2005 "European Semiconductor Start-up of the Year."

"The market opportunity in the advanced packaging space is exceptional" stated Bart Markus from Wellington Partners. "The superior characteristics of Replisaurus' technology along with the excellent team told us that Replisaurus will be a leader in this field."

"As this is the first advanced packaging company that Northzone invested in and the first investment from Fund V, we were cautious," stated Bjorn Stray from Northzone Ventures. "We came to the conclusion that Replisaurus has extraordinary technology and is poised to become a leader in the advanced packaging space."

About Replisaurus Technologies

Replisaurus Technologies, Inc. has developed a revolutionary metallization technology which enables a Non Lithographic MicroCell Plating process. The integrated "ElectroChemical Pattern Replication" (ECPR) process is an enabling technology targeted at key growth markets such as integrated passives, copper pillars and 3D integration. The company has demonstrated fine pitch/high resolution capability (less than 500nm lines/less than 280nm space) and significantly improved thickness uniformity. The Replisaurus ECPR process offers a simple and cost effective integrated solution eliminating several traditional process steps thereby reducing complexity. The ECPR process does not use solvents, developers or strippers and has extremely fast plating rates. In addition, the ElectroChemical Pattern Replication (ECPR) process is a "Design Enabling" technology for integrated passives enabling advanced designs, eliminating the need for prototyping and dummy plating patterns. For more information please visit us at www.replisaurus.com