Rambus to Outline Mobile and MultiCore Memory Challenges and Solutions at MemCon 2008.

Rambus Inc. (NASDAQ:RMBS):

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Rambus Booth Demonstrations:

* The Terabyte Bandwidth Initiative, featuring new memory signaling innovations that facilitate data rates of 16Gbps and a future memory architecture that can deliver an unprecedented terabyte per second (TB/s) of memory bandwidth (1 terabyte = 1,024 gigabytes) to a single System-on-Chip (SoC). Innovations include the industry's first differential signaling for both data and command/address (C/A); FlexLink([TM]) C/A, the industry's first full-speed, point-to-point C/A link; and 32X Data Rate technology (32 data bits per input clock cycle).

* The award-winning XDR([TM]) memory architecture: a low-cost XDR system solution operating at 3.2Gbps data rate, on a two-layer printed circuit board. The test board shows a Rambus XDR PHY and memory controller interfacing to an XDR DRAM.

* A PLAYSTATION([R])3 (PS3[TM]) Open Demo Board featuring XDR technology. The Rambus XDR memory interface and FlexIO([TM]) processor bus enable an unprecedented aggregate bandwidth of over 90 gigabytes-per-second between the Cell Broadband Engine and supporting chips at the heart of the PS3.

* TI DLP Open Demo Board: Rambus is showing an open TI DLP projector development board, highlighting Rambus XDR technology inside. The development board includes a 4.0Gbps, 16-bit XDR interface, an XDR Memory Controller (XMC), XDR memory cell interface (XIO), XDR DRAM, and the XDR Clock Generator (XCG). XDR has been adopted by TI for use in their DLP graphics engines, targeted at consumer projectors. TI DLP technology, included in Sharp projectors, is one of many consumer-level applications taking advantage of the XDR memory architecture.

For registration and additional information, please visit http://www.denali.com/memcon

About Rambus, Inc.

Rambus is one of the world's premier technology licensing companies specializing in the invention and design of high-speed memory architectures. Since its founding in 1990, the Company's patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus' technology and products solve customers' most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, Korea and Taiwan. Additional information is available at www.rambus.com.

Rambus and the Rambus logo are registered trademarks of Rambus Inc. XDR, FlexPhase and FlexLink are trademarks of Rambus Inc. All other trade names are the service marks, trademarks, or registered trademarks of their respective owners.