RadiSys Unveils New Products, Outlines Strategy Supporting Intel's Network Processors and the Intel Internet Exchange Architecture.Business Editors, Technology Writers Intel Developer Forum Intel Developer Forum (IDF), is a twice yearly gathering of technologists to discuss Intel products and products based around Intel products. The first IDF was in 1997. There is usually a Spring IDF and a Fall IDF. SAN JOSE, Calif.--(BUSINESS WIRE)--Aug. 27, 2001 RadiSys Corp. (Nasdaq:RSYS) today announced a set of product offerings, including boards and chipsets, that broaden support for the Intel(R) Internet Exchange Architecture Internet Exchange Architecture (acronym: IXA) is a chip set and framework produced by Intel Corporation used by manufacturers to design customised network processors. Introduced in 1999, the first model was based on the StrongARM processor. (IXA (1) (Integrated XSeries Adapter) See IXS. (2) (Internet EXchange Architecture) A family of chips from Intel that are designed to enable network device manufacturers to build custom systems. ) and Intel(R) IXP (1) (Internet EXchange Processor) See IXA. (2) (Internet eXchange Point) A public junction point on the Internet that provides an on-ramp to the Internet as well as a location for carriers to exchange traffic. 1200 Network Processor family. RadiSys is a leading global designer and manufacturer of building blocks enabling next-generation Internet and communications systems. RadiSys also unveiled a strategy that complements Intel's announced IXA strategy and outlined solutions for both voice packet processing and packet-to-packet processing. RadiSys products are targeted for applications requiring high-density or wire-speed packet processing for various streaming data, intelligent router, aggregator, firewall and security applications. RadiSys IXA-based products for the IXP1200 Network Processors help network providers deal with increased Internet growth, emergence of intelligent networks and voice/data convergence. This convergence phenomenon has fueled heightened demand for smarter, faster packet processing. RadiSys' solution enables programmable wire-speed packet processing at a lower cost and in less time than those found with non-programmable, ASIC-based designs. The network-processor market is expected to explode in the next few years. IDC estimates the market to be at $300 million by 2002, jumping to $2.8 billion by 2004. The voice-over-IP (VoIP) gateways market, which hit $3.7 billion in 2000 will balloon to $12.3 billion by 2006 according to Allied Business Intelligence of Oyster Bay, New York
Oyster Bay is the name of a hamlet and census-designated place on the North Shore of Long Island in Nassau County in the state of New . As a leading supporter of Intel's network processor technology, RadiSys is poised to provide products that enable VoIP via wire-speed, packet-processing technology for OEMs rushing to take advantage of the market explosion. "RadiSys has long supported Intel-based solutions and is an important provider of building blocks based on Intel's IXA," said Nick Finamore, general manager of Intel's Network Processor Business Unit. "As we move toward next-generation networks, the power of our network processors and RadiSys' support for wire-speed packet processing technology will enable developers of next-generation, integrated communications systems to facilitate data, voice and packet-to-packet processing over their networks." These solutions enable telecom OEMs to develop and market advanced, complex products and systems that support the convergence of voice and data communications and wireless technologies and the Internet. "As voice/data convergence gains momentum, the industry's need for products that enable wire-speed, programmable packet processing will explode," said Glen Myers, RadiSys president and CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. . "Our strategy is keenly aligned with Intel and the needs of those developing next-generation voice/data applications." ENP-2505 and ENP-2506 Products The ENP-2505 and ENP-2506 products are designed in the PCI (1) (Payment Card Industry) See PCI DSS. (2) (Peripheral Component Interconnect) The most widely used I/O bus (peripheral bus). form factor and powered by an Intel(R) IXP1200 Network Processor with a 232 MHz StrongARM(a) core and six multithreaded microengines capable of wire-speed packet analysis, processing and forwarding. The ENP-2505 is a high-performance packet-processing engine available in a PCI form factor with four 10/100 Mbit Ethernet ports. The ENP-2506 is identical, but with two optical gigabit Ethernet ports. These products include 256 Mbytes of SDRAM (Synchronous DRAM) A type of dynamic RAM (DRAM) memory chip that has been widely used since the late 1990s. SDRAM chips eliminated wait states by dividing the chip into two cell blocks and interleaving data between them. as well as 8 Mbytes of on-board flash memory and 4 Mbytes of on-board SRAM See static RAM. SRAM - static random-access memory . Additionally each board offers a PMC (1) See Portable Media Center. (2) (PCI Mezzanine Card) A PCI-based mezzanine card that is widely adapted to VMEbus, CompactPCI and PCI cards. site, which can be used for hardware extensions and additional applications and features. TDM (Time Division Multiplexing) A technology that transmits multiple signals simultaneously over a single transmission path. Each lower-speed signal is time sliced into one high-speed transmission. 2IX Chipset The TDM2IX is a .35 micron ASIC (Application Specific Integrated Circuit) Pronounced "a-sick." A chip that is custom designed for a specific application rather than a general-purpose chip such as a microprocessor. in an industry standard 240-pin PQFP (Plastic Quad Flat Package) Refers to many varieties of QFP chip packages, which are molded in plastic. See QFP. package. The .35 micron implementation minimizes the power requirements of the TDM2IX while enabling operation at the full speed of the IX bus of the IXP1200 Network Processor. When coupled with an industry-standard TSI TSI Total Solar Irradiance (sum solar light in energy per unit of time) TSI Trading Standards Institute (UK) TSI Transportation Safety Institute (US DOT) (Time Slot Interchanger), the TDM2IX allows access to any or all of the 4096 DS0s of the H.110 CompactPCI bus. Because of the small footprint, the TDM2IX uses minimum board real estate and simplifies board routing. About RadiSys RadiSys (Nasdaq:RSYS) designs and manufactures building blocks for next-generation Internet and communications systems. As the leading independent provider to OEMs, RadiSys delivers a time-to-market advantage in a tight "virtual division" relationship with its customers. The building blocks include embedded computers based on Intel Architecture, DSP modules and algorithms, network interfaces and protocols, systems platforms, and embedded software. RadiSys' highly differentiated position in the market is a result of its intense focus on Intel technology, having the broadest array of building blocks, and a "perfect fit" product development strategy using its intellectual property to design customer subsystems. RadiSys is a registered trademark of RadiSys Corporation. (a) All other products are trademarks or registered trademarks of their respective companies. Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States an in other countries. The matters discussed in this press release contain forward looking statements that are subject to the risk factors found in RadiSys' 1999 Form 10-K, and such statements should be considered in light of those factors. For more information, contact RadiSys at info@radisys.com or http://www.radisys.com or call 800/950-0044 or 503/615-1100. For press information only: Eric Stebel, Public Relations Manager, RadiSys Corp., 713/541-8200. |
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