RadiSys Integrates the Intel 815E Chipset and Pentium III in Its Low-Cost, High-Performance CompactPCI Building Block.Business Editors/High-Tech Writers HILLSBORO, Ore.--(BUSINESS WIRE)--May 21, 2001 RadiSys Corp. (Nasdaq:RSYS), a leading provider of building blocks enabling next-generation Internet and communications systems, today introduced the industry's first CompactPCI(R) system controller based on the embedded Intel(R) 815E chipset. This latest RadiSys building block delivers OEMs both low cost and exceptional performance, for industrial automation, medical imaging and telecommunications applications, which require high-performance in a highly reliable system controller. Additionally, it is ideal for OEMs who need feature flexibility and a variety of I/O interfaces. The Intel 815E chipset's built-in, high-performance AGP graphics and audio controller also makes RadiSys' latest building block well-suited to applications that require high-resolution 3D-graphics technology, such as robotics and medical imaging. Its integrated multimedia capabilities include AC '97 audio -- one of the only CompactPCI boards to offer this feature. This means an application that relies on a complex graphical user interface graphical user interface (GUI) Computer display format that allows the user to select commands, call up files, start programs, and do other routine tasks by using a mouse to point to pictorial symbols (icons) or lists of menu choices on the screen as opposed to having to (GUI (Graphical User Interface) A graphics-based user interface that incorporates movable windows, icons and a mouse. The ability to resize application windows and change style and size of fonts are the significant advantages of a GUI vs. a character-based interface. ) and audible user feedback can be implemented in a CompactPCI-based system. Video is available as a conventional analog VGA (Video Graphics Array) The display standard for the PC. All PC display adapters support VGA, and Windows machines boot up in "VGA mode" before switching to higher resolutions. interface or via the optional RTM (1) (RealTime Model) Refers to a system or architecture that performs operations in real time. See real time. (2) (Release/Released To M , in DVI (1) (Digital Video Interactive) An earlier compression technique that provided up to 72 minutes of full-screen video on a CD-ROM. Acquired by Intel in 1988 from RCA's Sarnoff Research labs, Princeton, NJ, DVI never caught on. (PanelLink) format, allowing for longer distances between the computer and a high-resolution digital display. Based on the Intel(R) Pentium(R) III processor -- supporting processor speeds from 600 to 866MHz and memory bus speeds of 100 and 133MHz -- this solution is designed to improve OEMs' time to market. Additionally, it can be expanded with an optional second-slot mezzanine board. Two mezzanine boards are currently available from RadiSys -- the MSF MSF Manufacturing, Science, and Finance (Union) (multi-serial function board) and the MSIO MSIO Modeling and Simulation Integration Office MSIO Memory Stick Input/Output (mass storage and I/O (Input/Output) The transfer of data between the CPU and a peripheral device. Every transfer is an output from one device and an input to another. See PC input/output. I/O - Input/Output board) -- and RadiSys or the OEM (Original Equipment Manufacturer) The rebranding of equipment and selling it. The term initially referred to the company that made the products (the "original" manufacturer), but eventually became widely used to refer to the organization that buys the products and can easily build customized versions. To satisfy mass storage requirements, the system controller incorporates a dual EIDE (Enhanced IDE) An extension to the IDE interface that supports the ATA-2 and ATAPI standards. ATA-2 (Fast ATA) provides faster transfer rates (see IDE for details) and allows for multiple channels, each connecting two devices. controller and a standard floppy interface. A fast SCSI II interface is also available with the optional MSIO mezzanine adapter. When configured with either the optional MSF or MSIO mezzanine I/O cards, OEMs may select an on-board 2.5-inch hard disk drive or up to two on-board CompactFlash modules for mass storage. Directly mounted mass storage devices eliminate the need to cable outside the CompactPCI system platform, thus facilitating rapid, convenient and flexible product development. On-board peripherals also eliminate extraneous and unreliable connections to non-CompactPCI peripherals. "This latest CompactPCI-based building block delivers the cost, performance, reliability and flexibility that our customers have come to expect," said Wade Clowes, vice president and general manager, RadiSys. "This is an ideal general-purpose solution for applications requiring front-panel and rear-panel I/O access, efficient use of system slots, and options for feature customization." About the EPC-3325 The EPC-3325's passive heatsink design offers OEMs a higher mean time between failures (MTBF (Mean Time Between Failure) The average time a component works without failure. It is the number of failures divided by the hours under observation. MTBF - Mean Time Between Failures ), when compared to fansink designs (which utilize an active heatsink). Additionally, the EPC-3325 includes ruggedized non-rotating mass storage (CompactFlash) and an optional SCSI SCSI in full Small Computer System Interface Once common standard for connecting peripheral devices (disks, modems, printers, etc.) to small and medium-sized computers. SCSI has given way to faster standards, such as Firewire and USB. II interface for 24 x 7 operation of 3.5-inch hard disks. The EPC-3325 features one 144-pin SODIMM (Small Outline-DIMM) A DIMM module with a thinner profile due to the use of TSOP chip packages. SODIMMs are commonly used in laptop computers. See memory module and TSOP. socket that supports up to 256MB of SDRAM (Synchronous DRAM) A type of dynamic RAM (DRAM) memory chip that has been widely used since the late 1990s. SDRAM chips eliminated wait states by dividing the chip into two cell blocks and interleaving data between them. . An additional 256MB of soldered-down SDRAM accommodates a total of 512MB of SDRAM. The EPC-3325 offers a full set of standard I/O interfaces accessible from the front panel or via an optional RTM (rear transition module). I/O interfaces include a PMC slot; dual 10/100BaseTX Ethernet interfaces; four USB ports; dual serial ports (six serial ports with the optional MSF mezzanine); a parallel port; a PS/2 keyboard/mouse; and both analog and digital (DVI) video. Additionally, RadiSys' latest building block has a real-time clock with an on-board battery, dual EIDE interfaces, and a floppy interface. The EPC-3325 comes with a two-year warranty and is currently available in limited quantities. Full production is scheduled for September 2001. Pricing, which starts at $1,800, depends on exact configuration. About RadiSys RadiSys (Nasdaq:RSYS) designs and manufactures building blocks for next-generation Internet, communications, industrial automation, medical equipment and transaction terminal applications. As the leading independent provider to OEMs, RadiSys delivers a time-to-market advantage in a tight "virtual division" relationship with its customers. The building blocks include Intel-based embedded computers, DSP modules and algorithms, network interfaces and protocols, systems platforms, embedded software, systems engineering and integration services. RadiSys' highly differentiated position in the market is a result of its intense focus on Intel-based technology, having the broadest array of building blocks, and a "perfect fit" product development strategy using its intellectual property to design customer subsystems. RadiSys is a registered trademark of RadiSys Corporation. All other products are trademarks or registered trademarks of their respective companies. The matters discussed in this press release contain forward-looking statements that are subject to the risk factors found in RadiSys' 2000 Form 10-K, and such statements should be considered in light of those factors. For more information, contact RadiSys at info@radisys.com or http://www.radisys.com or call 800/950-0044 or 503/615-1100. For press information only: Eric Stebel, Public Relations Manager, RadiSys Corp., 713/541-8200. |
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