RadiSys Announces the TDM2IX Bridge Chip to Enable Voice-Over-IP for Intel IXP1200 Network Processors.Business Editors INTEL DEVELOPER FORUM Intel Developer Forum (IDF), is a twice yearly gathering of technologists to discuss Intel products and products based around Intel products. The first IDF was in 1997. There is usually a Spring IDF and a Fall IDF. , SAN JOSE, Calif.--(BUSINESS WIRE)--Aug. 27, 2001 RadiSys Corp. (Nasdaq:RSYS) today announced the first commercially available chip that bridges the TDM (Time Division Multiplexing) A technology that transmits multiple signals simultaneously over a single transmission path. Each lower-speed signal is time sliced into one high-speed transmission. (time division multiplexing (communications) time division multiplexing - (TDM) A type of multiplexing where two or more channels of information are transmitted over the same link by allocating a different time interval ("slot" or "slice") for the transmission of each channel. I.e. ) bus to the IX bus of the Intel(R) IXP (1) (Internet EXchange Processor) See IXA. (2) (Internet eXchange Point) A public junction point on the Internet that provides an on-ramp to the Internet as well as a location for carriers to exchange traffic. 1200 Network Processor. The TDM2IX is designed for use in voice packetization applications, such as voice-over-IP (VoIP) gateways. With the new chip, RadiSys -- a leading global designer and manufacturer of building blocks enabling next-generation Internet and communications systems -- greatly expands its product line based on the IXP1200 Network Processor. Until today, bridging the TDM bus to the IX bus was difficult. There simply have not been any efficient solutions for translating serial TDM data -- from multiple sources over multiple lines -- into a parallel format for transmission over the IX bus to the IXP1200 Network Processor. But the RadiSys TDM21X converts TDM data into an "IXP-friendly" format to enable VoIP applications based on the IXP1200. "Our line of products for Intel network processors is growing based on market demand," said Arif Kareem, senior vice president and general manager for RadiSys. "Our ability to solve difficult problems, such as transmission of voice and data via a converged IP network, is proof of our commitment to this important market." The RadiSys TDM2IX is the industry's first "TDM to IX bridge" chip facilitating applications, such as high density VoIP packetizing and depacketizing that require an interface between TDM streams and an IXP1200 Network Processor. To maximize design flexibility, RadiSys designed the serial interface side of the TDM2IX based on the TDM stream I/O (Input/Output) The transfer of data between the CPU and a peripheral device. Every transfer is an output from one device and an input to another. See PC input/output. I/O - Input/Output of many conventional TSI TSI Total Solar Irradiance (sum solar light in energy per unit of time) TSI Trading Standards Institute (UK) TSI Transportation Safety Institute (US DOT) (Time Slot Interchanger) components. Product Specifications The TDM2IX is a .35 micron ASIC (Application Specific Integrated Circuit) Pronounced "a-sick." A chip that is custom designed for a specific application rather than a general-purpose chip such as a microprocessor. in an industry standard 240-pin PQFP (Plastic Quad Flat Package) Refers to many varieties of QFP chip packages, which are molded in plastic. See QFP. package. The .35 micron implementation minimizes the power requirements of the TDM2IX while enabling operation at the full speed of the IX bus of the IXP1200 Network Processor. When coupled to an industry standard TSI, the TDM2IX allows access to any or all of the 4096 DS0s of the H.110 CompactPCI bus. Because of the small footprint, the TDM2IX uses minimum board real estate and simplifies board routing. Pricing and Availability The TDM2IX is available now and is priced starting at $59 in thousand-piece quantities. About RadiSys RadiSys (Nasdaq:RSYS) designs and manufactures building blocks for next-generation Internet and communications systems. As the leading independent provider to OEMs, RadiSys delivers a time-to-market advantage in a tight "virtual division" relationship with its customers. The building blocks include embedded computers based on Intel Architecture, DSP (1) (Digital Signal Processor) A special-purpose CPU used for digital signal processing applications (see definition #2 below). It provides ultra-fast instruction sequences, such as shift and add, and multiply and add, which are commonly used in math-intensive modules and algorithms, network interfaces and protocols, systems platforms, and embedded software. RadiSys' highly differentiated position in the market is a result of its intense focus on Intel-based technology, having the broadest array of building blocks, and a "perfect fit" product development strategy using its intellectual property to design customer subsystems. RadiSys is a registered trademark of RadiSys Corporation. All other products are trademarks or registered trademarks of their respective companies. Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and in other countries. The matters discussed in this press release contain forward- looking statements that are subject to the risk factors found in RadiSys' 1999 Form 10-K Form 10-K A report required by the SEC from exchange-listed companies that provides for annual disclosure of certain financial information. Form 10-K See 10-K. , and such statements should be considered in light of those factors. For more information, contact RadiSys at info@radisys.com or http://www.radisys.com or call 800/950-0044 or 503/615-1100. For press information only: Geoff Kann, McClenahan Bruer Communications, 503/546-1000. |
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