RTC to Build Second WaferBump Oven System for 300mm Line at Leading Taiwanese Semiconductor Assembler.Business Editors FULLERTON, Calif.--(BUSINESS WIRE)--March 19, 2003 Radiant Technology Corp. (OTC OTC See: Over-the-counter. OTC See over-the-counter market (OTC). BB:RTNC RTNC Radio Télévision Nationale Congolaise (Congo) RTNC Returned to National Control ), a global supplier of precision thermal processing systems for the electronics and technology industries, announced that a major Taiwanese subcontract assembler and bump fab has ordered its second WaferBump(TM) Oven System to support growing demand for 300mm wafer bumping. The WaferBump Oven was selected over competing systems primarily because of the significantly lower bump voiding afforded by infrared (IR) conduction heating technology. "We are especially delighted with this second order as it reinforces the superior performance of our WaferBump Oven System," said Carson Richert, executive vice president of RTC See real time clock. . The new equipment, which includes full automation for wafer handling and fluxing, will complement the first 300mm WaferBump Oven system installed in July 2002. Technical Details: Extremely low voiding is possible because the WaferBump Oven has been specifically designed for reflowing solder bumps and solder spheres on flip chip and wafer level packaging (WLP WLP WebLogic Portal (Bea Systems) WLP Wafer Level Packaging WLP Women's Learning Partnership (Bethesda, MD) WLP Workplace Learning & Performance WLP World Library Partnership, Inc. ) wafers. The system features a high-density mesh belt transport system that is heated from below with IR lamps. The mesh belt conducts heat through the wafer to the under bump metallurgy (UBM UBM United Business Media Plc (London) UBM Under-Bump Metallization UBM UniCredit Banca Mobiliare S.p.A. (Italy) UBM United Bikers of Maine UBM Unbalanced Magnetron UBM Ultimate Building Machine ) underneath the solder. For better wetting, Flux activation occurs at the UBM/solder interface before the solder melts. Bottom-up heating eliminates the problem of "skinning" inherent in forced convection furnace systems, creating a reliable and low-void bump. "Conductive heating has been shown to be the preferred mechanism for reflowing solder on wafers," said Dr. Raymond Kruzek, Vice President of Business Development for RTC. "That combined with the benefits of IR heating makes the WaferBump Oven system the most versatile, flexible reflow (1) The process of heating and melting the solder that has been screen printed onto a printed circuit board in order to bond chips and other components to the board. Surface mount chips (SMT) use the reflow method. Contrast with wave soldering. See also reflowable text. tool available." The quick thermal response of IR heating enables the most precise temperature control and the fastest changeover times of any solder reflow system in the industry. In addition to IR conduction heating, the WaferBump Oven is also designed with a unique Tri-Belt(TM) transport system that features separate load, hot, and cold belts for precise control of the wafer temperature. Low velocity laminar flow of pre-heated process gases through a porous ceramic medium maintains a non-turbulent, virtually oxygen-free (less than 10 parts per million parts per million mg/kg or ml/l; see ppm. ) environment. The inherent advantages of IR conductive heating and the WaferBump Oven's process-specific design for solder reflow on flip chip and WLP wafers ensure consistent, reliable bump formation with very low voiding. About RTC For more than 30 years, RTC has pioneered the development of precision thermal processing systems for photovoltaic The generation of voltage by a material that is exposed to light in the visible and invisible ranges. See photoelectric and photovoltaic cell. products, semiconductor packaging, flat panel displays, and other demanding technology applications. RTC equipment provides precise heat that is on-demand, fast, hot and clean. RTC is an ISO (1) See ISO speed. (2) (International Organization for Standardization, Geneva, Switzerland, www.iso.ch) An organization that sets international standards, founded in 1946. The U.S. member body is ANSI. 9001:2000 registered firm with more than 3,500 precision furnaces and ovens operating in more than 40 countries around the world. To learn more about RTC's wide range of furnace systems, contact Radiant Technology Corp. at: 1335 South Acacia Avenue, Fullerton, CA 92831; phone 714/991-0200; fax 714/991-0600, web: www.radianttech.com. |
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