RF Micro Devices Announces 3x3mm CDMA PA Shipments to a Leading Manufacturer of CDMA Handsets; RFMD Anticipates Growth in CDMA in Calendar 2004.

Business Editors/High-Tech Writers

GREENSBORO, N.C.--(BUSINESS WIRE)--March 9, 2004

RF Micro Devices, Inc. (Nasdaq:RFMD), a leading provider of proprietary radio frequency integrated circuits (RFICs) for wireless communications applications, today announced that it has begun high volume production shipments of its RF3163 CDMA power amplifier (PA) module to a top-two CDMA handset original equipment manufacturer (OEM) headquartered in Korea.

The RF3163 is a high-performance GaAs HBT CDMA power amplifier module with an industry-leading 3x3x0.9mm package. The RF3163 design is based upon RFMD's patent pending Lead Frame Module(TM) (LFM(TM)) packaging technology that reduces component count, product size and total cost. RFMD expects to increase sales of its CDMA PAs in calendar 2004 to this customer and to other leading manufacturers of CDMA handsets.

Joe Grzyb, general manager of power amplifier products at RF Micro Devices, said, "We are pleased to begin production shipments of our highly integrated 3x3 millimeter CDMA power amplifier module. We have enjoyed a very strong relationship with this customer in GSM/GPRS handsets, and we are extremely pleased to announce these CDMA PA sales. We expect to grow our market share in CDMA handsets in 2004 as these shipments ramp and as we introduce new 3x3 millimeter PA modules with increased functionality."

The RF3163 PA module is designed for US Cellular CDMA IS-95, 1xRTT and 1xEV-DO operation. RFMD's LFM packaging technology eliminates surface mount devices and the associated costs of surface mount device placement by integrating the functionality of passive components into the gallium arsenide (GaAs) die manufactured by RFMD. Products designed using LFM technology do not require laminate or LTCC substrates or surface mount components, which greatly simplifies the production supply chain and decreases manufacturing lead time.

The RF3163 offers best-in-class ruggedness, thermal dissipation, moisture sensitivity level (MSL), electrostatic discharge (ESD) sensitivity and an industry-leading profile of only 0.9mm. At +28 dBm, the RF3163 provides an efficiency of 41 percent and linearity of -51 dBc for the highest possible handset talk time and minimum system distortion.

RF Micro Devices, Inc., an ISO 9001- and ISO 14001-certified manufacturer, designs, develops, manufactures and markets proprietary RFICs primarily for wireless communications products and applications such as cellular and PCS phones, base stations, WLANs and cable television modems. The Company offers a broad array of products -- including amplifiers, mixers, modulators/demodulators, and single-chip receivers, transmitters and transceivers -- representing a substantial majority of the RFICs required in wireless subscriber equipment. The Company's goal is to be the premier supplier of low-cost, high-performance integrated circuits and solutions for applications that enable wireless connectivity. RF Micro Devices, Inc., is traded on the Nasdaq National Market under the symbol RFMD. For more information about RFMD, please visit www.rfmd.com.

This press release contains forward-looking statements that relate to RF Micro Devices' plans, objectives, estimates and goals. Words such as "expects," "anticipates," "intends," "plans," "projects," "believes" and "estimates," and variations of these words and similar expressions, identify these forward-looking statements. RF Micro Devices' business is subject to numerous risks and uncertainties, including variability in quarterly operating results, the rate of growth and development of wireless markets, risks associated with the operation of wafer fabrication, molecular beam epitaxy and test, tape and reel facilities and the Company's conversion from four-inch to six-inch wafer manufacturing, its ability to manage rapid growth and to attract and retain skilled personnel, variability in production yields, its ability to control and reduce costs and improve gross margins on highly integrated products, dependence on a limited number of customers and dependence on third parties. These and other risks and uncertainties, which are described in more detail in RF Micro Devices' most recent Annual Report on Form 10-K filed with the Securities and Exchange Commission, could cause actual results and developments to be materially different from those expressed or implied by any of these forward-looking statements.

RF MICRO DEVICES(R), RFMD(R), Lead Frame Module(TM) and LFM(TM) are trademarks of RFMD, LLC. All other trade names, trademarks and registered trademarks are the property of their respective owners.