RADVISION IMS Ready Carrier Class SIP Solution Validated with High Performance AdvancedTCA* Single Board Computer from Intel.

FAIR LAWN, N.J. -- RADVISION (Nasdaq:RVSN), a leading provider of multimedia conferencing and communications platforms, announces that the RADVISION SIP Server Tool Kit has been validated on the Intel Telco Server Proof of Concept in Intel's New Jersey Modular Communication Platforms (MCP) Solution Center using RADVISION ProLab(TM) test suite. The POC utilizes the RADVISION SIP Server Tool Kit and the latest high performance Intel NetStructure(R) MPCBL0040 single board computer. The telco server platform proof of concept (POC) from Intel is helping to accelerate time to market for deployment of this new core network architecture for Telecom Equipment Manufactures and Service Providers.

"Support for high-capacity environments is crucial for service providers implementing voice and video over IP products," said Adi Paz, Director of Product Management and Marketing for RADVISION's Technology Business Unit. "The RADVISION SIP Toolkit on which the SIP Server platform is based and ProLab testing environment have been specifically designed to support carrier-class systems scaling up to terabits per second. This makes them an ideal fit for AdvancedTCA based platforms that will bring plug-and-play capabilities to business-critical carrier-grade systems."

The RADVISION SIP product portfolio provides a complete framework for developing all types of IP Multimedia Subsystem (IMS) ready SIP Server applications including proxies, redirect servers, registrars, and presence servers on multiple hardware platforms, including AdvancedTCA. It radically simplifies and accelerates development by providing a standards-compliant, robust and high performance implementation of standard SIP server functionality controlled through a multi-level, user friendly application programming interface (API). IMS is a new core infrastructure for wireless and cable networks that facilitates deployment of multimedia services.

Based on RADVISION's award-winning protocol toolkits, the RADVISION ProLab Test Management Suite is a powerful, highly scalable, feature-rich testing system that is well suited for testing carrier-class, real-time communication applications supporting large volumes of traffic. It complies with the most recent industry standards and supports advanced signaling across different network topologies. Intel used the Prolab Test Management Suite in their New Jersey MCP Solution Center to perform stress and load testing in order to verify the performance of the SIP Server in a high-capacity, high volume environment. The Prolab Test Management Suite for SIP is part of a testing tool family that includes testing support for H.323 and 3G-324M.

"By utilizing the RADVISION Prolab Test Management Suite, TEMs and Platform Integrators will be able to quickly validate and benchmark Intel NetStructure(R) AdvancedTCA blades in a carrier grade environment," said Shantanu Gupta, Director of MCP Solutions Program, Communications Infrastructure Group, Intel. "The RADVISION SIP Server platform provides our customers a stable, consistent and high performance testing environment for our validations and integration efforts."

The ATCA SIP server solution from RADVISION including the ProLab Test Management Suite will be demonstrated at the RADVISION booth at the Spring Voice on the Network (VON) conference and exhibition at San Jose, California during March 15-17, 2006. Results of the POC validation are available at www.intel.com/go/IMS.

About RADVISION

RADVISION LTD. (Nasdaq: RVSN) is the industry's leading provider of high quality, scalable and easy-to-use products and technologies for videoconferencing, video telephony, and the development of converged voice, video and data over IP and 3G networks. For more information please visit our website at www.radvision.com.

RADVISION is an Affiliate Member of the Intel(R) Communications Alliance, who are committed to developing modular, standards-based solutions based on technologies, processors, products, and services from Intel. Intel enables the modular network with standards-based, building blocks for the converged network that deliver enhanced performance, greater scalability, and maximum flexibility offering profitable new communications services and lower infrastructure costs. Visit http://www.intel.com/go/ica to learn more about these products and the Alliance.

This press release contains forward-looking statements that are subject to risks and uncertainties. Factors that could cause actual results to differ materially from these forward-looking statements include, but are not limited to, general business conditions in the industry, changes in demand for products, the timing and amount or cancellation of orders and other risks detailed from time to time in RADVISION's filings with the Securities Exchange Commission, including RADVISION's Form 20-F Annual Report. These documents contain and identify other important factors that could cause actual results to differ materially from those contained in our projections or forward-looking statements. Stockholders and other readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date on which they are made. We undertake no obligation to update publicly or revise any forward-looking statement.

Intel and Intel NetStructure(R) are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

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