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Quellan Links Up with Foxconn Technology Group Via Strategic Alliance.

Companies to Collaborate on Ultra Low Power An ultra low power, or ULP device, is an electronic gadget that has milli- or micro-watt power consumption.

Some examples of ultra-low power devices:
  • Pacemakers
  • Hearing aids
 Active Interconnects

SANTA CLARA CLARA Clairemont Amateur Radio Association , Calif., April 30 /PRNewswire/ -- Quellan Incorporated, a leader in Analog Signal Processing Analog signal processing is any signal processing conducted on analog signals by analog means. "Analog" indicates something that is mathematically represented as a set of continuous values. This differs from "digital" which uses a series of discrete quantities to represent signal.  and RF Noise Cancellation ICs, today announced it has entered into a Strategic Alliance with Foxconn Technology Group. The Alliance will deliver thinner, higher performance, environmentally friendly interconnects to the high growth cloud computing, desktop and rich media display markets by combining Foxconn's Interconnect technology and green manufacturing prowess with Quellan's Q:Active active cable semiconductor technology. The Alliance will expand Quellan's Cloud Interconnect program to provide OEMS OEMS Office of Emergency Medical Services (Massachusetts government)
OEMS Oracle Enterprise Messaging Service
OEMS Order Entry Management System
 with access to vital technologies for accelerating active interconnect development.

Foxconn is the world's leader for end-to-end environmentally friendly contract manufacturing. The Companies will collaborate on active interconnects for consumer, desktop and data center markets. Active Interconnects dramatically reduce power, weight and diameter required to interconnect high speed, rich media platforms such as Servers, Switches and Displays by performing signal processing directly inside the cable connector.

The Alliance's Q:Active technology represents the industry's smallest, lowest power and highest density Integrated Circuits for the active interconnect market. These IC's deliver 6Gbps miniSAS,10Gbps SFP SFP Small Form-factor Pluggable (optical transceiver module)
SFP Société Française de Physique (French Physics Society; Paris)
Sfp Svenska Folkpartiet (Finnish: Swedish People~s Party) 
+ and 40Gbps QSFP throughput in a single CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes.  device for Active Copper Cables, Blade Servers and Switches. Quellan's QLx111G device achieves 10Gbps transmit and receive in a tiny 3 millimeter x 3 millimeter package while the QLx411GRx and QLx411GTx transmit and receive 40Gbps in just a 7 millimeter x 4 millimeter package. Quellan's Consumer Products including the QLx1600 and QLx4270-DP deliver USB USB
 in full Universal Serial Bus

Type of serial bus that allows peripheral devices (disks, modems, printers, digitizers, data gloves, etc.) to be easily connected to a computer.
3.0 and DisplayPort active cable integration in similar ultra small packages.

These tiny devices are embedded directly in the connector and compensate for channel impairments such as skew, attenuation Loss of signal power in a transmission.

The reduction in level of a transmitted quantity as a function of a parameter, usually distance. It is applied mainly to acoustic or electromagnetic waves and is expressed as the ratio of power densities.
, group delay and crosstalk presented by the copper cable. They are entirely analog for low power and small size - yet deliver the highest industry performance. They enable a 10Gbps interconnect to run on copper twinax just 2mm in diameter - 30% thinner than fiber optics and 90% thinner than Category 6a structured cabling - or increase distance on traditional copper by as much as 400% - allowing data centers to interconnect without the hefty power consumption of fiber optic lasers and receivers.

"Clearly this is a breakthrough for Data Center interconnects at a time that's right," said Ken Fleck of Fleck Research and veteran of the interconnect industry. "The approach the Alliance is taking and the technology and benefits are impressive."

According to Dataquest, there are now 7,000 major data centers up and running and many more being built out. Quellan chips are currently embedded in switches and supercomputers in these data centers that consume up to 30,000 ports of Q:Active technology per individual switch.

"Our partner's Q:Active technology provides a seamless method for increasing reach and interconnect density without the price of power consumption," said Caesar Chen, Foxconn SVP. "Our customers are now sampling our active cables and we plan to continue to innovate with this green technology going forward."

"As a world leader in interconnects and end-to-end services alike, Foxconn is an excellent choice as a partner to deliver extremely cost effective, high performance active copper interconnects," said Tony Stelliga, CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board.  of Quellan. "By combining our silicon expertise with their scale, innovation, devotion to environmental causes and engineering professionalism, unsurpassed price/performance green solutions can be achieved in the interconnect industry."

About Quellan

QUELLAN, INC., headquartered in Santa Clara, California, designs and markets analog integrated circuits that dramatically enhance the performance of system interconnects and radio frequency receivers. Quellan chips are embedded in connectors, receiver modules and handheld mobile devices to improve speed, density and reception quality. The company's patented Collaborative Signal Processing products perform adaptive noise cancellation and equalization with an entirely analog signal path for ultra low power. Quellan serves a broad range of applications in the computing, storage, consumer and wireless markets.

About Foxconn Technology Group

Foxconn is the partner of choice for all aspects of contract manufacturing services in 3C industries. Armed with its proprietary eCMMS business model and world leading IP portfolio, Foxconn has revolutionized the CEM/EMS/ODM industries since the turn of the century. Through its renowned offering of best speed, quality, engineering services, efficiency and value-added, Foxconn determines to make the comfort from environmental-friendly electronic products usage an attainable luxury for all mankind.

CONTACT: Melissa Kallos of Quellan, Inc., +1-408-774-0084,

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Publication:PR Newswire
Date:Apr 30, 2009
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