QUALCOMM Selects Jacket Micro Devices' RF Modules for Chipset Reference Design.

JMD's technology enables QUALCOMM's next generation draft 2.0 802.11n chipset

ATLANTA -- Jacket Micro Devices (JMD), suppliers of the smallest, highest performing RF modules available, today announced that QUALCOMM Incorporated, a leading developer and innovator of advanced wireless technologies and mobile data solutions, has selected Jacket Micro Devices' M20006 and M20007 RF modules for the draft 2.0 compliant 802.11n AGN400[TM] chipset reference design. The combination of QUALCOMM's advanced chipset and JMD's FEM technology enable QUALCOMM to implement a 2x3 dual band MIMO architecture with the RF portion occupying only 98 mm2 of board space.

JMD's level of integration within the module reduces the bill of materials (BOM) for QUALCOMM and allows for reliable manufacturing and small form factor reference designs. The performance of the JMD RF Modules, when coupled with QUALCOMM's AGN400 chipset, achieves throughput speeds of 315 Mbps.

The AGN400 is the world's first chipset offering full support for Draft 2.0 of the IEEE 802.11n standard. The AGN400 chipset is the fourth generation 802.11n-compliant chipset from QUALCOMM and features QUALCOMM's True MIMO Gen-N technology. True MIMO Gen-N capitalizes on QUALCOMM's patented innovations in multiple antenna technology to extend the effective range and bolster data throughput for consumer Wi-Fi and next-generation wireless digital home entertainment devices.

"We believe JMD's unique Multi-layer Organic (MLO) technology is the only choice for multi-band, high performance and space constrained RF circuits like the QUALCOMM AGN400," said Jim Stratigos, president and CEO of Jacket Micro Devices. "The complexity of OFDM and MIMO architectures requires a high degree of integration to provide functionality in the smallest space possible. JMD has the only technology which enables multiple radio designs for space-constrained devices."

The AGN400 chipset, reference designs and software are currently sampling with lead customers and are being publicly demonstrated at the 2007 International Consumer Electronics Show being held in Las Vegas, Nevada from January 8 - 11. Products containing True MIMO Gen-N technology are expected to be commercially available in the first quarter of 2007.

About JMD RF M20006 and M20007 RF Modules

The M20006 and M20007 comprise a complete dual band 2x3 RF front end module (FEM) for 802.11a/b/g/n applications. The 1x1 MIMO building block M20006 can stand alone or be used in combination with the M20007 1x2 MIMO FEM to implement all popular MIMO structures including 2x2, 2x3, and 3x3. The 7x7x1.4 mm LGA package contains dual band transmit and receive chains ideal for small form factors such as notebook PCI Express mini cards, USB dongles, and embedded WLAN interfaces. The single package includes all RF filters, baluns, PAs, LNAs, and switches to reduce size and minimize assembly costs of the deployment of new WLAN standards.

About Jacket Micro Devices (JMD)

JMD, a supplier of integrated RF modules for high performance wireless products, was founded in 2002 by researchers from Georgia Tech who developed a groundbreaking new method to package RF components. Unlike modules made with ceramic and other technologies, JMD's products can be rapidly customized and have higher levels of integration, resulting in fewer external components and faster time to market. JMD's patented Multi-Layer organic (MLO) technology defines a revolutionary, system-on-package (SOP) approach to RF modules for wireless products and is ideal for wireless systems engineers who need to design compact wireless products. For more information, visit www.jacketmicro.com.