Professional Development Certificate Program.PCB PCB: see polychlorinated biphenyl. PCB in full polychlorinated biphenyl Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound. Design Conference West 2005 is pleased to offer 10 courses in this year's Professional Development Certificate Program--four two-day Design Excellence Curriculum (DEC1-DEC4) courses and six Tutorials (T1-T6). These technical courses of study are taught by industry experts who will provide you with the technology, theory, application and best-practice information that you need to achieve meaningful progressional growth and development. Following the show, you'll receive a certificate of completion for each Professional Development course that you complete, but the real benefit is the knowledge you'll gain and be able to apply to your career--long after this year's conference has ended. Professional Development courses are not included on the Proceedings CD-ROM CD-ROM: see compact disc. CD-ROM in full compact disc read-only memory Type of computer storage medium that is read optically (e.g., by a laser). . NEW! Monday, March 7, 9 am-5:30 pm, and Tuesday, March 8, 9 am-5 pm DEC 1--High-Speed Design--Signal Integrity, EMI (ElectroMagnetic Interference) An electrical disturbance in a system due to natural phenomena, low-frequency waves from electromechanical devices or high-frequency waves (RFI) from chips and other electronic devices. Allowable limits are governed by the FCC. and Crosstalk Speaker: Hartley, L-3 Communication, Avionics Systems Attendees: PCB designers, engineers and managers interested in learning and applying high-speed concepts to electronic products. This two-day course is a compete introduction to the high-speed design concepts needed for designs utilizing ultra-fast ICs. The course will cover circuit parasitics, high-frequency currents, signal and wave propagation Wave propagation is any of the ways in which waves travel through a medium (waveguide). With respect to the direction of the oscillation relative to the propagation direction, we can distinguish between longitudinal wave and transverse waves. , propagation time and velocity, PCB properties, transmission line impedance, impedance models, trace routing and termination, and the effects of vias and trace corners. Highlights will include high-speed PCB materials, connectors in high-speed circuits, differential pairs, control of signal crosstalk, control of EMI, split planes and plane islands, PCB layer stackups, filters and filtering techniques, system RF shielding A material that prohibits electromagnetic radiation from penetrating it. Computers and electronic devices used in the home must meet U.S. government standards for electromagnetic interference. and grounding, slots in enclosures, and conducted EMI filters. Attendees will learn about interfacing with the fabricator fab·ri·cate tr.v. fab·ri·cat·ed, fab·ri·cat·ing, fab·ri·cates 1. To make; create. 2. To construct by combining or assembling diverse, typically standardized parts: , PCB fabrication fabrication (fab´rikā´sh  n),n the construction or making of a restoration. drawings, impedance testing, test coupons and cost differential of controlled impedance PCBs. NEW! Monday, March 7, 9 am-5:30 pm, and Tuesday, March 8, 9 am-5 pm DEC 2--Laminates and Stackups: Keys to Optimum Performance Speaker: Mary Sugden, Printed Circuit Training Inc. Attendees: PCB designers and others with a basic knowledge of PCB design. There are occasions when the design of a multilayer board can prove disappointing. This two-day course will help you prevent those disappointments through better multilayer design practices. On Monday we will focus on the properties and characteristics of the laminates, prepregs and copper foils in common use, plus their influence on board manufacturing processes. Attendees will learn to evaluate and compare the laminate's important properties, such as dimensional stability dimensional stability, n See stability, dimensional. , dielectric constant dielectric constant n. See permittivity. , loss tangent tangent, in mathematics. 1 In geometry, the tangent to a circle or sphere is a straight line that intersects the circle or sphere in one and only one point. , chemical resistance, maximum operating temperature, flammability, Tg and CTE (Coefficient of Thermal Expansion) The difference between the way two materials expand when heat is applied. This is very critical when chips are mounted to printed circuit boards, because the silicon chip expands at a different rate than the plastic board. . Attendees also will learn how to select and specify laminates, prepregs and copper foils using IPC-4121 Guidelines for Selecting Core Constructions for multilayer boards. On Tuesday, attendees will learn how multilayer boards are manufactured. Attendees will perform exercises in evaluating different construction options for 4-, 6-, 8-, 10- and 12-layer boards. The evaluation criteria include considerations for ease of manufacturing, low noise emission, impedance control, ease of routing and ease of assembly. The course will conclude with discussions on how to standardize and document your proven multilayer stackups. NEW! Monday, March 7, 9 am-5:30 pm, and Tuesday, March 8, 9 am-5 pm DEC 3-HDI/Microvias and Embedded Passives Design Challenges Speakers: Happy Holden, Westwood Associates; and Mike Fitts, Mentor Graphics Mentor Graphics, Inc (NASDAQ: MENT) is a US-based multinational corporation dealing in electronic design automation (EDA) for electrical engineering and electronics, as of 2004, ranked third in the EDA industry it helped create. Corp. Attendees: PCB design engineers, designers, managers and others interested in utilizing HDI HDI Human Development Index (UNDP yardstick of human welfare) HDI Help Desk Institute HDI Humpty Dumpty Institute (New York, New York) HDI High Density Interconnect , embedded passives and other advanced technologies. Day 1: Current Advanced Design Technologies--Overcoming the Obstacles by speaker Happy Holden. On Monday we will cover all of the current advanced design technologies, including HDI, microvias, embedded passives, fine-pitch BGAs and routing, channel routing, very large BGAs (<600 pins), signal integrity, distributed capacitance and new design tools. We'll examine design techniques for the interconnection of area array components, from ASIC (Application Specific Integrated Circuit) Pronounced "a-sick." A chip that is custom designed for a specific application rather than a general-purpose chip such as a microprocessor. packaging to dense multichip modules and more. PCB design rules, materials and selection of PCB structures (blind, buried and microvias) will be examined and compared. We will define HDI technologies, circuit routing guidelines and materials required for fine-pitch and BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. components. Channel routing techniques using blind vias will show how layers can be reduced by as much as 3X. The afternoon will be devoted to embedded passive technologies, including planar capacitance, buried resistors and capacitors, materials and more. Day 2: EP Technology: Show me the Flow--and the Value! by speaker Mike Fitts. You believe that there might be some potential use of EP at your company. Now what? Day two of DEC3 will have you working through the actual design flow for various EP technologies, in real timer You'll increase your understanding of the value of EP by working on a real project. This hands-on workshop will help attendees understand the design flow and implementation of various EP technologies, including integral resistors and capacitors. Topics that will be covered include material and technology selection, the schematic-to-layout process, component (discrete vs. embedded) tradeoff, and the affects of EP on factors such as area, stack-up, SI and more. CAD toolset experience is highly recommended. Please have a basic understanding of EP technology before attending this class. NEW! Monday, March 7, 9 am-5:30 pm, and Tuesday, March 8, 9 am-5 pm DEC 4--EMI and EMC (1) (EMC Corporation, Hopkinton, MA, www.emc.com) The leading supplier of storage products for midrange computers and mainframes. Founded in 1979 by Richard J. Egan and Roger Marino, EMC has developed advanced storage and retrieval technologies for the world's largest companies. for the Design Engineer Speaker: Robert Hanson Robert Hanson or ... Hansen or ... Hanssen may be:
Attendees: PCB design engineers and engineering managers with an interest in EMI and EMC. If you're a PCB design engineer, it pays to know how and why EMI testing is conducted--as well as the typical causes of failure--even if an outside company performs your actual testing. This two-day course provides all of the EMI information you'll need--including design considerations at CAE (1) (Computer-Aided Engineering) Software that analyzes designs which have been created in the computer or that have been created elsewhere and entered into the computer. and CAD levels--for you to provide a compliant radiation/susceptibility product. You'll examine and identify ways to prevent common EMI/EMC EMI/EMC Electromagnetic Interference/Electromagnetic Compatibility problems regarding power supplies, cables, connectors, slots, discontinuity of ground planes and more. We will focus on EMI and RFI (Radio Frequency Interference) High-frequency electromagnetic waves that emanate from electronic devices such as chips. RFI - Radio Frequency Interference issues regarding PCBs, computers, analog designs and systems, along with relevant EMI regulations in the U.S., the European Union European Union (EU), name given since the ratification (Nov., 1993) of the Treaty of European Union, or Maastricht Treaty, to the European Community and Asia. Highlights will include PCB radiation basics, radiation and bypass on PCBs, PCB radiation suppression techniques, grounding designs/filtering, crosstalk/termination, power and ground planes, antenna loops, spread spectrum clocking, and differential-mode and common-mode radiation. NEW! Monday, March 7 * 9 am-5:30 pm T1--Electronics Principles and Signal Integrity Speaker: Doug Brooks, UltraCAD Attendees: PCB designers and anyone interested in learning more about signal integrity. Do inductors and capacitors confuse you? Are you unsure what lead inductance inductance, quantity that measures the electromagnetic induction of an electric circuit component; it is a property of the component itself rather than of the circuit as a whole. means and why we worry about bypass capacitors? Do you gasp for breath when someone says that crosstalk is related to the same loop area that causes EMI problems? Then this course is for you! We'll start with an overview of resistors, capacitors, inductors and diodes, and how and why they do what they do. Next we'll look at what happens to resistance and impedance when we combine these components together in various ways in our circuits. Then we'll look at how these principles apply to the primary signal integrity issues board designers face today --EMI, crosstalk, signal reflections and transmission lines, and power supply conditioning to prevent ground bounce In electronic engineering, ground bounce is a phenomenon associated with transistor switching where the gate voltage can appear to be less than the local ground potential, causing the unstable operation of a logic gate. . At the conclusion of the course attendees will understand the basic causes of these signal integrity problems, and many of their solutions will become apparent. NEW! Monday, March 7 * 9 am-5:30 pm T2--Best Practices in Implementing Lead-Free Assembly Speaker: Dave Sbiroli, Indium Corp. Attendees: Anyone interested in learning how to implement a lead-free assembly process. This may be the only workshop that focuses on the "how to" of implementing lead-free at your factory. It covers all of the relevant issues: PCB finishes, components, alloys and SMT (1) (Surface Mount Technology) See surface mount. (2) (Station ManagemenT) An FDDI network management protocol that provides direct management. Only one node requires the software. SMT - Station Management processes. It also reviews actual implementations of lead-free assembly processes at Motorola and Hewlett-Packard. The morning course includes a review of current legislation and practices in lead-free electronics assembly. We'll review the current alloys in use and why and how they were selected, as well as PCB finishes for lead-free assembly and component concerns in lead-free assembly. Then we'll focus on best practices in SMT processes for lead-free assembly, printing, placement, reflow (1) The process of heating and melting the solder that has been screen printed onto a printed circuit board in order to bond chips and other components to the board. Surface mount chips (SMT) use the reflow method. Contrast with wave soldering. See also reflowable text. and wave soldering Applying liquid solder to the underside of printed circuit boards in order to bond the chips and discrete components that are placed on top of the board and whose metal leads (pins) extend through the board. . Case studies will be reviewed, including a Motorola study on implementing a lead-free process to assemble 9 million cell phones, and a Hewlett-Packard study on large board implementation. The tutorial will finish with a section on establishing your lead-free implementation plan. Friday, March 11 * 9 am-5 pm T3--Signal Integrity Issues in PCB Design Speaker: Doug Brooks, UltraCAD Attendees: PCB designers and design managers. Designers now recognize that faster component rise times mean that the circuit board itself has become an active circuit component. However, many designers do not appreciate how significant certain layout decisions can be in the ultimate performance and EMI certification of designs. Board design can often make or break a product. This tutorial will look at a variety of layout practices that can lead to noise and radiation, explain why those practices cause problems, and show how to control or eliminate noise and EMI. Emphasis will be placed on transmission lines, loop areas, bypass capacitors and crosstalk. Results from commercially available signal analysis tools will be used as an aid to understanding transmission lines and crosstalk. Fundamental issues covered in the session are: what is noise vs. EMI, what causes noise and EMI, why noise and EMI can be harmful, signal reflections and their control with transmission lines, crosstalk and its relationship to EMI, power system noise and the role of bypass caps. Attendees of this session should have a basic familiarity with PCB design and should understand the basic characteristics of capacitance and inductance. NEW! Friday, March 11 * 9 am-5 pm T4--Basic Basics: Enhancing Your CAD Tool With Visual Basic Speaker: Bruce Fihe, consultant Attendees: PCB designers, engineers, technicians and others. Enhance your standing as a power user by tapping into one of the most powerful features of your design tools. No EDA (1) (Electronic Design Automation) Using the computer to design, lay out, verify and simulate the performance of electronic circuits on a chip or printed circuit board. vendor is able to provide all of the solutions requested by every one of their users. Fortunately, they have supplied a means for us to provide our own solutions: writing and adding Visual Basic scripts (language) Visual BASIC Script - (VBScript) Microsoft's scripting language which is an extension of their Visual Basic language. VBScript can be used with Microsoft Office applications and others. It can also be embedded in web pages but can only be understood by Internet Explorer. . (You may even be surprised at how easy and fun it can be to create your own scripts!) This course will cover the fundamentals of Visual Basic programming and demonstrate the construction of a reasonably complex program in a series of easy-to-understand steps. Attendees will be able to take these concepts back to their jobs and create software solutions for some of their design tasks. Attendees are introduced to the fundamentals of programming and how to extract data from a PCB design database to use in their programs. Participants will receive a Web link to download all program source code covered during this course. This course is intended for PCB designers with little or no programming experience. NEW! Friday, March 11 * 9 am-5 pm T5--Everything You Need to Know About Bypassing, Including BGAs Speaker: Robert Hanson, Americom Seminars Attendees: PCB designers, design engineers, EMC specialists, system architects, IC package designers and others. In today's high-frequency designs, clock speeds of 1 GHz and edge rates less than 1 nsec are common. These high frequencies and their harmonics must be bypassed properly between power and ground to insure power delivery, switching fidelity and control of radiated emissions. To ensure that the power delivery system meets its objectives, the intelligent placement, value, size and type of capacitors must be achieved. Also, at higher freqencies the die and interplane capacitance must be optimized. Proper via placement for return current pathway minimization, laying out digital/analog interfaces, pours (Cu fills) and splits must be carefully analyzed. This full-day tutorial will illustrate a layout process that achieves .1 ohm ohm (ōm) [for G. S. Ohm], unit of electrical resistance, defined as the resistance in a circuit in which a potential difference of one volt creates a current of one ampere; hence, 1 ohm equals 1 volt/ampere. up to the knee frequency and provides methods to minimize serial/parallel resonance and achieve constant ESR ESR - Eric S. Raymond . NEW! Friday, March 11 * 9 am-5 pm T6--RF and Microwave PCB Design and Base Materials Speaker: Rick Hartley, L-3 Communication, Avionics Systems Attendees: PCB designers, engineers and managers interested in learning how to apply PCB layout techniques for RF circuits. Ultra-high signal integrity and noise control are the keys to full when designing very high frequency analog applications. One area of paramount importance is the design and structure of the PCB. This tutorial will help you understand the "whats" and "whys" of PCB layout and the effect of PCB materials in high-frequency analog circuits. The course also will cover impedance matching Impedance matching The use of electric circuits and devices to establish the condition in which the impedance of a load is equal to the internal impedance of the source. and balance, signal wavelength, propagation delay The time it takes to transmit a signal from one place to another. Propagation delay is dependent solely on distance and two thirds the speed of light. Signals going through a wire or fiber generally travel at two thirds the speed of light. Contrast with nodal processing delay. , critical trace length, noise, reflections, skin effect, loss tangent, waveguides and other RF transmission lines, and microstrip vs. stripline vs. co-planar waveguides. Attendees will focus on RF equations and methods to resolve impedance, wavelength couplers and filters designed into the board copper, layout techniques and strategies, optimum component placement, critical routing and circuit isolation, proper grounding, mismatched loads, signal splitters, tuning transmission lines, power bus and decoupling Decoupling The occurrence of returns on asset classes diverging from their normal pattern of correlation. Notes: Take for example stock and corporate bond returns, which normally rise and fall together. for RF circuits. Other highlights include PCB stackups for RF circuits, shields and shielding, RF PCB base material properties, choosing RF base materials, RF PCB fabrication, and RF PCB assembly. |
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