Browse Computer industry topic

Production processes subtopic

Articles 1-50 out of 50 article(s) Title Author Type Date Words United Kingdom : Invensys Operations Management Supports Suppliers Unified for Field Device Integration. Dec 17, 2009 446 United States : GDA Technologies Adds PowerPC(R) 440T90 Hard Macro to Its Portfolio Using TSMC 90nm Process Technology. Dec 14, 2009 252 China :Honeywell's UOP Announces Start-up of Para-xylene Production Unit at Sinopec Facility in Shanghai. Oct 9, 2009 393 Japan : Renesas, Panasonic to devise 28-nm process. Oct 3, 2009 387 United States : Honeywell s UOP Renewable Jet Fuel Technology to Be Used For US. Oct 3, 2009 464 United States : AMCC, TSMC put new MPU spin on IBM technology. Sep 26, 2009 386 United States: IBM scientists create DNA computer chip. Aug 19, 2009 369 Saudi Arabia's Al Jazeera Paints Leverages NEC Computers' Fault Tolerant (FT) Servers to Improve Production Processes. Aug 5, 2009 827 United States: IBM Alliance Looks To Top Intel With 28-Nm Chips. Apr 18, 2009 390 CEA/Leti and IBM to Collaborate on Future Nanoelectronics Technology. Apr 9, 2009 773 United States: Major biotech manufacturer expands R&D facilities. Apr 1, 2009 394 IBM, Applied Materials and UAlbany NanoCollege to Develop Process Modeling Technology for Manufacturing 22nm Chips. Feb 26, 2009 959 ARM Extends Performance, Size and Power Efficiency Leadership with the First Cortex Processor on 32nm Process. Feb 16, 2009 640 United states : Intel to invest $7bln to build US plants. Feb 11, 2009 314 United States: Honeywell s Advanced Energy Solutions Designed for Industrial Power Generating Facilities - Process Automation & Safety. Dec 19, 2008 175 United States: IBM and Dassault SystAmes chosen by EADS for collaborative 3D design and manufacturing. Nov 29, 2008 136 United States : EADS Chooses IBM and Dassault Systemes for Collaborative 3D Design and Manufacturing to Help Reshape the Future of Aerospace and Defense Products and Services. Nov 27, 2008 137 EADS Chooses IBM and Dassault Systemes for Collaborative 3D Design and Manufacturing to Help Reshape the Future of Aerospace and Defense Products and Services. Company overview Nov 26, 2008 920 Luxtera Announces Multi-Million Dollar Project with Sun Microsystems and DARPA. Oct 21, 2008 570 United States: austriamicrosystems Foundry Unit Announces Availability of 0.18um High-Voltage CMOS Process for Lead Customers. Oct 4, 2008 163 austriamicrosystems' Foundry Unit Announces Availability of 0.18um High-Voltage CMOS Process for Lead Customers. Oct 2, 2008 557 United States: New nanotechnology to speed up computers. Sep 30, 2008 199 United Kingdom: IBM unveils technology for 22nm chips. Sep 20, 2008 180 United States: IBM and Mentor Graphics to Develop 22nm Computational Lithography Solution for the Integrated Circuit Industry. Sep 18, 2008 321 IBM and Mentor Graphics to Develop 22nm Computational Lithography Solution for the Integrated Circuit Industry. Company overview Sep 17, 2008 672 United States: NEC and IBM form SoC alliance. Sep 15, 2008 280 United Kingdom: NEC joins IBMs Super Friends chip alliance. Sep 12, 2008 330 United States: NEC joins IBM on 32-nanometer chip research. Sep 12, 2008 402 Honeywell helps KJO improve process automation. Aug 24, 2008 989 United States: HP Certified to manage customers' IT Asset Disposition. Jul 24, 2008 198 United States: HP Certified to Manage Customers' IT Asset Disposition. Jul 22, 2008 206 United States: HP certified to manage customers' IT asset disposition. Jul 21, 2008 178 Audi Works with ESI Group and HP to Advance Auto Safety Standards with Auto Industry's Fastest Supercomputer. Apr 21, 2008 688 AMD Demos 45nm Native Quad-Core Processors for Server, Desktop. Mar 4, 2008 228 MOSIS Adds 0.25 Micron SiGe BiCMOS Technology Multi-Project Wafer (MPW) Fabrication. Jun 29, 2007 358 Agustawestland Re-Engineers Design to Manufacturing Processes in 3D with IBM and Dassault Systemes. Jun 20, 2007 482 Intel cuts 100 jobs at Hudson plant; Non-manufacturing staff targeted. Jun 6, 2007 425 New MOSIS Shared Wafer Service on IBM's 130nm 8WL Process Makes High-Performance RF Chip Fabrication Affordable. Mar 2, 2007 340 AMD Promotes Raj N. Master to Corporate Fellow. Company overview Feb 14, 2007 624 Chipidea Offers the Industry's Most Advanced Portfolio of AFE and Data Converter IP in IBM, Chartered and Samsung Processes. Nov 29, 2006 490 ULCOAT Chosen as Potential Mold Supplier for SUSS C4NP Equipment. Sep 11, 2006 473 IBM, Chartered, Infineon and Samsung Announce Process and Design Readiness for Silicon Circuits on 45nm Low-Power Technology. Aug 29, 2006 1149 Mentor Graphics and ARM Validate Physical IP for Robustness to Lithographic Variation Using Calibre LFD. Jul 26, 2006 488 UMC Delivers One Millionth 90nm RV516 Chip to ATI; Chip Brings High Performance Graphics Capabilities to Desktop Computers. Jul 17, 2006 345 Cinea Unveils Portable Video Key for Playback of Encrypted Content on Laptops and Desktop PCs. Jul 17, 2006 823 Intergraph Selected by the Spanish Army for Digital Map Production. Jun 15, 2006 422 Built for speed. Brown, Greg Aug 1, 2004 380 Package routing considerations: left uncompensated for, IC packages can skew the routing process. How to keep your timing tight. Voss, Bernard Nov 1, 2003 1140 Manufacturing considerations of embedded passives; designing and building PCBs with EPs means knowing the tolerances of the different material sets. Snogren, Richard Nov 1, 2003 1054 Fabrication guidelines for backdrilling: for higher designs and thick boards backdrilling--the removal of plating from the unused portion of the via--reduces via capacitance and mitigates resonance. Cohen, Tom Nov 1, 2003 1462