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Articles 1-18 out of 18 article(s) Title Author Type Date Words Japan: Applied Materials Showcases Advanced Copper Technology for FPD Manufacturing. Oct 29, 2009 300 United States: Applied Materials Delivers Advanced Copper Technology for FPD Manufacturing on AKT-PiVot PVD System. Oct 28, 2009 429 Applied Materials Delivers Advanced Copper Technology for FPD Manufacturing on AKT-PiVot PVD System. Oct 28, 2009 466 ASML Introduces Holistic Lithography Solutions to Continue Moore's Law. Jul 14, 2009 421 IBM, Applied Materials and UAlbany NanoCollege to Develop Process Modeling Technology for Manufacturing 22nm Chips. Feb 26, 2009 959 Research and Markets: Semiconductor Fabtech. Feb 20, 2009 265 United States: STS and SPP Announce the Formation of SPP Global Business Services. Sep 10, 2008 348 Applied Materials Delivers Critical Copper Barrier Technology for Memory Chips with Extensa PVD System. Jul 15, 2008 440 Rubber-to-metal bonded parts development. Jun 22, 2008 282 Avery licenses RFID technology to Muhlbauer. Jan 1, 2008 177 Applied Materials Opens Advanced Wafer Reclaim Center in Taiwan to Extend Wafer Lifecycle and Conserve Silicon. Company overview Jun 27, 2007 355 Applied Materials Receives Environmental Leadership Award for Energy Efficient Product Design. Jun 8, 2007 388 ASML to Deliver Advanced Resolution Techniques to SEMATECH for Manufacturing Research. Sep 19, 2006 323 Collaboration on SoC Process Development Expanded to 45 nm; Starting Full Integration Incorporating Latest ArF Immersion Technology. Aug 3, 2006 634 Aviza Technology Ships Celsior(TM) ALD Tool to Leading European DRAM Manufacturer; Next-Generation Single Wafer ALD System Seeing Continued Global Adoption. Jun 19, 2006 668 Aviza Technology Ships Next-Generation Single Wafer ALD System to Inotera Memories of Taiwan; Foundry Aims to Use Tool for 90-nm DRAM Production. May 25, 2006 864 Novel wafer cleaning technologies to support advances in the semiconductor industry. Feb 21, 2005 419 STMicro gets decent results on applied materials' copper CMP system. Dec 29, 2003 510