Browse Semiconductor industry topic

Production management subtopic

Articles 1-100 out of 100 article(s) Title Author Type Date Words Rubicon Technology, Inc. Provides Additional Details on Production Capacity Expansion Plans. Dec 21, 2009 926 Renesas Technology to Start Mass Production of 12-Product Lineup of Energy-Efficient Low-Loss Power MOSFETs That Cover Wide Voltage Tolerance Ranges (40 V, 60 V, 80 V, 100 V) for Isolated DC-DC Converters. Dec 17, 2009 607 TSMC closes 32nm project to focus on 28nm bid. Brief article Nov 26, 2009 179 TSMC gains ground in 40-nm process market. Brief article Nov 4, 2009 159 India : Syria, Indian firm sign deal to expand Tishrin power plant. Nov 2, 2009 157 300 Million Euro Contract to Expand Tishreen Power Plant. Oct 30, 2009 162 NexPower actively expands output of thin-film solar cells. Brief article Oct 7, 2009 312 Nanya, Inotera start volume production at 50nm process. Oct 2, 2009 301 Terepac begins pilot production of printed silicon ICs. Drysdale, Chelsey Oct 1, 2009 91 UMC moves to ramp up 300mm Fab capacity. Sep 23, 2009 353 Taiwanese LED chipmakers to up output amid strong LCD TV sales. Brief article Sep 22, 2009 290 PC suppliers plagued by Intel's reduced supply of atom processors. Sep 15, 2009 305 China Mobile, Mediatek to jointly produce TD-SCAMA chips. Brief article Sep 1, 2009 274 Taiwanese DRAM chipmakers vying to boost DDR3 output. Brief article Aug 27, 2009 301 Japanese Electronics Manufacturers Boost Production for Government's 'Eco-point' Shopping Incentive Program. Aug 20, 2009 172 Taiwan : Nanya Tech sees new DRAM chips to boost Q3 output. Aug 7, 2009 422 United States: Intel Halts Shipments of New Solid-State Drives. Aug 5, 2009 352 United States: Chartered Semiconductor Starts Production of Enhanced 65nm Low-Power Process. Jul 18, 2009 391 AMD, VIA benefit from Intel's restriction on netbook specification. Brief article Jul 14, 2009 283 United States: Mercury Computer Systems Announces $2.7 Million Production Order from General Atomics Aeronautical Systems for Predator UAS Upgrade. Jul 14, 2009 321 Nanya, Inotera profit from robust demand for DDR3 chips. Brief article Jul 2, 2009 240 Energy Conversion CEO 'guarded' about gloomy 2009. Brief article Jun 2, 2009 261 Dongbu HiTek Starts Volume Production of 128Mb NOR Flash Memory Devices at 90-nanometer CMOS Processing Node. May 13, 2009 473 Samsung Ramping Up DDR3 Production to Accommodate New Intel Server Platforms. Apr 21, 2009 535 Romania: AMD to Start Production of 32nm CPUs Next Year. Mar 6, 2009 148 United States: Intels upgrade plans include $2.5 billion in NM. Feb 11, 2009 315 Diodes Incorporated Announces New Omnipolar Hall Switches That Reduce Power Consumption and Simplify Production. Feb 6, 2009 546 Switzerland : ABB to expand semiconductor manufacturing capacity in Switzerland. Dec 22, 2008 288 Switzerland : ABB to expand semiconductor manufacturing capacity in Switzerland. Dec 20, 2008 286 China : SMIC starts production of 45-nm silicon. Dec 10, 2008 252 United States: Micron, Intel begin mass production of 34nm NAND. Nov 28, 2008 209 Samsung begins production of 256GB Solid State Drive. Nov 21, 2008 175 United States: AMD specifies Dresden expansion plans. Nov 6, 2008 142 Unisem Begins Volume Production of Packages Using Proprietary Copper Wirebonding Process. Oct 13, 2008 352 Fujitsu Develops World's First Gallium-Nitride HEMT Able to Cut Power in Standby Mode and Achieve High Output. Oct 10, 2008 1180 Japan: Fujitsu Develops World's First Gallium-Nitride HEMT Able to Cut Power in Standby Mode and Achieve High Output. Oct 10, 2008 176 ROHM Electronics Announces Complete Line of PWM Output H-Bridge Driver ICs for DC Brush Motors Offering Selection of Motor Speed Control Options. Sep 19, 2008 495 United States: CPUs Intel-compatible processors upgraded to operate up to 66 MHz. Sep 4, 2008 142 Qimonda Started Volume Production of Rambus XDR(TM) DRAM for PLAYSTATION(R)3 Computer Entertainment System. Aug 26, 2008 849 Fears over factory expansion plans. Aug 25, 2008 281 Nigeria: Greenview Development invests USD 198.69 million on factory expansion. Jul 30, 2008 167 Rohm and Haas Increases Investment in Taiwan with Expansion of Asia-Pacific Manufacturing Facility. Jul 29, 2008 692 Taiwan: TSMC 12-inch expansion on track; 40nm introduction to lead peers. Jul 28, 2008 133 India: BHEL receives contract for 400MW Tishreen TPP expansion project. Jul 3, 2008 142 United States: China earthquake halts some high-tech production. May 15, 2008 219 India: Intel-Micron JV delays Singapore chip output. May 6, 2008 387 Renesas Technology to Expand Back-end Process Plant in Beijing by Adding New Building on Site. Mar 25, 2008 449 United States: $52M wastewater plant expansion OK d. Mar 21, 2008 178 Transmeta Corporation Confirms First LongRun2 Licensee Has Achieved Volume Production. Feb 6, 2008 479 Tegal Ships 981ACS Plasma Etch System to Top-Ten European Semiconductor Manufacturer for Automotive MEMS Device Production. Jan 24, 2008 641 Renesas Technology to Bolster Analog and Discrete Semiconductor Business by Expanding Back-End Process Plant and Establishing New Design Company in Malaysia. Jan 11, 2008 584 Qimonda Focusing Production on 300mm Capacity to Improve Competitiveness. Nov 30, 2007 541 Tower Semiconductor Starts Volume Production for International Rectifier. Nov 28, 2007 399 Tower Semiconductor Begins Volume Production of ViTi's CMOS Image Sensors for Home Security and Surveillance Systems. Oct 17, 2007 657 Nanometrics Reduces Fixed Costs by Closing Non-Critical Manufacturing Facilities. Aug 16, 2007 422 ON Semiconductor Expands Manufacturing Facility in the Philippines. Jul 9, 2007 365 Rohm and Haas Expands the IC1000(TM) Pad Line -- Offering a Range of Advanced Technology Features for Volume Production. Jun 27, 2007 554 RF Monolithics, Inc. Announces Production Shipments to Industrial Technology Leader Cooper Bussmann. May 23, 2007 1074 Samsung announces mass production of 16GB NAND flash. Apr 30, 2007 220 Tower Semiconductor Begins High Volume Production of Zoran ICs on 0.16 Micron Manufacturing Process. Mar 15, 2007 373 Dongbu Electronics Commences Volume Production of Wafers That Implement LCD Driver IC (LDI) Chips for Large LCD Panels. Jan 15, 2007 484 Aegis Semiconductor Signs with Fabrinet to Expand Manufacturing Capacity of Channel Monitors. Nov 7, 2006 520 Tower Semiconductor Begins Production of UXGA (Two-Mega-Pixel) and VGA Image Sensors for SuperPix of China. Nov 2, 2006 660 Renesas to Expand Production Capacity at Back-End Process Facility in Kyushu, Japan; A New Building at the Kumamoto Manufacturing Plant Will Consolidate the Operations of the Fukuoka Plant. Aug 31, 2006 440 Ibis Technology Announces Final Customer Acceptance of Oxygen Implanter; SUMCO grants final acceptance of their second Ibis i2000 implanter; system to begin production of SIMOX-SOI wafers immediately. Aug 29, 2006 929 Siliconaire Inc. Introduces New Operations Model for Fabless Semiconductor Companies; Cost-Effective Approach Enables Fabless Startups to Control Operational Expenses; Benefit From an Expert Team; Preserve Margins When Production Ramps. Aug 7, 2006 621 Filtronic cuts back its plant investment cash. Aug 1, 2006 507 AMD Begins First Revenue Shipments of AMD64 Products Manufactured at Chartered; Delivering on Its Customer-Centric Strategy of Flex Capacity, AMD Starts On-Plan, On-Time Startup of Volume Production at Chartered. Jul 13, 2006 705 VESTA ALD in Volume Production for Semiconductors; System Order from Major Semiconductor Manufacturer in Japan Boosts ALD Market Momentum. Jul 10, 2006 329 Silecs Introduces New Products for CMOS Image Sensor Manufacturing; New Optical Materials Designed for CMOS Image Sensor Applications Improve Image Quality and Reduce Production Costs for Mobile Phone Cameras and Other Consumer Applications. Jul 6, 2006 401 RFMD begins pre-production sampling of new GaAs pHEMT LNAs. Brief article Jun 19, 2006 201 austriamicrosystems Unveils 5V 130mA Step-up DC-DC Converter; AS1321 High Efficiency Step-up DC-DC Converter Supplies Fixed Output of 5V for Battery Powered Applications Where Small Size and Low Power Consumption Are Critical. Jun 14, 2006 422 AMD to Invest US$2.5 Billion in Germany to Expand 300mm Microprocessor Production; Large Investment in Europe Underscores AMD's Leadership Strategy to Drive Microprocessor Manufacturing Innovation and Reduce Costs for End Customers. May 29, 2006 904 InterDigital and Infineon Expand Cooperative Agreement to Include HSDPA Technology Development. Jan 19, 2006 480 Azimuth Systems Strengthens Leadership Position with Several Major Milestones; Wi-Fi Test Equipment Leader Ships 1,000th Test Module, Expands Product Line and Attracts Industry-Leading Customers. Jan 10, 2006 706 Pixelworks(TM) Continues Product Line Expansion with Debut of Audio Processing and Video Demodulator Chips. Jan 6, 2006 807 NComputing's New Xtenda X300 Desktop Expansion Kit Allows Three Additional Users to Share One Host PC; New System Builder/OEM Product Leverages Altera's Low-Cost FPGA Family to Reduce Hardware and Networking Cost for SOHO Users. Jan 6, 2006 604 Wireless Communications Specialist Nordic Semiconductor and Distributor Nu Horizons Electronics Expand Distribution Partnership from Asia to North America. Company Profile Jan 4, 2006 742 US Subsidiary of Everlight Electronics Company, Ltd., Purchases LED and LED Display Product Lines from Fairchild Semiconductor. Jan 3, 2006 314 Hynix increases Eugene output. Dec 23, 2005 382 IXYS Expands ''Wespack(TM)'' Phase Control Thyristor Range to 2083 Amps and 2200 Volts Offering Significant Size, Weight and Cost Reductions over Conventional Press Packs. Dec 19, 2005 494 AMCC Raises the Performance Bar With Entrance into the GPON Application Space and Expansion of SerDes Product Family; AMCC Leverages Proven SerDes Design Expertise to Move into the GPON Market and Deliver Telecom-Grade PHY Devices for Customers. Dec 19, 2005 797 Discera Expands Executive Management Team; Venkat Bahl Adds Depth to Key Business Function, Bringing Strategic and Product Marketing Focus. Dec 13, 2005 414 Hiroshima Elpida Commences Mass Production of 90 nm DRAM Chips on New 300 mm Wafer Production Line; Newly Expanded E300 Fab Targets 54,000 Wafers per Month, the Largest Semiconductor Capacity in Japan. Dec 1, 2005 541 Teridian Semiconductor Introduces the World's Smallest Fast Ethernet PHY; Reduces Board Space by 70%, Targeted at Consumer Audio-Video Products. Nov 1, 2005 568 Diodes Inc. to expand product line into multifunctional circuits. Potkewitz, Hilary Brief Article Jul 18, 2005 214 Axalto adds U.S.-based smart card microelectronics module production at its Maryland Advanced Card Center. Apr 4, 2005 486 Test Results Showing Invention Failed to Satisfy Commercial Standards Are Not Material to Patentability. Dec 4, 2003 416 Tech shift. (Wall Street West). Brief Article Mar 31, 2003 145 IBM and Xilinx prepare for production of first 90nm chips on 300mm wafers. Dec 23, 2002 720 AMCC closing down its chip-making 'fab'. (High-Tech). Graves, Brad Brief Article Jun 10, 2002 77 China's entry into WTO is good news for Valley firms. (Up Front). Garcia, Shelly May 27, 2002 1508 Semiconductor Makers Explore Wafer Outsourcing. BARACH, DAVID Brief Article Oct 15, 2001 838 When the Chips are Down. SIVITZ, LAURA Nov 25, 2000 1765 Chip handling. Brief Article Aug 1, 2000 140 Varian Reports Flat Sales, Lower Orders and Profits for Fiscal 1998 Due to Recession in Chip Equipment Sector. Oct 22, 1998 2095 National Semiconductor Announces Plans to Restructure and Spin Out Wafer Manufacturing Operations in Scotland. Oct 5, 1998 531 SatCon Technology Corporation's Film Microelectronics, Inc. - FMI - Subsidiary Installs Unique Direct Write Laser Chrome Mask Maker for Thin Film Substrates. Sep 14, 1998 575 SigmaTron International, Inc. Flood Damage. Aug 26, 1998 468 Broadcom to Expand Corporate Headquarters At Irvine Spectrum. Aug 25, 1998 481