Browse Semiconductor production equipment industry topic

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Articles 1-100 out of 100 article(s) Title Author Type Date Words KLA-Tencor Launches PVI-6 Solar Inspection Product. Mar 4, 2009 487 SpaceClaim Releases New Products to Enable 3D for All. Jan 9, 2008 669 Applied Materials Launches Strategy to Reduce the Cost Per Watt of Solar Power. Sep 5, 2006 941 Invitrogen Introduces Next Generation of Transfection Reagents; Lipofectamine(TM) LTX Reagent Improves DNA Delivery and Lowers Toxicity. Aug 30, 2006 442 SensArray Introduces Integral Wafer for Plasma, Wet and Planarization Processes; Breakthrough ''Zero Profile'' Architecture Produces Wireless Metrology Wafer Capable of Surveying Severe Process Environments. Jul 12, 2006 558 Tiger Optics. Brief Article Jun 15, 2005 25 Tiger Optics. Brief Article Jul 15, 2004 33 Micronix releases display driver IC that enables high resolution e-book. Brief Article Apr 9, 2004 130 Endura2 platform sets new standard for semiconductor manufacturing systems. Feb 16, 2004 312 Tiger Optics. Brief Article Aug 15, 2003 14 Palomar Technologies intros Model 8000 high-speed wire bonder. Jul 28, 2003 331 Palomar introduces 6-axis optical alignment stage. Mar 3, 2003 501 Varian Semiconductor announces new VIISta platform offering. Product Announcement Jul 29, 2002 430 Commercial spinoffs. Brief Article Jul 1, 2002 270 SEZ INTRODUCES NEW GENERATION SPIN-PROCESSOR FOR 4-6" WAFER FABRICATION. Product Announcement Sep 25, 2000 200 New Japanese Presses Have Hybrid Clamping. Brief Article Feb 1, 2000 366 Microbar Unveils Revolutionary Wastewater Treatment Technology for the Semiconductor Industry; EnChem Designed to Address Critical Fab Cost-of-Operation Issues. Oct 20, 1998 814 Schlumberger Introduces IDS 2000--the First Diagnostic System to Probe Flip-Chip Devices Through Silicon. Oct 5, 1998 483 Lam Research Corporation Releases Dual Damascene Applications for 4520XLE -- Now in Use in Copper Production At a Major U.S. Chip Manufacturer. Sep 23, 1998 659 KLA-Tencor Introduces Advanced Inspection Technology for OPC Photomasks. Sep 21, 1998 450 Analogy Announces TESTIFY for Board and System Test Development; New Product Delivers Analog and Mixed-Signal Fault Simulation for Military and Aerospace Applications. Sep 18, 1998 875 New Rimage CD-R Publishing System Now Available From MARCAN. Sep 15, 1998 290 Applied Materials Introduces Ultra-Shallow Junction Module to Enable GigaHertz-Generation Devices. Aug 25, 1998 702 Applied Materials Leads the Advancement of RTP with New XEplus System. Aug 25, 1998 569 SatCon Ships First 200mm Magnetic Suspension Product for the Semiconductor Industry. Jul 21, 1998 536 Credence Enters Memory Verification Market; First Affordable, Flexible Benchtop Tools Dedicated for Memory Verification of NVM Devices to be Shown at Semicon West 98. Jul 15, 1998 768 Applied Materials Introduces Breakthrough Copper Cleaning Technology; Reactive Preclean Cuts Resistance in Copper Interconnects to Enable Faster Chips. Jul 13, 1998 457 Applied Materials Introduces Nitride550 CVD Process to Enable Next-Generation Transistor Structures. Jul 13, 1998 467 Therma-Wave Introduces New Opti-Probe 5000 Series at SEMICON/West 98; Series' Customizable Feature Sets Reduce Manufacturing Costs. Jul 13, 1998 429 PRI Automation Unveils New 300mm Automation Products for Next-Generation Wafer Fabs. Jul 13, 1998 892 Nanometrics Introduces Three New Thin Film Metrology Systems. Jul 13, 1998 573 Credence Introduces New Configuration of High Pin Count ValStar Series Test System; VS 2000e Extends High-Volume Production Capabilities. Jul 9, 1998 540 Applied Materials Introduces New Storage Capacitor Solution for Gigabit DRAMs. Jul 8, 1998 471 Mattson Technology Debuts 300mm Stripper at SEMICON West 1998. Jul 6, 1998 417 Canon Introduces Dual-Era FPA-5000ES2 Scanning Stepper; First KrF Lithography Tool for 0.18 Micron Patterning on 300mm Wafers. Jul 6, 1998 411 Cypress Adds Verilog Synthesis To Warp Software; Programmable Logic VHDL Leader is Now Simply the HDL Leader. Jul 6, 1998 777 Spectra International Introduces Photoresist Solution; New In-Situ Sensor Improves Device Yields, Saves Time and Money. Jul 2, 1998 342 Applied Materials Announces Technology and Productivity Breakthrough with New PRODUCER System. Jul 1, 1998 633 AG Associates Unveils Revolutionary 300 mm RTP System for 0.18 Micron and Below Applications. Jul 1, 1998 1028 TRTC Announces Enhanced US-VLF Semi-Automatic Wet Process Station. Jun 30, 1998 387 Lam Research Corp. Launches High-Density Dielectric Etch System for Sub-0.25 Micron and Beyond. Jun 29, 1998 453 Fluoroware Unveils New Cleaning Equipment Line; Process One systems set new industry standard for cost of ownership. Jun 23, 1998 757 Mattson Technology Ships 500th Aspen Strip System to AMD; Reception at Mattson Headquarters to Commemorate IC Producer's Selection. Jun 16, 1998 510 Inspectech's KIS 2000 Dicing Yield Maximizer Scheduled for SEMICON West Introduction. Jun 8, 1998 792 Novellus Unveils Damascus: A Full Spectrum of Copper Products and Processes Featuring a Revolutionary New Copper Electrofill System. Jun 2, 1998 1772 Mitsubishi Announces Sample Availability of QAM Channel Decoder for Cable Modem, Digital CATV Set-top Box and MMDS System Applications. May 13, 1998 601 Applied Materials Unveils Industry's First Fully-Automated Defect Review SEM for High-Volume Production. May 8, 1998 632 Novellus Introduces Next-Generation PVD System for 0.18 Micron Production; New INOVA Features Novellus' Innovative HCM High Density Plasma Source Technology. Apr 29, 1998 672 Coherent Communications Systems Corp. Announces the CEC-128 Echo Canceller Module for OEM Integration. Apr 9, 1998 375 Matheson Introduces the New Phosphine SDS2 Safe Delivery Source. Apr 1, 1998 401 Lam Research to Present Etch, CMP, CVD, and 300 mm Solutions at SEMICON Europa. Mar 26, 1998 419 Fluoroware Rounds Out Comprehensive Line of 300 MM Products With Introduction of 300 MM Voyager Wafer Shipper; Shipper qualified and purchased by leading wafer supplier. Mar 24, 1998 684 Augment Unveils New, Lower-Cost AFX 410 Storage Servers System Price Reductions Reflect Storage Economies, Fibre Channel Acceptance. Mar 12, 1998 1023 Orbotech Launches VT-8000 Inspection System In North America. Mar 3, 1998 587 ASML Introduces Its First i-line Step & Scan. Feb 24, 1998 668 Tegal Develops New Titanium Etch Application For Disk Drive Heads. Jan 14, 1998 213 Tegal Introduces Smaller Footprint 900 Series Etch System. Jan 7, 1998 218 MRC Introduces Eclipse Mark IV PVD System at SEMICON/Japan '97. Dec 3, 1997 528 Applied Materials Announces First Barrier/Seed Layer System for Copper Interconnects. Dec 2, 1997 1010 QC Optics Announces First Shipment of DISKAN-9000 Systems. Dec 2, 1997 338 VLSI Releases Cell Libraries for 0.25- and 0.20-Micron Processes, Upgrades Specs for 0.20-Micron Technology. Nov 24, 1997 999 Applied Materials Announces New RTP Oxide Technology. Nov 21, 1997 653 Ultima Interconnect Technology Enters Net Parasitic Extraction Market, Introduces Ultima-PE. Nov 10, 1997 1079 Systems Science Enters the Formal Analysis Market, Adds to its Design Verification Offering. Nov 10, 1997 734 Fairchild Technologies Introduces New Family of Optical Disc Manufacturing Solutions at Hong Kong Show. Nov 5, 1997 487 Factory Mutual Research Corp.'s New Technology Defines Semiconductor Clean Room Plastics That Don't Require Special Fire Protection. Oct 22, 1997 505 ProSys Announces Advanced New Family of MegaSonics Cleaners; ProSys MegaSonics Cleaners Deliver High Reliability, Advanced Electronics, and Lower Cost of Ownership. Oct 13, 1997 541 New IBD-350 Technology Introduced for Advanced MR/GMR Deposition Applications. Oct 10, 1997 414 Veeco Announces the New Wyko LT-2000 Laser Texture Disk Measurement System for Faster, More Reliable Process Control. Oct 10, 1997 372 Ultratech Announces Revolutionary Thin Film Head Lithography System; Model 1800 Broadens Ultratech's Application-Specific Line of Tools for the TFH Market, Provides Lowest Cost-of-Ownership Solution Available for Rowbar-Level Pole Trimming. Sep 23, 1997 727 Ion Systems Introduces Smart, High Performance Ionizer for Small Environments; Single Fan Precision SC. Sep 22, 1997 392 MPM Announces Production Model of its Ultraprint 2500 Series with Dual Lane Capability. Sep 9, 1997 427 Applied Materials Introduces Advancement in Reticle Inspection Technology; New RT-8000ES Reticle Inspection System Delivers Enhanced Sensitivity for Next Generation Applications. Sep 5, 1997 529 KLA-Tencor Introduces New Reticle Inspection Enhancements for 0.25-Micron and Below Lithography; Two New Features Enable Highly Accurate and Reliable Inspection of Advanced OPC Reticles. Aug 28, 1997 495 GaSonics Offers A3010 Photoresist Removal Chamber on PEP Platform; PEP 3010A Provides High Throughput and Closed-Loop Temperature Control in a Lamp-Based System. Aug 27, 1997 423 Kulicke & Soffa Announces Products and Services That Will Reduce the Cost of Semiconductor Assembly. Jul 16, 1997 452 K&S Model 8020 Wire Bonders Chosen for First Fully Automated U.S. Semiconductor Assembly Factory. Jul 16, 1997 228 Credence Introduces a New Era of Semiconductor Testing: ValStar 2000, the First Affordable Production Test Solution for High Pin Count VLSI; Credence's ValStar 2000, the Newest Generation of ATE Test Systems, Delivers Exceptional Performance at a Revolutionary Price in an Evolutionary Footprint. Jul 16, 1997 839 Genus Introduces Two Ion Implanters with the Highest MeV Yields, a Broad Energy Range and the Lowest Operating Costs in Industry; Kestrel 650 Targets Traditional High-Energy Implants; Kestrel 750 Aims at More Aggressive Applications. Jul 15, 1997 616 Genus Introduces World's First Plasma-Enhanced CVD Tungsten Nitride Process Module and Low-Cost Integrated Amorphicide; New Films Offered on LYNX2 Modular, Single Wafer CVD Platform. Jul 15, 1997 686 Etec's New ALTA 3500 Scanned-Laser System Offers Unprecedented Performance and Quality. Jul 14, 1997 520 Berkeley MicroInstruments Introduces Two New Products for the Semiconductor Industry. Jul 14, 1997 136 Nikon Optimizes NSR Stepper Productivity: Debuts Nikonnest at SEMICON West 97. Jul 14, 1997 416 Nikon Introduces Second-Generation KrF Excimer Stepper for Mass Production of Emerging ULSI Devices. Jul 14, 1997 479 Praxair Introduces New Monitoring and Control Systems for Semiconductor Process Gases. Jul 14, 1997 338 Applied Materials Introduces New High Performance Metal Etch DPS R1 Centura System; DPS R1 Takes the Advanced, 0.25-micron Capabilities of the Metal Etch DPS Centura to Even Higher Performance Levels. Jul 11, 1997 666 Electroglas Announces Breakthrough Wafer Probing Solution. Jul 10, 1997 852 Asyst Technologies Introduces Breakthrough 300mm Series; New Series of 300mm Isolation Technology-Based Products Meets All Industry Standards. Jul 10, 1997 957 KLA-Tencor Extends its Online Automated Defect Classification Solution with Industry's First ADC Matching Software. Jul 9, 1997 592 Ontrak Systems Introduces First CMP Cleaning System Featuring Platform Designed Specifically for Polisher Integration; Synergy Integra enables dry-in, dry-out CMP and clean process solution. Jul 8, 1997 458 PRI Automation Introduces Semiconductor Industry's First Fully-Integrated Automation Systems for Next-Generation 300MM Wafer Fabs. Jul 7, 1997 1397 TEL Introduces the P-8XL Wafer Prober. Jul 7, 1997 312 LUXTRON Announces TrueTemp 7150 Ripple Technology, for Non-contact In situ, Real-time RTP Wafer Temperature Measurement in Lamp Heated Environments; Emissivity Independent Accurate Temperature Measurement Featuring LUXTRON's Patented Ripple Technology. Jul 7, 1997 504 LUXTRON Introduces OPTIMA 9400 Optical Chemical Mechanical Planarization End Point System to Provide Real-time, In situ Wafer Processing Monitoring and Control. Jul 7, 1997 470 Mattson Technology Unveils Aspen Strip Turbo System At SEMICON West 1997; Mattson's New Strip Tool Delivers a 35-45% Throughput Improvement. Jul 7, 1997 624 New semiconductor parameter analyzers from HP combine high throughput and convenience; LAN connection, "friendly" software environment help speed product-development time. Jul 1, 1997 699 New Canon EX3L will expedite worldwide move to 300mm. Jul 1, 1997 456 Applied Materials' Mirra System Advances CMP Technology With New Next-Generation Polishing Head; New Titan Head Sets Industry Standard for Process Performance and Reliability. Jun 25, 1997 483 Electroglas Introduces New High-Load Hinged Testhead Manipulator; Industry's most robust, standardized testhead interface solution support current- and future-generation applications. Jun 24, 1997 666 Kayex Unveils Revolutionary 300mm Crystal Growing Furnace. Jun 24, 1997 395