ProMOS Technologies Selects ESI's High Performance Laser Processing System for Advanced DRAM Manufacturing.

Business Editors/High-Tech Writers

PORTLAND, Ore.--(BUSINESS WIRE)--Feb. 6, 2004

Electro Scientific Industries, Inc. (Nasdaq:ESIO) today announced a multi-system order from ProMOS Technologies for ESI's Model 9830 laser fuse processing system. ESI commenced shipment of these systems during its third fiscal quarter ending February 28, 2004, with final delivery in its fourth quarter.

ProMOS is implementing a self-developed 0.12 micron process technology for advanced DRAM production, and is also collaborating with global technology partners to implement 90nm and below DRAM designs. The Model 9830's patented 1.3 micron wavelength offers the process flexibility required for this range of products. The Model 9830 also delivers the high throughput needed for cost effective volume production of 512Mb and 1Gb devices. In addition, the small spot size and accuracy of the Model 9830 will handle future DRAM designs down to 90nm and beyond.

"ESI's Laser Processing System is a valuable vehicle for ProMOS to achieve optimal manufacturing efficiency with cost competence and yield refinement," said Dr. M.L. Chen, President of ProMOS Technologies.

"ESI has had a long-term relationship with ProMOS Technologies," said Steve Harris, Vice President of ESI's Semiconductor Group. "The employment of ESI's Model 9830 combined with ProMOS' manufacturing excellence and leading edge process technology clearly showcases a roadmap for meeting the global semiconductor market demands for production of new DRAM devices."

Based on ESI's legacy of technology excellence in DRAM laser fuse processing, the high-throughput, highly accurate Model 9830 is the platform for future 90nm and 70nm semiconductor memory designs. The system is designed for high-volume 300 mm wafer processing of DRAM, SRAM, embedded memory and other laser fuse applications. It dramatically increases yields by enabling redundant memory on each chip and lowers processing costs. The 9830 also includes innovative new optics and beam positioning designs, which deliver capability for the processing of new generations of 512Mb and 1Gb DRAM device designs.

About ProMOS Technologies Inc.

ProMOS Technologies is located in HsinChu Science-based Industrial Park of Taiwan. It manufacturers high performance and high-density commodity DRAMs and other niche memory products, including pseudo-SRAM, low power SDRAM and MCM products. ProMOS applies the leading-edge technologies for advanced memory products and is noted in global DRAM industry for its outstanding performance in manufacturing excellence and technology advancement. ProMOS owns two fabrication plants (fabs). The 8-inch (200 mm) fab applies 0.12 micron process for volume production, 110nm process in pilot runs. Its 12-inch (300 mm) fab is one of the world's leading 12-inch DRAM fabs in volume production. For more information, please visit www.promos.com.tw.

About ESI

Electro Scientific Industries, Inc. (ESI) is a global supplier of manufacturing equipment to increase productivity for customers in the semiconductor, passive components and electronic equipment markets. As an innovator in the electronics industry, ESI has a legacy of technology firsts and customer recognition for product excellence. The advanced electronic devices you see and use around the world today -- cell phones, personal computers, digital cameras, PDAs, even automotive electronics -- contain components that were likely manufactured with ESI equipment. The company was founded in 1944 and is headquartered in Portland, Oregon. ESI's web site is http://www.esi.com.