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Articles from Printed Circuit Design & Manufacture (May 1, 2007)

1-40 out of 40 article(s)
Title Author Type Words
[E.sup.3].series 2007 is said to have advancements relating to 3rd party integration and increased ease of use and productivity. 90
10+ Gb/second signal considerations: improving layout technique and focusing on physical layer structure can optimize signal integrity. Ali, Syed W. 1978
Altium Designer 6's intelligent interactive routing system has been enhanced with a new interactive length-tuning tool for high-speed designs. 72
Aspocomp Group Oyj entered into an agreement with the group's Taiwanese partner Chin-Poon Holdings to acquire its 49% minority interest in ACP Electronics Ltd., the Suzhou, China based joint venture of the two companies. 50
BluePrint for PCBs Version 1.7 is said to deliver customer enhancements as well as general product quality improvements to increase the product's usability, stability and market reach. 80
Breaking old habits: reduce waste and work towards profitable collaborations that improve your success. Bigelow, Peter 861
Can R&D consortia increase the PCB industry's innovation output? Collaborative research provides an economical avenue that fosters process innovation and new product development channels. Fisher, Jack 3278
Celestica Inc. 58
Cimmetry Systems and LDSI signed a new independent software vendor agreement where LDSI will embed AutoVue Office, Web Edition, viewing and annotation capabilities into its web-based document management and e-discovery solutions. 62
Curing oven profiles. 80
DEK named Scanditron as its exclusive distributor for key markets in Latvia, Lithuania and Estonia. 28
Dispense valve. 85
Electronics gear demand slowing, will rebound in '08. 169
Endicott Interconnect Technologies Inc. 60
Events. Calendar 235
February 2007 book-to-bill ratios up. Heffner, Tracy 298
Freedom CAD Services Inc. 39
Getting a 'designer' education. Nargi-Toth, Kathy 827
Global Innovation Corp. 70
Industry market snapshot. 123
Intercept Technology Inc. and DesignAdvance Systems Inc. created a partnership to integrate Intercept Technology's PCB layout software, Pantheon, with DesignAdvance's PCB placement design and automation technology, CircuitSpace. 53
IP cameras looking good. 107
IPC releases 2006-2007 International Technology Roadmap for Electronic Interconnections. Heffner, Tracy 162
Keratherm 86/77 provides electrically conductive bonding sites on a flexible, thermally conductive material that can be attached to non-linear, heat spreading structures. 80
March inventories, orders down. 181
Mentor Graphics announces winners of its 19th Annual PCB Technology Leadership Awards. Heffner, Tracy 497
Merix Corp. 99
Moving forward, moving up? Situated in a new location, CPCA again impresses. But SEMI warns of the threat to China's growth. Nargi-Toth, Kathy 1428
Oxide replacement for high temperature applications: increased high temperature stability enhances adhesion in RoHS compliant laminate materials. Ormerod, D. 2723
PCB production in January 2007: revenues post double digit growth. Numakura, Dominique 821
Printable electronics pushes $2b. 119
Product support for the ARM Cortex-M1 processor is available. 76
Semis sink. 204
Sierra Proto Express and CadParts & Consulting formed a strategic alliance to sell a complete PCB design. 24
Software simulation tools for EMC control of high-speed signals: using multiple simulation techniques and tools improves modeling validity. Archambeault, Bruce 4549
The impact of innerlayer copper foil roughness on signal integrity: smooth copper minimizes signal attenuation at high frequencies but it can negatively impact product reliability by reducing innerlayer bond strength. Lee, Bruce 2041
The Technic EBA (Electrochemical Bath Analyzer) is available for all Technic acid copper plating chemistries and reportedly utilizes a combination of AC and DC voltammetry to provide accurate measurement of copper metal, sulfuric acid and organic additive levels. 77
Understanding differential pairs and differential signals: just don't think "differential mode." It will help keep differential signals separate from odd mode impedance, eliminating the confusion. Bogatin, Eric 819
UP Media Group announces major changes for the 2008 PCB design conferences. Heffner, Tracy 541
UV Curing Unit. 81

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