Articles from Printed Circuit Design & Manufacture (November 1, 2006)

1-42 out of 42 article(s)

Title	Author	Type	Words
3D thermal modeling: concurrent engineering tackles the thermal challenges of high-speed design.	Ikemoto, Sherman		1861
A force to be reckoned with: driving organizational excellence pays dividends.	Bigelow, Peter		888
Agilent Technologies Inc. and privately held Remcom Inc. reported that Agilent has licensed 3D electro-magnetic (EM) simulation technology from Remcom.			79
Altium Ltd.			37
Back-drill monitor.			56
Benchmark Electronics Inc.			52
Book-to-bill: rigid and flex up.			277
China's flex output to grow at 20% CAGR.	Heffner, Tracy		349
Communication bus Data Extractor.			60
Crystal clear reproductions: optimizing process controls for the next generation diazo phototool films.	Jarvis, Jeff		906
DDi Corp. completed the sale of its assembly business to Veritek Manufacturing Services LLC, for approximately $12 million in cash.			60
Design software.			70
Design Software.			71
DFM collaboration solution.			81
Elcoteq SE.			63
EMA Automation on Inc. 500 list for second year.	Heffner, Tracy		98
Embedded passive test programs: ECIT active with OEMs on embedded passive testing.	Snogren, Richard	Company overview	1095
Endicott Interconnect Technologies Inc.			50
Events.		Calendar	233
Fidus Systems has acquired Fabridyne Electronics Inc.			40
Foxconn to invest US$1 b in China.			242
Growth in storage.			169
Henkel Electronics Group.			32
Indian auto electronics in fast lane.			125
Industry market snapshot.			98
Inventories climbing, in control.			83
IPCA seeks government help.	Heffner, Tracy		332
ISM: manufacturing sector slowing.			270
JMD International and Sedona Board Services announced the completion of a definitive merger agreement.			38
Laminate material selection for RoHS Assembly, Part 1: success in lead-free assembly is based on matching critical laminate properties with the design constraints.	Bergum, Erik		2928
Lead-free HAL final finishes: a review of RoHS compliant hot air leveled options.	Liyanage, Nimal		2734
Mentor sponsoring design lab at Hungarian university.	Heffner, Tracy		182
Microwave Laminate.			88
Plexus to expand capacity, capabilities in Malaysia.	Heffner, Tracy		142
Real world training: hands on at the Switzerland of the networking industry.	Bogatin, Eric	Company overview	722
The 2006 salary survey: despite a few blips, the overall salary numbers hold strong. But designers seem more cynical than ever.	Shaughnessy, Andy		3155
Time for a new tool.	Nargi-Toth, Kathy		695
Topology router.			72
TV shift seen.			110
Vertical Plater.			55
Winland Electronics Inc.			59
Xtreme accelerator/emulators.			71