Articles from Printed Circuit Design & Manufacture (July 1, 2006)

1-48 out of 48 article(s)

Title	Author	Type	Words
4th Dimension PCB.			53
A turning point: we survived the RoHS deadline, but what now?	Bigelow, Peter		821
Advanced Circuits wins wastewater award.	Shaughnessy, Andy		184
Altium releases Designer 6.3.	Shaughnessy, Andy		181
Ansoft Q4 income up 75% YOY.	Shaughnessy, Andy		160
Book-to-bill: rigid strong, flex down.	Shaughnessy, Andy		285
Circuitronics fined for waste violations.	Shaughnessy, Andy		106
Closed Isola UK plant latest site for fire.	Shaughnessy, Andy		92
Connectors.			71
Dai Nippon licenses B2it to Samsung.	Shaughnessy, Andy		71
Distributed autorouting of printed circuit boards: it's true--there is strength in numbers. Learn how to take advantage of multiple CPUs when routing large PCBs.	Pfeil, Charles		1693
Domain-optimized FPGA.			68
EDA-PLM software.			72
Empowering you to meet tomorrow's PCB design challenges.			2855
Endicott Interconnect Technologies won several new contracts for the fabrication of wirebond PBGA substrates resulting from alliances with Silicon Valley-based companies Singulated Technology and CORWIL Technology Corp.			47
Endicott Interconnect Technologies.			59
Europe's PWB market to grow 3.5%.			118
Events.		Calendar	277
FKI Logistex Manufacturing Systems North America.			47
Gartner: growth, consolidation in IC sector.	Shaughnessy, Andy		72
IDC: servers facing commodization.			101
Industry market snapshot.			79
Insulating pre-preg.			68
IPC.			53
JPCA 2006 recap: the biggest PCB show continues to amaze.	Numakura, Dominique		780
Lead-free FR-4 Specs: facts and fiction: Just in time for July 1, what you need to know about IPC-4101B--what it does and what it doesn't do.	Sober, Douglas J.		1303
Lead-free reflow oven.			69
Manufacturing dampened in May.			255
Microvia failure in lead-free assembly, Part 2: failure analysis continues with examples of the effects of thermal excursions on microvias.	Andrews, Paul	Cover story	2046
Mobile music.			101
Nu Horizons Electronics Corp.			28
One door closes, another opens.	Shaughnessy, Andy		639
Only two knobs to tweak above 3 Gbps: either increase the attenuation budget with more expensive silicon or decrease the attenuation with more expensive laminates. The choice is yours.	Bogatin, Eric		756
OrCAD CIS, PADS integration.			70
Part list management.			67
RF inductor.			82
Secure communications.			168
Socketless probe testing: boards keep shrinking, but the decreasing size of test targets doesn't have to be a problem.	Smith, Jeff		1129
Solectron EVP resigns.	Shaughnessy, Andy		67
The Elprint AS facility in Bergen, Norway, has invested around .4 million euros in a developing-etching-stripping system from Hollmuller Maschinenbau GmbH.			37
The Institute of Environmental Sciences and Technology has chosen new officers for the term beginning July 1.			80
Thermal prototyping: optimizing etched-foil heater performance can complement other approaches, such as thermal estimation programs and FEA.	Williams, Brian		1402
U.S. Department of Housing and Urban Development.			27
Ultra fine-line AOI.			76
UMC acquires equipment, Velie personnel.	Shaughnessy, Andy		85
What's next on the environmental front: new priorities must be defined and industry must proactively drive for harmonized regulatory standards.	Pfahl, Bob		1722
WISE releases GerbTool v. 15.	Shaughnessy, Andy		127
Worldwide PCB output for 2005: Asia leads the way in board production, and the U.S. cements its position at the bottom of the list.	Nakahara, Hayao		2314