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Articles from Printed Circuit Design & Manufacture (April 1, 2004)

1-62 out of 62 article(s)
Title Author Type Words
1+ GHz dielectric. 48
3D electrostatic software. 65
Achieving impedance control targets: the standard tolerance for characteristic impedance of a line--[+ or -] 10%--is changing fast. Use of field solvers can get Zo within [+ or -] 1%. Zimmer, Steve 2025
Air freight prices on rise: congestion at the hubs. 127
Aspocomp Group Oyj. 41
Back to the phones. Kowalewski, Andy Letter to the Editor 135
Big plans. Shaughnessy, Andy 29
Cadence releases new Allegro platform: spotlights system level co-design. Shaughnessy, Andy 122
CAM panelization. 82
Camtek Ltd. 29
Compliance grant. Shaughnessy, Andy 59
Cost is king. Adolphs, Jeff Letter to the Editor 306
CT SMTA chapter looks at Pb-free: finds most shops ready. Wolfe, Bob 240
DDi gets stacked. Shaughnessy, Andy 79
Defensive position. 164
Deterministic jitter: by understanding the relationship between 'aggressor' line and 'victim' line bit switching, designers can keep crosstalk-induced deterministic jitter at bay. Or, just use embedded technology. Bogatin, Eric 561
DownStream Technologies. 47
EEs for hire: unemployment at all-time high. Buetow, Mike 193
Electro Scientific Industries (esi.com) sold a model 2100 laser trimmer. 17
Electropac Montreal also purchased a DP-1500 for vertical double-sided screen coating. 16
EMI shield. 48
Epoxy on rise. Shaughnessy, Andy 22
Events. Calendar 320
For lead, no blue sky. Buetow, Mike 630
Gartner: 30% hike in ICs in 2004. 109
Gould adds high Tg version of resistor foil. 116
High-frequency CAD. 62
In-Stat: 6.5% CAGR ahead for PDAs. 106
Industry market snapshot. 54
Is the supply chain finally unchained: after two years of stagnation and recession, changes are afoot. While the buzz was of pending environmental laws, the feel-good story was the mood swing. Shaughnessy, Andy 1303
Land pattern tool set released. Buetow, Mike 104
Lloyd Doyle (lloyd-doyle.com) installed a Redline AOT system at Century Circuits (centurycircuits.com). 25
Manufacturing still in full swing. 289
Mentor gets with program. Shaughnessy, Andy 45
Merger mania. Shaughnessy, Andy 17
Merix Corp. (merix.com) ordered multiple Spiron-8800 VIP AOI systems. 15
Micro-machining of trenches to form shielded transmission lines: a laser and metalization method for forming a shield around a conductor, permitting 10 Gb/s signals with no crosstalk or EMC. Tourne, Joan Cover Story 1823
MLB stackup tool. 63
New life for tin-lead? RoHS rule may contain major loophole. 250
New shop shows 'flexibility'. 101
New System (new-system.com) sold a Newprint Legend printer to Quality Circuits (qualitycircuits.com). 22
NWSC Crane adding major R&D site: will partner with industry. 93
Offspring comes out: but will new data format take off? Buetow, Mike 210
Papers sought for PCB East 2004. Buetow, Mike 190
Pb-free laminate. 64
PCB screen printer. 55
Polyclad Laminates. 44
Simple cost modeling for EPs: a continuation of last month's discussion of how to create an accurate, user-friendly methodology. Snogren, Richard 855
Sovereign Circuits (sovereign-circuits.com) installed a PTH Speedline horizontal electroless plating line. 17
Taipei shows flex side. 198
The Christopher Group. 44
The dreaded 'P' word: partnerships are the football that fabs can't seem to kick. Beaulieu, Dan 846
The great recession: often confused, hole-wall pullaway and resin recession have different causes and require different remedies. Carano, Michael 679
The mating dance: is it time to change how we choose our suppliers? Bigelow, Peter 916
Tool time. Shaughnessy, Andy 22
TTM adding on: invests $14m in plant expansion. 147
Ultra-thin, loaded epoxy materials for use as embedded capacitor layers: use of <25 [micro]m high capacitance power-ground cores can eliminate hundreds of discrete capacitors, not to mention improving signal integrity and EMI. Peiffer, Joel S. 1500
Universal verification/repair. 55
Up and down. Shaughnessy, Andy 42
Using signal integrity analysis to achieve EMC: SI and EMC engineers usually take different routes to get to the same destination. Now EMC engineers may not have to spend so much time out on the test range. Raghuram, Raj 1984
Via-in-pad limitations. Rath, Randy Letter to the Editor 213
ZMC-Singapore. 24

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