Articles from Printed Circuit Design & Fab (March 1, 2008)

1-53 out of 53 article(s)

Title	Author	Type	Words
Accelerated Designs Inc.			38
Aegis opens new headquarters.	Nargi-Toth, Kathy		114
Atotech, U of Albany launch R&D partnership.	Nargi-Toth, Kathy		216
Automotive PCB market to double by 2012.	Nargi-Toth, Kathy		146
Black Oxide technology.			44
Cell phone manufacturers restructuring.	Nargi-Toth, Kathy		113
Copper surface preparation.			53
DDi receives Boing performance award.	Nargi-Toth, Kathy		77
Diane Grinder.			47
Digital solder mask printer.			58
EMI/EMC and SI effects from ground-return vias on PCBs: at higher frequencies signal loss and noise is reduced when ground-return vias are placed close to the signal vias.	Archambeault, Bruce		1077
Events.		Calendar	151
EVF micro via electroplate.			62
Fanout patterns, part 1: successful fanout solutions provide escape routing for a combination of serial and parallel nets.	Pfeil, Charles		658
Flexible solder resist.			73
Flying Probe for system test.			57
FPGA/PCB co-design increases fabrication yields: when integrating FPGAs into PCB design every signal and pin has a measureable effect on production yield.	Killy, Yan		1561
FUBA and MFS team up.	Nargi-Toth, Kathy		70
High density backplane connector.			64
Higher labor costs, higher profits?			171
Honeywell Electronic Materials and the U.S. Display Consortium (USDC) announced an agreement to develop materials for flexible electronics.			78
IEC releases new environmentally friendly design standard.	Nargi-Toth, Kathy		159
Immersion tin final finish.			48
Implementation of buried capacitance in high-speed designs: embedded capacitance frees up the board surface for routing traces, can reduce the overall board size and can speed time to market.	Fan, Jun; Smith, Norm; Knighten, Jim; Andresakis, John; Fukawa, Yoshi; Harvey, Mark		2428
Improved innerlayer bonding for sequential lamination: multiple lamination cycles add cumulative thermal stress to the innerlayer bonds.	Rasmussen, Jean; Owei, Abayomi I.; Isik, Danis; Dombert, Axel; Ormerod, David		2821
Industry market snapshot.			125
Landrex Technologies.			76
LG & Samsung target Motorola.	Nargi-Toth, Kathy		105
Mania Technologie has entered into an agreement with Century Hi-Tech Ltd. (Welly) to manufacture Micronic drilling machines.			30
New Year brings production upturn.			230
Optoelectronic design tool.			66
Optoelectronics comes of age, part 2: optical connectivity is sufficiently advanced, has been reduced to practice and is available for many near term applications.	Booth, Bruce L.; Fisher, Jack		1908
PCB etching.			55
PCB fabrication technologies.			51
PCB Solutions.			59
Peripheral push.			168
Plasma market picture mixed.			90
PPG Industries has acquired the assets and intellectual property of NanoProducts Corp., a producer of nanoproduct materials and a developer of nanoproduct technology.			69
Promote innovation to jumpstart economy, say industry associations.	Nargi-Toth, Kathy		488
Report: auto electronics slowing.			79
RF and microwave laminate.			64
Richard D. Parker.			43
Sierra Proto Express.			39
The Isola Group SARL.			49
The long view.	Nargi-Toth, Kathy		666
Thermal profiler.			77
Three axis measurment system.			79
Transceiver library.			61
UV laser for LDI applications.			85
Valor Computerized Systems announced the formation of a strategic partnership with EMA Design Automation for the North American market.			75
Voids, part 3: the best defense against voids is to understand the processes that can cause the defect.	Carano, Michael		780
Weathering the storm: experienced people are an essential part of a corporate recession survival plan.	Bigelow, Peter		901
X-ray fluorescence analyzer.			70