Plexus and Tessera sign agreement.

Plexus Corp. (Neenah, WI), a provider of engineering, manufacturing and testing services, and Tessera Technologies Inc. (San Jose, CA), a provider of intellectual property for chip-scale packaging (CSP), have signed a licensing and services agreement. The agreement enables Plexus to utilize Tessera's CSP and multi-chip packaging (MCP) solutions to develop and manufacture miniaturized electronic devices. In addition, Tessera will provide Plexus with design collaboration, technology support, technology transfer and sales and marketing assistance to accelerate their customers' time to market.

"Tessera's advanced packaging technology and expertise, combined with our leading design, new product introduction and manufacturing capabilities, will enable our customers to bring products they previously thought impossible to market quickly," said Bob Kronser, vice president of technology and strategy for Plexus. "This technology can be readily applied to medical devices, implantables, optical components, wireless communications and other products where size, weight, thermal and reliability considerations are critical to product design."