Phoenix/x-ray Systems + Services.AUTOMATICALLY DETERMINE BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. WETTING ERRORS The pcba|sentry is the only automated au·to·mate v. au·to·mat·ed, au·to·mat·ing, au·to·mates v.tr. 1. To convert to automatic operation: automate a factory. 2. microfocus x-ray X-ray Electromagnetic radiation of extremely short wavelength (100 nanometres to 0.001 nanometre) produced by the deceleration of charged particles or the transitions of electrons in atoms. inspection/failure analysis system that determines opens and wetting errors instantly at known levels of confidence. Its powerful BGA analysis software performs all assembly inspection--diameter variations, percentage voids, form errors, mis-registration, pitch, insufficient solder solder (sŏd`ər), metal alloy used in the molten state as a metallic binder. The type of solder to be used is determined by the metals to be united. Soft solders are commonly composed of lead and tin and have low melting points. Hard solders (i. mass--for both production lines and FA labs. 1676 Lincoln Avenue, Utica, NY 13502 PH: 877/749-9729; 805/389-0911 ext. 11 dklehmann@phoenix-xray.com http://www.phoenix-xray.com [ILLUSTRATION OMITTED] |
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