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Philips and Fairchild Form Strategic Alliance to Second Source Leading Small Scale Packaging Technologies.


Business Editors & High-Tech Writers

SOUTH PORTLAND, Maine South Portland is a city in Cumberland County, Maine, United States. As of the 2000 census, the city population was 23,324. Geography
South Portland is located at  (43.631549, -70.272724)GR1.
 & EINDHOVEN, The Netherlands--(BUSINESS WIRE)--Sept. 23, 2002--

Semiconductor Leaders in Logic Packaging Work to Promote Industry

Standardization for DQFN DQFN Depopulated Very-Thin Quad Flat-Pack No-Leads  and MicroPak(TM) and to Support the Growing

Portable Market

Fairchild Semiconductor (NYSE NYSE

See: New York Stock Exchange
:FCS FCS - Frame Check Sequence ) and Royal Philips Electronics (AEX AEX

See: Amsterdam Exchange
:PHI phi
n.
Symbol The 21st letter of the Greek alphabet.


PHI,
n See health information, protected.
)(NYSE:PHG), two of the industry's largest standard logic suppliers, announced today that they have formed a working relationship to become a multi-source supplier for small-scale logic packaging.

This development increases the availability of the industry's two leading packaging technologies- Fairchild's MicroPak and Philips' Depopulated de·pop·u·late  
tr.v. de·pop·u·lat·ed, de·pop·u·lat·ing, de·pop·u·lates
To reduce sharply the population of, as by disease, war, or forcible relocation.
 very-thin Quad Flat-pack No-leads (DQFN) packages. This relationship will provide customers with second sourced, premier packaging solutions today, and with future logic packaging technologies.

Fairchild's MicroPak packaged logic and Philips' DQFN packaged devices are ideally suited for space-constrained applications such as cellular telephones, PDAs, watches, cameras, notebook computers and other portable electronics. MicroPak offers designers single and dual gate products that provide a 65 percent space savings over SC70 packages. The DQFN package is approximately 75 percent smaller than existing TSSOP TSSOP Thin Shrink Small Outline Package
TSSOP Thin Scale Small Outline Package
 packages.

"Customers often require multiple suppliers before adopting a new package," said Rich Lewis, Fairchild's marketing manager for Logic Products. "Fairchild's relationship with Philips gives customers the flexibility and second source supply that they want, and promotes faster adoption rates of new packages for the industry."

"Philips' and Fairchild's working relationship provides our customers with second-source options in the best package designs available anywhere," said Bruce Potvin, director of marketing for logic products at Philips. "This relationship creates the logic industry's benchmark for packaging excellence, and brings us one step closer to eliminating confusion in today's logic market."

Fairchild's 6 terminal MicroPak(TM), with a footprint of only 1.45 mm by 1.00 mm and a height of only 0.55 mm, features leadless contact pads. These contact pads eliminate the potential loss of co-planarity during the production process and allow the package to be soldered Pronounced "sod-erd." Permanently attached by a hard metal bond. In order to replace a chip soldered to a circuit board, it requires heating the soldering joints until they melt. Contrast with socketed.  to the pc board more efficiently. MicroPak's familiar overall dimensions (similar to passive chips) and 0.5 mm terminal pitch facilitate qualification on high volume production lines.

Philips' lead-free DQFN package addresses the market needs for smaller electronic products and components. The DQFN package's extremely small size allows miniaturization min·i·a·tur·ize  
tr.v. min·i·a·tur·ized, min·i·a·tur·iz·ing, min·i·a·tur·iz·es
To plan or make on a greatly reduced scale.



min
 of the circuit board and frees board space for additional devices and functions. Designed with a footprint of 2.5 mm by 3 mm in a 14-pin configuration, the DQFN package is also available in 16- and 20-pin options. The DQFN package offers improvements in heat dissipation Noun 1. heat dissipation - dissipation of heat
chilling, cooling, temperature reduction - the process of becoming cooler; a falling temperature
 and ease of board assembly. The package incorporates an exposed die paddle, providing a 20 percent improvement in heat dissipation over a comparable TSSOP package. The package contains no leads, thereby eliminating co-planarity and bent-lead issues.

About Philips

Royal Philips Electronics of the Netherlands is one of the world's biggest electronics companies and Europe's largest, with sales of $28.8 billion (EUR EUR

In currencies, this is the abbreviation for the Euro.

Notes:
The currency market, also known as the Foreign Exchange market, is the largest financial market in the world, with a daily average volume of over US $1 trillion.
 32.3 billion) in 2001. It is a global leader in color television sets, lighting, electric shavers, medical diagnostic imaging and patient monitoring, and one-chip TV products. Its 184,000 employees in more than 60 countries are active in the areas of lighting, consumer electronics, domestic appliances, components, semiconductors and medical systems. Philips is quoted on the NYSE (symbol:PHG), London, Frankfurt, Amsterdam and other stock exchanges. News from Philips is located at www.newscenter.philips.com/usa.

About Fairchild Semiconductor International:

Fairchild Semiconductor (NYSE:FCS) is a leading global supplier of high performance products for multiple end markets. With a focus on developing leading edge power and interface solutions to enable the electronics of today and tomorrow, Fairchild's components are used in computing, communications, consumer, industrial and automotive applications. Fairchild's 10,000 employees design, manufacture and market power, analog & mixed signal, interface, logic, and optoelectronics products from its headquarters in South Portland, Maine, USA and numerous locations around the world. Please contact us on the Web at www.fairchildsemi.com.
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Copyright 2002, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Publication:Business Wire
Geographic Code:1USA
Date:Sep 23, 2002
Words:649
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