Philips Semiconductors Announces BiMOS3D Process for Integrated Circuits Dedicated to Motion Control.SUNNYVALE, Calif.--(BUSINESS WIRE)--Sept. 22, 1998-- Process Improves Hard Disk Drive Performance; Reduces Overall System Cost Philips Semiconductors today announced the availability of its BiMOS3D process for the design of motion control integrated circuits Integrated circuits Miniature electronic circuits produced within and upon a single semiconductor crystal, usually silicon. Integrated circuits range in complexity from simple logic circuits and amplifiers, about 1/20 in. (1. (ICs) applied in hard disk drives (HDDs). Volume production of ICs using the mixed signal BiMOS3D technology is scheduled to begin in Q4 1999. Combining high voltage The term high voltage characterizes electrical circuits, in which the voltage used is the cause of particular safety concerns and insulation requirements. High voltage is used in electrical power distribution, in cathode ray tubes, to generate X-rays and particle beams, to lateral transistors with intelligent digital functions and analog power components in a single die, BiMOS3D is designed to improve performance and reduce overall system costs. "The need to reduce cost per device and optimize optimize - optimisation mass storage architecture has driven the development of BiMOS3D," said Arnaud Moser, business line marketing manager for motion control ICs. "BiMOS3D can handle high currents, while maintaining process functionality. Philips Semiconductors believes this process represents the best all-around option for HDD (Hard Disk Drive) See hard disk and HDD caddy. HDD - hard disk drive designers and manufacturers because of the combined digital intelligence and analog power processes on a single chip." BiMOS3 produces a type of integrated circuit integrated circuit (IC), electronic circuit built on a semiconductor substrate, usually one of single-crystal silicon. The circuit, often called a chip, is packaged in a hermetically sealed case or a nonhermetic plastic capsule, with leads extending from it for using both bipolar (1) See bipolar transmission. (2) One of two major categories of transistor; the other is "field effect transistor" (FET). Although the first transistors and first silicon chips were bipolar, most chips today are field effect transistors wired as CMOS logic, which and CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes. technologies. Philips Semiconductors has been using BiMOS3 to produce the one-chip TV ICs, which have provided a significant performance increase and cost reduction to TV setmakers. The proven BiMOS3 process has been shipping in volume for two years. While BiMOS3 provides 75 percent of the process required for motion control ICs, it does not address the high power requirements for HDD motion controls, hence the custom development of BiMOS3D. With BiMOS3D, the logic gates are primarily made of CMOS, but the output stages use lateral bipolar DMOS DMOS Double-Diffused Metal-Oxide Semiconductor DMOS Diffusion Metal Oxide Semiconductor DMOS Duty Military Occupational Specialty DMOS Diffusive Mixing of Organic Solutions DMOS Distributed Mature Object Space DMOS Discrete Metal Oxide Semiconductor transistors to accommodate the high current, high voltage and high power requirements associated with controlling HDD disk and arm motors. Performance Specifications BiMOS3D specifications clearly identify the inherent power, speed, high integration and cost trade-offs that distinguish the process. -0-
MAIN FEATURES OF BIMOS3D UNIT VALUE
Mask Count 20
Density Digital Cells Gate/mm(2) 2700
CMOS Effective Gate Length (mu)m 0.5
Bipolar Type V and LNPN, V and LPNP
HV CMOS Type ENMOS, EPMOS
LDMOS Power mOhm.mm(2) less than 35
EN-EPMOS Power mOhm.mm(2) less than 100
Vt LDMOS V 0.9
Diffused Resistance KOhm/sq 2,75
High Ohmic Poly Ohm/sq 220
Capacitor nF/mm(2) 3.86
Zener Diode V 5
BP/BN Isolation YES
IMMUNITY Latch-up Very High
Cross-Talk Very High
ESD PROTECTIONS YES
-0- Pricing and Availability Custom design-ins are underway with samples expected in Q2 1999. Volume production of BiMOS3D ICs is scheduled to begin in Q4 1999. About Philips Semiconductors Philips Semiconductors, Inc., a subsidiary of Philips Electronics North America North America, third largest continent (1990 est. pop. 365,000,000), c.9,400,000 sq mi (24,346,000 sq km), the northern of the two continents of the Western Hemisphere. Corporation and an affiliate of Royal Philips Electronics NV Philips Electronics NV in full Royal Philips Electronics NV Dutch Koninklijke Philips Electronics NV Major Dutch manufacturer of consumer electronics, household appliances, lightbulbs, and imaging equipment. , headquartered in Eindhoven, The Netherlands, is the ninth largest semiconductor supplier in the world. Philips Semiconductors' innovations in digital audio, video and mobile technology position the company as a leader in the consumer, multimedia and wireless communications wireless communications System using radio-frequency, infrared, microwave, or other types of electromagnetic or acoustic waves in place of wires, cables, or fibre optics to transmit signals or data. markets. Sales offices are located in all major markets around the world and are supported by regional customer applications labs. Additional information on Philips Semiconductors can be found on the home page at www.semiconductors.philips.com. |
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