Philips Introduces the World's Smallest Logic IC Package for 14-, 16- and 20-pin Functions; DQFN is Up to 75 Percent Smaller Than Comparable TSSOP Package.

Business Editors/High-Tech Writers

SAN JOSE, Calif.--(BUSINESS WIRE)--April 8, 2002

Royal Philips Electronics (AEX:PHI) (NYSE:PHG) today introduced the world's smallest logic integrated circuit (IC) package. The Depopulated very-thin Quad Flat-pack No-leads (DQFN) package -- for logic gates and octal ICs -- is meant to address the market needs for smaller electronic products and components. The DQFN package enhances miniaturization of the circuit board and frees board space for additional components and functions. Designed with a footprint of 2.5 mm by 3 mm in a 14-pin configuration, the DQFN package is 75 percent smaller than existing TSSOP packages.

Over the years, package technology has continued to move toward a smaller size with expanded functionality. Along with higher density ASIC and ASSP solutions, the reduction in package size has contributed to the dramatic miniaturization of portable and mobile applications. Building on a long track record of creating new and innovative logic solutions, Philips is taking a decisive lead by being the first to bring the DQFN package to market. Philips will leverage its strength in manufacturing, test and assembly to meet market demand for this package.

"Daimler Chrysler's Huntsville Electronics facility is designing the next generation of automotive electronic controllers. With the ever increasing demand to supply these controllers in smaller modules for cost savings and ease of installation in the vehicle, electronic components used on the controllers' printed circuit board had to offer a substantial reduction in size over current surface mount devices, including TSSOP," said Wilman Pidgeon, product engineering supervisor, Huntsville Electronics Facility, Daimler Chrysler. "This was a critical consideration for selecting components in Philips' DQFN package."

"Philips continues to invest to be a leader in IC package innovation and we have set a new benchmark with the DQFN logic package," said Bruce Potvin, director of marketing, Business Line Logic in the semiconductor division of Philips. "With the introduction of the DQFN logic IC package, Philips is well-equipped to support customers looking to develop the next-generation products where miniaturization is essential."

In addition to significant size reduction, the DQFN package also offers improvements in heat dissipation and ease of board assembly. The package incorporates an exposed die paddle, providing a 20 percent improvement in heat dissipation over a comparable TSSOP package. The package does not require leads, thereby eliminating co-planarity and bent-lead issues.

Pricing and Availability

The first products to be released in the DQFN package are the 74AHC14 hex inverter Schmitt trigger, the 74LVC257 Quad 2-Input Multiplexer and the 74LVC244 Octal Buffer/Line Driver. These parts are currently being sampled, and full production will begin in June 2002. In volume quantities of 1,000 pieces or more, the estimated price for the 74AHC14 will be $0.25, the 74LVC257 will be $0.30 and the 74LVC244 will be $0.35. Data sheets and additional information can be found at www.philipslogic.com.

About Philips

Royal Philips Electronics of the Netherlands is one of the world's biggest electronics companies and Europe's largest, with sales of $28.8 billion (EUR 32.3 billion) in 2001. It is a global leader in color television sets, lighting, electric shavers, medical diagnostic imaging and patient monitoring, and one-chip TV products. Its 189,000 employees in more than 60 countries are active in the areas of lighting, consumer electronics, domestic appliances, components, semiconductors and medical systems. Philips is quoted on the NYSE (symbol: PHG), London; Frankfurt, Amsterdam and other stock exchanges. News from Philips is located at www.semiconductors.philips.com.