Browse Pfeil, Charles

1-14 out of 14 article(s)

Title	Date	Words
Top 10 BGA breakout tips: a look back at the most important ideas for fanout and routing of BGAs.	Feb 1, 2009	840
Looking forward: PCB footprints for mobile chipsets.	Jan 1, 2009	594
Pin-pitch under 0.8 mm: fine-pitch BGAs dramatically increase in pin count and will drive adoption of HDI.	Dec 1, 2008	715
0.8-mm pin pitch BGAs, Part 3: any-layer vias can be stacked to span any set of layers.	Nov 1, 2008	650
Routing 0.8-mm pin pitch BGAs, part 2: microvias can reduce the number of signal layers required.	Oct 1, 2008	520
The 0.8mm pin pitch BGAs, Part 1: microvias reduce layer count when routing high pin count BGAs.	Sep 1, 2008	758
Layer-biased escapes: effective fanout patterns increase route density and enable the fewest number of layers while meeting other design constraints.	Aug 1, 2008	749
Routing BGA fanout Patterns by PCB region: routing high pin count BGAs contributes to increased layer count, but maximizing route density by region using blind and buried vias can reverse the trend.	Jul 1, 2008	727
Fanout patterns, Part 4: creating effective fanout patterns for microvias in an HDI stackup.	Jun 1, 2008	741
Fanout patterns, Part 3: aligning blind via fanout patterns can significantly increase route density.	May 1, 2008	821
Fanout patterns, part 2: through-vias provide the lowest fabrication cost but can limit routing density.	Apr 1, 2008	933
Fanout patterns, part 1: successful fanout solutions provide escape routing for a combination of serial and parallel nets.	Mar 1, 2008	658
Size matters: next generation ASIC and FPGA packages with 0.8-mm pitch and over 2,000 pins will require the use of HDI to accomplish BGA routing.	Feb 1, 2008	942
BGA breakouts and routing: BGA miniaturization amplifies the design challenge of balancing high-performance signal integrity with fabrication cost reduction.	Jan 1, 2008	922