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Browse Parker, J. Lee

1-2 out of 2 article(s)
Title Type Date Words
An analytical characterization of PCB delamination and comparison of adhesion tests: how the double lap joint tops the peel strength and T260 methods. Aug 1, 2006 2007
Buried capacitor analysis: the use of blind microvias--and multiples of vias--can help reduce the discharge time of sheet capacitors. Jun 1, 2006 1623

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