Palomar Wins Global Technology Award for its Precision Gold Wire Bonder and Ball Bumper.CARLSBAD, Calif. -- Palomar Technologies, leader in precision automation equipment and process development for microelectronic assembly, announced it has received a 2005 Global Technology Award. The award is given by Global SMT (1) (Surface Mount Technology) See surface mount. (2) (Station ManagemenT) An FDDI network management protocol that provides direct management. Only one node requires the software. SMT - Station Management & Packaging magazine to recognize the best new innovations in the printed circuit assembly and packaging industries. Palomar won the award for its Model 8000 gold wire bonder and gold ball bumper. The award was presented at a ceremony held during Productronica in Munich, Germany, on November 16, 2005. The Model 8000 is a gold ball-and-stitch thermosonic wire bonder for complex, precision interconnects where flexibility, ease of programming, and high throughput are desired. Applications such as complex multichip applications, high I/O (Input/Output) The transfer of data between the CPU and a peripheral device. Every transfer is an output from one device and an input to another. See PC input/output. I/O - Input/Output count devices, and gold ball bumping for flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done , MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. , and high frequency, fine pitch applications are addressed by the Model 8000. Palomar's single process co-planar gold bumper is the only machine that can produce planarized (bumps with a flat top and consistent programmable height) gold bumps in one step. An industry-best finished bond height consistency of +/-2 microns (at 3 sigma) is achieved with 2.5-micron placement accuracy. Additionally, gold wires and gold bumps provide a viable interconnection alternative where lead-free processes are mandated. "This was the first year of the Global Technology Awards and we were surprised by the large number of entries," said Global SMT & Packaging editor-in-chief Trevor Galbraith. "We had judges from China, Europe, and the United States United States, officially United States of America, republic (2005 est. pop. 295,734,000), 3,539,227 sq mi (9,166,598 sq km), North America. The United States is the world's third largest country in population and the fourth largest country in area. . It was truly an international awards contest celebrating the best technologies in the electronics industry." "We were very pleased to receive this Global Technology Award for our Model 8000 gold wire bonder and ball bumper, and we want to thank Trevor and his staff at Global SMT and Packaging for their diligent work putting this award competition together," said Palomar Technologies COO Bruce Hueners. "This is one of several awards the Model 8000 has received this year, providing ample evidence of the high quality and unique features it offers to companies requiring accuracy, precision, and low cost of ownership for their ball bumping and wire bonding Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The wire is generally made up of one of the following:
About Palomar Technologies Palomar Technologies, established in 1975 as part of Hughes Aircraft Hughes Aircraft Company was a major aerospace and defense company founded by Howard Hughes. The group was based near Ballona Creek, in Culver City, California, USA, on the Pacific Coast. Hughes Aircraft was acquired by General Motors in 1985. Company, has been an independent company since 1995. It is a leading supplier of automated high-precision assembly systems that increase yield and lower costs for manufacturers of optoelectronics, RF and microelectronic packages in the photonic, wireless, microwave, automotive, aerospace, medical and RF/ID See RFID. industries and markets. Processes include high accuracy component assembly with eutectic solder, epoxy epoxy Any of a class of thermosetting polymers, polyethers built up from monomers with an ether group that takes the form of a three-membered epoxide ring. The familiar two-part epoxy adhesives consist of a resin with epoxide rings at the ends of its molecules and a curing , or laser attach, precision ball and wedge bonding, and active optical align and attach. Palomar's Process Development and Prototyping Services assists companies in developing or validating new products by providing design, engineering, prototyping, assembly, and automation expertise, as well as metrology resources to bridge the gap between product concept and automated production. |
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