Palomar Technologies Offers Thermosonic Die Attach Services for Flip Chip Applications.Business Editors/High-Tech Writers VISTA, Calif.--(BUSINESS WIRE)--Sept. 30, 2003 Palomar Technologies, a leading manufacturer of automated, high-precision assembly systems, now offers thermosonic die attach services. Although companies performing gold stud bumping may have epoxy epoxy Any of a class of thermosetting polymers, polyethers built up from monomers with an ether group that takes the form of a three-membered epoxide ring. The familiar two-part epoxy adhesives consist of a resin with epoxide rings at the ends of its molecules and a curing or thermocompression bonding capabilities, few can also perform thermosonic die attach. This method is preferred for dies that are thin, brittle (such as RF devices or MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. ), or intolerant of high heat, because application of ultrasonic energy may reduce the need for heat and force. This interconnect method is an alternative to solder solder (sŏd`ər), metal alloy used in the molten state as a metallic binder. The type of solder to be used is determined by the metals to be united. Soft solders are commonly composed of lead and tin and have low melting points. Hard solders (i. reflow (1) The process of heating and melting the solder that has been screen printed onto a printed circuit board in order to bond chips and other components to the board. Surface mount chips (SMT) use the reflow method. Contrast with wave soldering. See also reflowable text. and improves thermal and electrical conductivity. The process is used with gold stud bumping for flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done applications. In thermosonic bonding, there are no adhesives used to join the die and the package. Instead, ultrasonic vibration, heat and force are applied to the die. The gold bumps are forced against their opposing pads and a second metallic bond metallic bond: see chemical bond; metal. is formed where the bump comes into contact with the package metallization Met`al`li`za´tion n. 1. The act or process of metallizing. . In this case, a second bond is created which is similar to the first bond created by the ball bonder during the stud bump process. The top and the bottom connection of the stud bump will be nearly identical, constituting a true metal-to-metal connection. In this process, an ultrasonic transducer transducer, device that accepts an input of energy in one form and produces an output of energy in some other form, with a known, fixed relationship between the input and output. is used to introduce another form of energy to the bonding process. Thermosonic bonding is available through Palomar's Process Development and Prototyping Services. Palomar established this service to meet the needs of companies looking to develop or validate new products, but who require the design, engineering, prototyping, assembly and automation expertise, and/or metrology resources to bridge the gap between product concept and automated production. Palomar can do both stud bumping and precision attachments (+/- 10 micron placements) in house for quick-turn processing. In addition, Palomar offers a wide variety of metrology services, including SEM, elemental analysis Elemental analysis is a process where a sample of some material (e.g., soil, waste or drinking water, bodily fluids, minerals, chemical compounds) is analyzed for its elemental and sometimes isotopic composition. , X-Ray microscopy, Scanning Acoustic Microscopy, and wire and die shear testing. All work is done at Palomar's Vista, California headquarters. About Palomar Technologies Palomar Technologies, established in 1975 as part of Hughes Aircraft Hughes Aircraft Company was a major aerospace and defense company founded by Howard Hughes. The group was based near Ballona Creek, in Culver City, California, USA, on the Pacific Coast. Hughes Aircraft was acquired by General Motors in 1985. Company, has been an independent company since 1995. It is a leading supplier of automated high-precision assembly systems that increase yield and lower costs for manufacturers of optoelectronic, RF and microelectronic packages in the photonic Dealing with light (photons). See photon and photonics. , wireless, microwave, automotive, aerospace, medical and life sciences industries. Processes include high accuracy component assembly with eutectic solder, epoxy, or laser attach, precision ball and wedge bonding, and active optical align and attach. Palomar's Process Development and Prototyping Services assists companies in developing or validating new products by providing design, engineering, prototyping, assembly and automation expertise, as well as metrology resources to bridge the gap between product concept and automated production. For more information, visit www.palomartechnologies.com or contact 760-931-3600. For more information, contact the Palomar office in your area: Palomar Technologies Inc. Palomar Technologies Pte Ltd Tricia McGough Wai Seng Chew 2230 Oak Ridge Way 192 Pandan Loop #07-08/09 Vista, CA 92083 Singapore 128381 Phone: 760-931-3440 Phone: (65) 6779 2766 Fax: 760-931-3444 Fax: (65) 6779 7939 tmcgough@bonders.com wschew@bonders.com Palomar Technologies GmbH A-R Marketing Inc. Josef Schmidl Andrea Roberts Am Weichselgarten 30 b PO Box 501528 91058 Erlangen, Germany San Diego, CA 92150 Phone: 49-9131-48009-30 Phone: 858-451-8666 Fax: 49-9131-48009-55 Fax: 858-451-8777 jschmidl@bonders.com aroberts@san.rr.com Editors Note: Download the accompanying graphic at http://www.bonders.com/news/press_releases/download.htm |
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