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PTC nabs DARPA 3-D IC grant.


Needham, MA -- The Defense Advanced Research Projects Agency Defense Advanced Research Projects Agency (DARPA), U.S. government agency administered by the Department of Defense (see Defense, United States Department of). , the central research and development organization for the U.S. Defense Department has selected PTC (PTC, Needham, MA, www.ptc.com) Long a world leader in mechanical computer-aided design, manufacturing and engineering software, PTC, through acquisitions and reorganization, has transformed itself into a leading provider of Internet-based B2B solutions for discrete manufacturers.  as the prime contractor for a research project to deliver 3-dimensional integrated circuit integrated circuit (IC), electronic circuit built on a semiconductor substrate, usually one of single-crystal silicon. The circuit, often called a chip, is packaged in a hermetically sealed case or a nonhermetic plastic capsule, with leads extending from it for  design management capabilities.

Reportedly, key to DARPA's decision was PTC's (ptc.com) history of working with commercial and military electronics companies to improve their product development processes by producing higher quality, lower-cost products that can be delivered in a shorter timeframe.

As part of this multimillion dollar, multiyear funded research project, PTC has subcontracted with Raytheon and North Carolina State University History

Main article: History of North Carolina State University
The North Carolina General Assembly founded NC State on March 7, 1887 as a land-grant college under the name North Carolina College of Agriculture and Mechanic Arts.
. PTC and its partners plan to deliver three main components of the IC research project including design process management, design collaboration and design tool integration. Specifically, PTC will provide:

* Product development process management and design collaboration solutions.

* Mechanical and thermal analysis Thermal analysis is a branch of materials science where the properties of materials are studied as they change with temperature. Techniques include:
  • Differential scanning calorimetry
  • Dynamic mechanical analysis
  • Thermomechanical analysis
 of these next generation ICs.

* Information extraction and visualization.

* Integration to third-party design and analysis applications.

As subcontractors, NC State will offer IC design and Raytheon will provide analysis and testing.

Edited by Mike Buetow
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Title Annotation:Industry NEWS
Author:Buetow, Mike
Publication:Circuits Assembly
Date:Feb 1, 2005
Words:173
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