PMC-Sierra and TDK Semiconductor Deliver Interoperable Framers and Interface Transceivers for DS3, E3 Applications.

Business Editors, High-Tech Writers

BURNABY, British Columbia & TUSTIN, Calif.--(BUSINESS WIRE)--Dec. 11, 2001

PMC-Sierra (Nasdaq:PMCS) and TDK Semiconductor today announced a marketing collaboration to deliver a complete physical layer solution for DS3, and E3 applications.

The solution features PMC-Sierra's comprehensive TEMUX(TM) and S/UNI(R) product families working seamlessly with TDK Semiconductor's family of DS3/E3 line interface units (LIU) for routers, multi-service switches, DSLAMs, digital cross-connects and SONET/SDH add/drop multiplexers. A number of complete reference designs are available to reduce the development efforts and improve time-to-market for equipment requiring DS3 and E3 rate support.

"This relationship allows both companies to offer a certifiably interoperable subsystem to our common customer base, " said Jeff Brown, marketing director of PMC-Sierra's Access Products Division. "System designers are constantly faced with the need to rapidly develop new communications interfaces for their routers and transport systems. PMC-Sierra and TDK Semiconductor's bundled solution simplifies a large part of a system design."

"The collaboration between TDK Semiconductor and PMC-Sierra formalizes a relationship we've shared for several years. It now enables our customers to implement a guaranteed compatible solution comprised of best-in-class silicon," said Andy Mills, senior vice president for TDK Semiconductor's Broadband Communications Products. "The combination of our low-power line interface transceiver and PMC-Sierra's framer devices will provide our customers with the optimal solution for equipment that bridges the gap between traditional copper and emerging optical networks."

About PMC-Sierra's DS3/E3 and SONET/SDH Framers

PMC-Sierra markets the widest array of framers available, including the recently introduced PM4328 TECT3(TM), the newest member of the TEMUX(TM) product family that is optimized for channelized DS3 applications. The TECT3 integrates 28 T1/J1 framers, 21 E1 framers and a DS3 framer/multiplexer in a single device. This enables a high-density DS3 copper interface solution that supports the global requirements for framing and multiplexing different tributary formats into a DS3 signal. The PM8316 TEMUX-84(TM) supports the global requirements for framing, T1, E1, T3, E3 channels. In addition, it supports mapping and multiplexing of T1, E1 and T3 channels into SONET/SDH services. For DSLAM applications, the PM7347-BI S/UNI-JET(TM) works seamlessly with PMC-Sierra's extensive line of ATM products including the Vortex DSLAM chip set, the S/UNI-ATLAS OAM and policing chip and the QRT/QSE switching chip set. In addition, the S/UNI-JET is software and pin-compatible with the S/UNI-QJET, PMC-Sierra's quad-channel J2, E3, and T3 solution.

About TDK Semiconductor's Line Interface Unit (LIU) Transceivers

TDK Semiconductor is established as the world's leading supplier of DS3/E3 LIU transceivers, with millions of ports shipped during the last two years. TDK Semiconductor has continued to enhance the legacy of its industry-standard single chip line interface transceivers first introduced in 1992 with the 78P7200. In May 1998, the 78P2241, operating at both 3.3 V and 5 V power supply voltage with a clock recovery and transmitter pulse shaping function was added to the lineup. In May 2000, the company released the 78P7200L, the world's lowest-power, single-channel T3/E3 LIU, with a typical power dissipation of 230mW @ 3.3V.

In January 2001, TDK Semiconductor introduced the 78P2241B, adding a line-code violation (LCV) detector to the feature set first available with the 78P2241. Earlier this year, the company marketed the broadest lineup of multiport transceivers in the industry. Two new families of multiport DS3/E3/STS-1 transceiver devices are now available, adding dual, triple and quad port options to our current product offerings. These devices extend the families of the popular 78P7200L and 78P2241B single port devices.

About PMC-Sierra

PMC-Sierra is accelerating the broadband revolution. PMC-Sierra is a leading provider of high-speed broadband communications semiconductors and MIPS-based processors for Access, Metro Transport and Optical Transport network equipment that make up the backbone of the Internet. The company offers worldwide technical and sales support, including a network of offices throughout North America, Europe and Asia. The company's quality system is registered with the Quality Management Institute to the ISO 9001 standard. As co-founder of the SATURN(R) Development Group, PMC-Sierra works with over 30 other member companies to define and develop interoperable, standard-compliant solutions for high speed networking applications.

PMC-Sierra is included in the S&P 500 Index which consists of 500 stocks chosen for market size, liquidity, and industry group representation and in the Nasdaq-100 Index (NDX) which contains the largest non-financial companies on the Nasdaq Stock Market and. PMC-Sierra is publicly traded on the Nasdaq Stock Market under the PMCS symbol. For more information about PMC-Sierra, visit http://www.pmc-sierra.com.

About TDK Semiconductor

TDK Semiconductor, part of the $ 5.6 billion TDK Corporation (NYSE:TDK), is a leader in advanced technology IC solutions for communications markets. The company designs and manufactures semiconductor solutions for broadband infrastructure, local access and consumer access applications. Its products are used globally for connectivity and data acquisition. Additional product information and the name of your closest representative can be obtained by visiting the company's web site at http://www.tdksemiconductor.com, sending an e-mail to [e-mail] or by calling 714/508-8800.

Attachments:

Figure 1: ADM Channelized DS3 Line Card

Figure 2: DS3 Terminal Mux

Figure 3: DSLAM

To view figures 1, 2 and 3, go to http://www.pmc-sierra.com/tdk.