PMC-SIERRA AND TDK SEMICONDUCTOR DELIVER INTEROP FRAMERS AND INTERFACE TRANSCEIVERS FOR DS3, E3 APPS.

PMC-Sierra (Nasdaq:PMCS) and TDK Semiconductor recently announced a marketing collaboration to deliver a complete physical layer solution for DS3, and E3 applications.

The solution features PMC-Sierra's comprehensive TEMUX and S/UNI product families working seamlessly with TDK Semiconductor's family of DS3/E3 line interface units (LIU) for routers, multi-service switches, DSLAMs, digital cross-connects and SONET/SDH add/drop multiplexers. A number of complete reference designs are available to reduce the development efforts and improve time-to-market for equipment requiring DS3 and E3 rate support.

"This relationship allows both companies to offer a certifiably interoperable subsystem to our common customer base, " said Jeff Brown, marketing director of PMC-Sierra's Access Products Division. "System designers are constantly faced with the need to rapidly develop new communications interfaces for their routers and transport systems. PMC-Sierra and TDK Semiconductor's bundled solution simplifies a large part of a system design."

"The collaboration between TDK Semiconductor and PMC-Sierra formalizes a relationship we've shared for several years. It now enables our customers to implement a guaranteed compatible solution comprised of best-in-class silicon," said Andy Mills, senior vice president for TDK Semiconductor's Broadband Communications Products. "The combination of our low-power line interface transceiver and PMC-Sierra's framer devices will provide our customers with the optimal solution for equipment that bridges the gap between traditional copper and emerging optical networks."