PDF Solutions(R) and FEI Company Release Powerful New Semiconductor Defect Analysis Solution.SAN JOSE San Jose, city, United States
San Jose (sănəzā`, săn hōzā`), city (1990 pop. 782,248), seat of Santa Clara co., W central Calif.; founded 1777, inc. 1850. , Calif. -- Integration of PDF Solutions PDF Solutions (NASDAQ: PDFS) is a developer for process-design integration technologies for integrated circuits (ICs). They have especially specialized in deep sub-micrometre designs. CV(R) Infrastructure and FEI FEI
Fédération Équestre Internationale. Advanced DA 300HP DualBeam(TM) Helps Semiconductor Manufacturers Accelerate Yield Learning
PDF Solutions, Inc. (Nasdaq:PDFS), the leading provider of semiconductor process-design integration technologies and services, and FEI Company FEI Company (NASDAQ: FEIC), founded in 1971, is a supplier of electron microscopy tools to researchers, developers and manufacturers working on the nanoscale.
FEI's tools include ion and electron-beam technologies that enable users to characterize, analyze and , the industry leader in Tools for Nanotech(TM), announced the successful integration of the PDF Solutions Characterization Vehicle(R) (CV) infrastructure (CVi) and the FEI Defect Analyzer (DA) 300HP next-generation DualBeam system for automated in-fab defect analysis (programming) defect analysis - Using defects as data for continuous quality improvement. Defect analysis generally seeks to classify defects into categories and identify possible causes in order to direct process improvement efforts. . The first combined solution was recently delivered to a global, U.S.-based developer and foundry of advanced microprocessor devices.
The new, integrated flow accelerates yield ramps of deep sub-micron semiconductors by speeding root cause analysis of defects. This gives customers better control over advanced processes along with improved yields, reduced time-to-market, and significantly reduced process development costs. In the integrated flow, PDF Solutions short-flow CV test chips are run through the factory, where electrical tests are performed to identify non-visual, sub-surface failures. Once the CV analysis software identifies failures, it works in conjunction with the voltage contrast capabilities of the FEI DA 300HP to precisely localize lo·cal·ize
v. lo·cal·ized, lo·cal·iz·ing, lo·cal·iz·es
1. To make local: decentralize and localize political authority.
2. the failures (both opens and shorts) on the wafer to within a fraction of a micron. Defects are then automatically cross-sectioned by the DA 300HP, resulting in a detailed sub-surface image of the relevant failure location and the failing structure. The image allows engineers to more rapidly and accurately identify the cause of failures and validate potential process changes to determine those which reduce failure-rates to an acceptable level.
"As recognized in the yield roadmap outlined in the latest International Technology Roadmap for Semiconductors The International Technology Roadmap for Semiconductors is a set of documents produced by a group of semiconductor industry experts. These experts are representative of the sponsoring organisations which include the Semiconductor Industry Associations of the US, Europe, Japan, (ITRS ITRS International Technology Roadmap for Semiconductors
ITRS International Terrestrial Reference System
ITRS International Transaction Reporting System (EU)
ITRS International Technical Rescue Symposium ), capturing, identifying, analyzing, and resolving non-visual defects and yield-detracting systematic mechanisms are major challenges faced by the semiconductor industry," said professor Andrzej Strojwas, chief technologist at PDF Solutions. "Having participated in more than 30 deep sub-micron process development and ramp projects -- more than 12 at the 90nm to 45nm nodes -- PDF Solutions recognized that working with FEI could help to successfully address these challenges."
PDF Solutions addresses the challenges of non-visual defects through its CVi, which provides a comprehensive set of test chip designs that contain a broad range of experiments aimed at identifying process-design yield sensitivities. The short-flow CV test chips are combined with a parallel fast tester and dedicated analysis software. The CVi greatly reduces the time to identify yield detractors and evaluate potential process fixes. This is because manufacturing a short-flow CV test chip requires only a fraction of the 90 or more days required to manufacture and electrically test a full-flow product wafer.
"At FEI, we understand our customer's requirements to rapidly acquire three-dimensional defect data and images," commented Matt Harris, vice president of worldwide marketing for FEI. "By integrating the DA 300HP with the PDF Solutions CVi, we are providing our customers even faster access to that data."
FEI's DA 300HP is a highly automated, in-fab 300 mm DualBeam (FIB/SEM) that is critical for yield-limiting defect identification, in-line module qualification, and defect and process marginality correlation. Utilizing Automatic Defect Redetection and Cross-Sectioning (ADR/ADX) along with Slice and View(TM), the DA 300HP is able to provide statistically significant root cause data. The FEI DA 300HP brings 3D defect diagnostics into semiconductor fabs See fab. to rapidly deliver critical process data and keep processes in control.
Traditional methods of defect cross sectioning -- where failures are identified on a product or an SRAM See static RAM.
SRAM - static random-access memory wafer that is then sent offsite for analysis -- has introduced a bottleneck A lessening of throughput. It often refers to networks that are overloaded, which is caused by the inability of the hardware and transmission lines to support the traffic. It can also refer to a mismatch inside the computer where slower-speed peripheral buses and devices prevent the CPU in the sequence of yield improvement activities. The DA 300HP helps eliminate such bottlenecks by combining voltage contrast and defect cross-sectioning in one tool, and enabling customers to perform these critical activities faster on the manufacturing floor. The new methodology is designed to reduce failure analysis time by several days compared with traditional flows.
About PDF Solutions
PDF Solutions, Inc. (Nasdaq:PDFS) is the leading provider of process-design integration technologies for manufacturing integrated circuits Integrated circuits
Miniature electronic circuits produced within and upon a single semiconductor crystal, usually silicon. Integrated circuits range in complexity from simple logic circuits and amplifiers, about 1/20 in. (1. (ICs). PDF Solutions software, methodologies, and services enable semiconductor companies to create IC designs that can be more easily manufactured using manufacturing processes that are more capable. By simulating deep sub-micron product and process interactions, the PDF (Portable Document Format) The de facto standard for document publishing from Adobe. On the Web, there are countless brochures, data sheets, white papers and technical manuals in the PDF format. solution offers clients reduced time to market, increased IC yield and performance, and enhanced product reliability and profitability. Headquartered in San Jose, Calif., PDF Solutions operates worldwide with additional offices in Europe and Japan. For the company's latest news and information, visit www.pdf.com.
FEI's Tools for Nanotech(TM), featuring focused ion- and electron-beam technologies, deliver 3D characterization, analysis and modification capabilities with resolution down to the sub-Angstrom level and provide innovative solutions for customers working in NanoResearch, NanoElectronics and NanoBiology. The company's products for NanoElectronics address a robust set of both fab- and lab-based applications including 3D metrology and defect analysis, mask repair and circuit edit. With R&D centers in North America North America, third largest continent (1990 est. pop. 365,000,000), c.9,400,000 sq mi (24,346,000 sq km), the northern of the two continents of the Western Hemisphere. and Europe, and sales and service operations in more than 40 countries around the world, FEI is bringing the nanoscale At nanometer size. Any device only a few nanometers in size is nanoscale. See nanotechnology and nanometer. within the grasp of leading researchers and manufacturers and helping to turn some of the biggest ideas of this century into reality. More information can be found on the FEI website at: http://www.feicompany.com.
PDF Solutions, the PDF Solutions logo, Characterization Vehicle, and CV are registered trademarks of PDF Solutions, Inc.
DualBeam, Tools for Nanotech, and Slice and View are trademarks of FEI Company.