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PCB Design Conference West.

CONFERENCE: MARCH 25-30, 2007 EXHIBITION: MARCH 27-28, 2007 Santa Clara Santa Clara, city, Cuba
Santa Clara (sän`tä klä`rä), city (1994 est. pop. 217,000), capital of Villa Clara prov., central Cuba.
 Convention Center in santa Clara, CA

The premier conference and exhibition for PCB PCB: see polychlorinated biphenyl.
 in full polychlorinated biphenyl

Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound.
 engineering, design and manufacture professionals

Join your industry peers at PCB Design Conference West 2007, where you'll learn from the PCB design industry's top speakers, be inspired by new ideas "New Ideas" is the debut single by Scottish New Wave/Indie Rock act The Dykeenies. It was first released as a Double A-side with "Will It Happen Tonight?" on July 17, 2006. The band also recorded a video for the track.  and technologies, find solutions for your toughest design issues, network with the industry's movers and shakers Shakers, popular name for members of the United Society of Believers in Christ's Second Appearing, also called the Millennial Church. Members of the movement, who received their name from the trembling produced by religious emotion, were also known as Alethians. , and meet face-to-face with your vendors and suppliers.

Utilizing input from PCB West conference alumni, speakers and exhibitors, we've put together an amazing a·maze  
v. a·mazed, a·maz·ing, a·maz·es
1. To affect with great wonder; astonish. See Synonyms at surprise.

2. Obsolete To bewilder; perplex.

 PCB design training, networking and technology information gathering experience that's second to none in the PCB design industry. From the moment you arrive until you head for home, you'll be surrounded by a brain trust of industry experts who not only will understand your toughest design issues but who can show you how to solve them. No other conferences deliver the kind of targeted experience that you'll enjoy at PCB West 2007. If you engineer or design PCBs or related technologies and you can only attend one conference a year, choose the conference that truly focuses on your personal goals and professional needs: PCB West 2007.


Every designer's dilemma is how to become a better and more confident designer without making costly design mistakes or overlooking technological advances. At PCB West 2007, we've tailored our conference program to match your needs. Create your own personalized per·son·al·ize  
tr.v. per·son·al·ized, per·son·al·iz·ing, per·son·al·iz·es
1. To take (a general remark or characterization) in a personal manner.

2. To attribute human or personal qualities to; personify.
 educational experience by choosing from:

* An unparalleled Professional Development Certificate Program consisting of two Design Excellence Curriculum two-day courses and eight full-day tutorials--all taught by top industry speakers (see the DEC and tutorial courses on pages 6-7).

* A diverse and targeted three-day Technical Conference Program of more than 26 short courses made up of two-hour workshops to half-day seminars (see pages 8-11).

* A FREE Tuesday program of 14 technical sessions (see page 8-10) that are totally free for all attendees. Seating is first-come first-served, so get there early!

* A variety of registration options, including, our 5-Day Special Value Passport Package (31.5 hours of in-depth instruction plus FREE Tuesday sessions for only $1,395 if you register before the Early- Bird Deadline).


What if your skills and ideas could save your company time and money on a future product? PCB West 2007 is chocked full of time-saving and cost-cutting ideas, design and manufacture strategies, and information about new technologies that will continue to inspire you for months after attending this year's conference.


Hundreds of PCB engineering, design and manufacture professionals attend PCB West each year specifically to find technological solutions for a wide range of projects and problems. You should be there, too--especially if you specify, recommend or approve the purchase of PCB design or manufacturing products and services for your company.


PCB West attendees consistently tell us that networking is a top priority. That's why we provide you with a variety of opportunities to network with the industry's movers and shakers--including other conference and expo-only attendees, speakers, exhibitors, industry press and even UP Media Group staff.


Huge wide-ranging trade shows might have more exhibitors, but it's exhausting to search the floor for the handful of exhibitors that apply to you. The show floor at PCB West 2007 features only the vendors that are applicable to our attendees, and on a show floor that is just the right size. PCB West also provides the perfect setting and atmosphere for those all important product demos and vendor meetings, so start planning your visit to the show floor now.

We look forward to seeing you in Santa Clara! The Conference Co-Chairs

sunday, March 25-Monday, March 26

Sponsored by Printed Circuit Design & Manufacture magazine

PCBTop Gun Hall of Fame Contest

If you have the talent, expertise and knowledge to solve the most challenging PCB design problems, we're looking for Looking for

In the context of general equities, this describing a buy interest in which a dealer is asked to offer stock, often involving a capital commitment. Antithesis of in touch with.
 you. Held annually at PCB West, the PCB Top Gun Hall of Fame contest endeavors to find the top designers in the world. During two days of competition at PCB West, participants are put through a battery, of tests, including a written exam, personal interviews, and an actual design. The top scorer(s) at each show are inducted into the PCB Top Gun Hall of Fame and receive a plaque, and a coveted cov·et  
v. cov·et·ed, cov·et·ing, cov·ets
1. To feel blameworthy desire for (that which is another's). See Synonyms at envy.

2. To wish for longingly. See Synonyms at desire.
 leather flight jacket The flight jacket, or bomber jacket is a garment originally created for pilots, which eventually became part of popular culture and apparel. In the First World War most airplanes did not have an enclosed cockpit, which necessitated a garment that could keep pilots  from Avirex. All participants receive free admission to the three-day technical conference. For more information, visit

Sunday, March 25

Sponsored by Printed Circuit Design & Manufacture

Professional Development Attendee Welcome Luncheon

12-1 pm in the Cypress Room

Sunday Professional Development Certificate Program attendees will enjoy a complimentary plated luncheon--complete with dessert and coffee--while conversing and networking with their peers and speakers. Plus, PCD&M Editor Kathy Nargi-Toth will moderate a panel session during the last half of the luncheon. Details will be announced at a later date on

Monday, March 26

Sponsored by Printed Circuit Design & Manufacture

Wine and Cheese Mixer 5:15-6:15 pm at the Hyatt Pool Patio

All Monday conference attendees and speakers are invited to attend a special onehour reception, featuring free wine, cheese and other non-alcoholic beverages
See also:
A non-alcoholic beverage is a beverage that contains no alcohol. Such drinks are generally drunk for refreshment, or to quench people's thirst.
. During the Wine and Cheese Mixer, you'll get to know your fellow attendees, pick the brains of our speakers, meet the Printed Circuit Design & Manufacture staff, and just decompress To restore compressed data back to its original size.

(compression, data) decompress - To reverse the effects of data compression.
 after an intense day in class.

Tuesday March 21

FREE Tuesday

8 am-11 pm in the exhibit hall and other rooms as noted

On FREE Tuesday, everything is totally free for all attendees, speakers and exhibitors! FREE Tuesday includes all of the technical sessions listed for Tuesday, March 27 on pages 8-10 of this brochure, the Keynote Address keynote address
An opening address, as at a political convention, that outlines the issues to be considered. Also called keynote speech.

Noun 1.
 described below, the Exhibitor Presentations that will be announced at a later date, and the Opening Night Networking Extravaganza.

Keynote Address

8-9 am in the SCCC SCCC Suffolk County Community College
SCCC Seattle Central Community College (Seattle, WA, USA)
SCCC Sussex County Community College (New Jersey)
SCCC Students for Concealed Carry on Campus

Cross Currents: Where PCB Design Meets ICs and Hardware

Speaker: Henry Potts, vice president and general manager of the Systems Design Division at Mentor Graphics Mentor Graphics, Inc (NASDAQ: MENT) is a US-based multinational corporation dealing in electronic design automation (EDA) for electrical engineering and electronics, as of 2004, ranked third in the EDA industry it helped create.  Corp.

The demands for increasingly competitive products are driving the electronics industry, to advanced PCB fabrication fabrication (fab´rikā´shn),
n the construction or making of a restoration.
 technologies, the use of innovative design methods to cut cycle time and reduce product costs, and expansion of design team collaboration outside of the PCB space. Potts will discuss industry trends such ms company and market globalization globalization

Process by which the experience of everyday life, marked by the diffusion of commodities and ideas, is becoming standardized around the world. Factors that have contributed to globalization include increasingly sophisticated communications and transportation
, outsourcing, and new manufacturing technologies. He will cite examples of how the EDA (1) (Electronic Design Automation) Using the computer to design, lay out, verify and simulate the performance of electronic circuits on a chip or printed circuit board.  industry is developing new technologies to meet these challenges and specific examples of future development directions both within the PCB design space and extended into IC-to-PCB and electro-mechanical design team collaboration.

Henry Potts joined Mentor Graphics in March 1999 as vice president and general manager of the Systems Design Division. He has more than 33 years of experience in the electronic industry, including experience in IC and systems development to serving as president and CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board.  of a VC-funded startup. He was senior vice president for Hitachi Semiconductor, where he oversaw all marketing and product development activities for microprocessor and embedded Inserted into. See embedded system.  products for the U.S. He also has held senior management positions at Motorola, VLSI Technology VLSI Technology, Inc was a company which designed and manufactured custom and semi-custom ICs. The company was based in Silicon Valley, with headquarters at 1109 McKay Drive in San Jose, California. , Schlumberger and Texas Instruments See TI.

(company) Texas Instruments - (TI) A US electronics company.

A TI engineer, Jack Kilby invented the integrated circuit in 1958. Three TI employees left the company in 1982 to start Compaq.
. Ports has a bachelor's in electrical engineering electrical engineering: see engineering.
electrical engineering

Branch of engineering concerned with the practical applications of electricity in all its forms, including those of electronics.
 from the University of Southwestern Louisiana.

Day 1 of the Two-Day Exhibition

12-7 pm in the Exhibit Hall

Start planning now so you'll have plenty of time to attend both days of our free two-day product and service exhibition.

Cyber Cafe

12-6:30 pm in the Exhibit Hall

Maximize the time you have to visit the show floor and meet with exhibitors by checking your e-mail in the conveniently located and free Cyber Cafe on the show floor.

Opening Night Networking Extravaganza

6-11 pm

Happy Hour, 6-7 pm in the Exhibit Hall Network with your peers, speakers and exhibitors while enjoying free beer, wine and sodas and tasty food.

Casino Night
For the episode of The Office, see "Casino Night (The Office episode)".

A Casino Night (also called Vegas Nights, Las Vegas Night, Monte Carlo Night) is an entertainment event with a casino theme.
, 8-11 pm in the Santa Clara Ballroom at the Hyatt Regency

Viva Las Vegas Las Vegas (läs vā`gəs), city (1990 pop. 258,295), seat of Clark co., S Nev.; inc. 1911. It is the largest city in Nevada and the center of one of the fastest-growing urban areas in the United States. ! Back by popular demand, we're once again bringing Las Vegas style action to Santa Clara with our professionally run casino event, featuring realistic craps craps: see dice.

Gambling game in which each player in turn throws two dice, attempting to roll a winning combination. The term derives from a Louisiana French word, crabs, which means “losing throw.
, roulette roulette (rlĕt`), game of chance popular in gambling casinos, and in a simplified form elsewhere. In gambling houses the roulette wheel is set in an oblong table. , blackjack blackjack, one of the world's most widely played gambling card games; also known as twenty-one or vingt-et-un. Despite contesting claims between the French and Italians, its origins are unknown.  and a special Texas Hold 'Era Tournament. Not a gambler? No worries! You'll be playing with Casino Night "funny money" and each dealer will teach you all you need to know. This year, you'll have a chance to win some exciting door prizes throughout the evening and the winner of the Texas Hold 'Em Texas hold 'em (also hold'em, holdem) is the most popular poker variant played in casinos in the United States.[1] Hold'em is a community card game where each player may use any combination of the five community cards and their own two hole cards  Tournament (which is seated first-come, first-serve) will win a great prize.

Dawg House Lounge, 8-11 pm in the Lawrence Room at the Hyatt Regency

Whenever you need a break from the exciting Casino Night action, wander into the adjoining Dawg House Lounge for live music and dancing. The infamous Porch Dawgs will be on stage jamming the night away. If you're a singer or musician, come prepared to make your way to the stage and jam with the band.

Wednesday, March 28

Day 2 of the Two-Day Exhibition

10 am-3 pm in the Exhibit Hall

Need to spend some quality time with your vendors? Looking for personal demonstrations of the latest software, products and services? Then we suggest that you plan to visit the show floor on Wednesday (because the first day of the exhibition can be so busy for exhibitors that personalized attention is hard to give).

Cyber Cafe

10-3 pm in the Exhibit Hall

Dawg House Lounge, Take Two

8-11 pm in the Lawrence Room at the Hyatt Regency

Don't hang out alone in your room! Join the infamous Porch Dawgs for a second night of jamming, dancing, networking and just hanging out with your longtime and new industry friends. The lounge won't have any food, so eat before you drop by. However, there will be a fully stocked bar (including sodas), and you're buying.


Sunday, March 25

8 am-10 am


9 am-5 pm

Professional Development Certificate Program courses

DEC 1--High-Speed Design--Signal Integrity, EMI (ElectroMagnetic Interference) An electrical disturbance in a system due to natural phenomena, low-frequency waves from electromechanical devices or high-frequency waves (RFI) from chips and other electronic devices. Allowable limits are governed by the FCC.  and Crosstalk (1) Electromagnetic interference that comes from an adjacent wire. "Alien" crosstalk is interference that comes from a wire in an adjacent cable, for example, when two or more twisted wire pair cables are bundled together.  

DEC 2--PCR Design 101

T1--Electronics Principles and Signal Integrity

T2--PCB Design for RF Applications

T3--Designing for RoHS

T4--Design Challenges with HDI/Microvias, Including Hands-On Design

12-1 pm

Professional Development Attendee Welcome Luncheon

12-8 pm

PCB Top Gun Hall of Fame Contest

Monday, March 26

8 am-4 pm


9 am-5 pm

Professional Development Certificate Program courses

DEC 1--Continued from Sunday

DEC 2--Continued from Sunday

9 am-11 am

Technical Conference courses

010--Current Flow in PCB Traces

011--Hansd-On Embedded Passives Design for Experienced Designers

012--Designing for Asian Fabrication

013--Are You Ready to Embed Resistors and Capacitors in Your PCRs?

11 am-1:30 pm

Lunch break for Technical Conference attendees

12 pm-1 pm

Professional Development Attendee lunch

12-8 pm

PCB Top Gun Hall of Fame Contest

1:30 pm-5 pm

Technical Conference courses

020--EMI and Crosstalk: Theory, Simulation and Control

021--Intro to Hands-On Embedded Passives Design

022--The Routing Workshop

023--Flexible Circuit Design

5:15-6:-15 pm

Wine and Cheese Mixer

Tuesday, March 27

8 am-6 pm


9 am-11 pm


Free for all Attendees!

9 am-10 am

030--A Spreadsheet-Rased Solution for Capturing Today's Designs

031--Team Collaboration Methodology for the Future PCB Designer

032--Thermo-Mechanical Benefits of Carbon Composite Laminates Composite laminates

Assemblages of layers of fibrous composite materials (see illustration) which can be tailored to provide a wide range of engineering properties, including inplane stiffness, bending stiffness, strength, and coefficients of thermal expansion.
 Embedded in PCB and IC Substrates

9 am-11 am

FREE Tuesday Sessions

033--Lead-Free Panel:The Designer Toolkit for RoHs and WEE Compliance

034--How to Design with Flex in Mind

10 am-11 am

FREE Tuesday Sessions

035--The Secret of Accelerated NPI NPI National Provider Identifier, see there  

036--An Innovative Process for Fabricating HDI HDI Human Development Index (UNDP yardstick of human welfare)
HDI Help Desk Institute
HDI Humpty Dumpty Institute (New York, New York)
HDI High Density Interconnect
 Vias Using Modified Conventional PCB Manufacturing Systems

037--Separating Myth From Reality in Signal Integrity

038--Layer Count Reduction through Microelectronics

11 am-12 noon

FREE Tuesday Sessions

040--Auterouting Highly-Constrained PCB Designs

041--Handling the New Lead-Free World

042--IDF Process: Love/Hate Relationship

043--Gigabit Serpentine serpentine (sûr`pəntēn, –tīn), hydrous silicate of magnesium. It occurs in crystalline form only as a pseudomorph having the form of some other mineral and is generally found in the form of chrysotile (silky fibers) and  with Maxwell

044--What Really is Characteristic Impedance This article is about impedance in electronics. For characteristic acoustic impedance, see acoustic impedance.

The characteristic impedance or surge impedance of a uniform transmission line, usually written

12-7 pm

Exhibits Open

12:30-5 pm

Free Exhibitor Presentations

6-11 pm

Opening Night Networking Extravaganza

Wednesday, March 28

9 am-11 am

Technical Conference courses

050--Grounding to Control Noise and EMI

051--Laminates Material Selection for RoHS

052--Ten Questions, Ten Observations and Ten Insights to Measure Confidence in a PCB Manufacturing Facility--One Negative May Send You Walking Away

053--Next Generation of Component Packages

10 am--3 pm

Exhibits Open

10:30 am-2 pm

Free Exhibitor Presentations

1:30-5 pm

Technical Conference courses

060--RF and Microwave PCB Design and Base Materials

061--Land Pattern Creation and RoHS

062--Fundamentals of DFT DFT - discrete Fourier transform  

063--Advanced HDI Engineering

064--Designing with BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used.  Packages

8-11 pm

Dawg House Lounge, Take Two

Thursday, March 29

8 am--2:30 pm


9 am--11 am

Technical Conference courses

070--Vias and Their Effects on High-Speed Digital Signals

071--The IPC-7351A CAD Library Standard

072--Designing High Density While Not Sacrificing DFM DFM Design for Manufacturing (newsletter)
DFM Design for Manufacturability
DFM Dubai Financial Market
DFM Delphi Form (computer filename extension)
DFM Distinguished Flying Medal
DFM Diesel Fuel Marine

073--Standards and Resources

12:30 pm-1:30 pm

Lunch on your own

1:30-5 pm

Technical Conference courses

080--Practical Guidelines for Signal Integrity and Board Layout

081--The Lead-Free Mandate and the Production Line

082--PCB Design with Flip Chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done  Components

083--The Fabrication Process and What the Designer Needs to Know

084--Materials for Lead-Free, High-Speed and High-Frequency Applications

Friday, March 30

8 am-10 am



Professional Development Certificate Program courses

T5--The ABCs of Grounding, Including Analog/ Digital Planes

T6--DFM for Lead-Free Manufacturing

T7--Placement and Routing of Complex PCBs

T8--SMT and Microelectronic Design Principles and Lead-Free Assembly Process Development

12-1 pm

Professional Development Attendee lunch

Professional Development Certificate Program

Ten courses are available in this year's Professional Development Certificate Program--two 2-day Design Excellence Curriculum courses and eight 1-day Tutorials. These technical courses are taught by industry experts who will provide you with the technology, theory, application and best practice information that you need to achieve professional growth and development. You'll receive a certificate of completion for each Professional Development course that you attend and complete. Note: Professional Development courses are NOT included on the Technical Conference Proceedings CD-ROM CD-ROM: see compact disc.
 in full compact disc read-only memory

Type of computer storage medium that is read optically (e.g., by a laser).


SUN MAR 25 & MON MAR 26 | 9 AM-5 PM

IDEC IDEC Instituto Brasileiro de Defesa do Consumidor (Portugese: Brazilian Consumer Protection Agency)
IDEC Information Design & End-User Computing
IDEC Interior Design Educators Council, Inc.

Design--Signal Integrity, EMI and Crosstalk

Speaker: Rick Hartley, L-3 Communications
Not to be confused with Level 3 Communications, an Internet carrier

L-3 Communications Holdings, Inc. (NYSE: LLL) is a company that supplies command, control, communications, intelligence, surveillance and reconnaissance (C3ISR) systems and
, Avionics Systems

Attendees: PCB designers, engineers and managers interested in learning and applying high-speed concepts to electronic products.

This two-day course is a compete introduction to the high-speed design concepts needed to ensure success with designs utilizing the fast and ultra-fast ICs of today and tomorrow. In today's printed circuit boards, it's not so much the rate at which the circuit is clocked, but the output edge rate (rise/fall time) of ICs that causes signal integrity problems, EMI and crosstalk. The course will cover circuit parasitics, high-frequency currents, signal and wave propagation Wave propagation is any of the ways in which waves travel through a medium (waveguide).

With respect to the direction of the oscillation relative to the propagation direction, we can distinguish between longitudinal wave and transverse waves.
, propagation time and velocity, control of signal crosstalk, power distribution and decoupling Decoupling

The occurrence of returns on asset classes diverging from their normal pattern of correlation.

Take for example stock and corporate bond returns, which normally rise and fall together.
, types of EMI, source control of EMI, control of EMI coupling, split planes and plane islands, PCB layer stackups, filters and filtering techniques, system IF shielding and grounding, metal vs. plastic enclosures, slots in enclosures, and conducted EMI filters. Attendees will learn about interfacing with the fabricator fab·ri·cate  
tr.v. fab·ri·cat·ed, fab·ri·cat·ing, fab·ri·cates
1. To make; create.

2. To construct by combining or assembling diverse, typically standardized parts:
, PCB fabrication methods and concerns, PCB fabrication drawings, impedance testing, test coupons and cost differential of controlled impedance PCBs.

DEC 2--PCB Design 101

Speakers: Gary Ferrari, Firan Technology Group; and Susy Webb, Fairfield Industries

Attendees: Entry-level PCB designers and anyone else interested in an introduction to PCB design.

Managers often ask, "Where can I send my entry-level designers to learn the tricks of the trade?" This tutorial is the answer! Technical sessions at conferences often emphasize the latest techniques and technologies, but unfortunately those classes are usually too in-depth for the typical novice designer. This class is targeted at the entry-level PCB designer or someone just starting out in this profession. Attendees will begin with the components and the schematic, and continue through layout and post-processing. Attendees will learn how to interpret component specification sheets and schematics, how to plan component placement, as well as routing strategies, DFM, DfT, post-processing and more.


SUN MAR 25 | 9 AM-5 PM

T1--Electronics Principles and Signal Integrity

Speaker: Doug Brooks, UltraCAD

Attendees: PCB designers and anyone interested in learning more about signal integrity

Do inductors and capacitors confuse you? Are you unsure what lead inductance inductance, quantity that measures the electromagnetic induction of an electric circuit component; it is a property of the component itself rather than of the circuit as a whole.  means and why we worry about bypass capacitors Noun 1. bypass capacitor - a capacitor that provides low impedance over certain (high) frequencies
bypass condenser

capacitor, condenser, electrical condenser, capacitance - an electrical device characterized by its capacity to store an electric charge
? Then this course is for you! We'll start with an overview of resistors, capacitors, inductors and diodes, and how and why they do what they do. Next we'll look at what happens to resistance and impedance when we combine these components together in various ways in our circuits. Then we'll look at how these principles apply to the primary signal integrity issues board designers face today--EMI, crosstalk, signal reflections and transmission lines, and power supply conditioning to prevent ground bounce In electronic engineering, ground bounce is a phenomenon associated with transistor switching where the gate voltage can appear to be less than the local ground potential, causing the unstable operation of a logic gate. . At the conclusion of the course attendees will understand the basic causes of these signal integrity problems, and many of their solutions will become apparent.


T2--PCB Design for RF Applications

Speaker: Andy Kowalewski, Sychip

Attendees: Any PCB designer who wants a basic understanding of some of the special issues involved in PCB design for radio frequency (RF) applications.

The circuit board is a critical element in the design of RF circuits, and it has its own special characteristics that dramatically affect the way an RF design will function. This one-day workshop will present a practical guide to the many issues facing the modern printed circuit board designer, at a level suitable for the competent board designer facing RF design challenges. The instructor will cover some of the basic RF concepts, including wavelength, frequency, spectrum, modulation, power measurement and capacitance capacitance, in electricity, capability of a body, system, circuit, or device for storing electric charge. Capacitance is expressed as the ratio of stored charge in coulombs to the impressed potential difference in volts. , inductance, resonance and impedance. Typical components likely to be encountered in RF design will be reviewed, with discussion of their characteristics and the special care needed in their use. Issues of laminate laminate,
n a thin slice of porcelain or plastic fabricated in a dental lab, which is cemented to the front of the teeth to cover gaps, whiten stained teeth, or reshape chipped or broken teeth.
 selection, stackup stack·up  
A deployment of aircraft circling an airport at designated altitudes while awaiting instructions to land.
 planning and impedance control will be covered in depth to achieve an understanding of the problems and their solutions. Placement and routing strategies will be discussed in detail, with reference to practical circuits and their special needs when designing for RF applications.


T3--Designing for RoHS

Speakers: Gary Ferrari, Firan Technology Group; Doug Sober, Kaneka Texas Corp., Jo Wynschenk; Rick Love, Cookson

Attendees: PCB design and layout engineers, fabricators, anyone involved in materials selection and final finish specifications for RoHS compliant printed circuit boards.

The dynamics of materials changes and critical assembly considerations for designing RoHS compliant PCBs will be covered in this full day workshop. Industry experts from across the supply chain will provide information on base materials considerations for RoHS, final finish selection and assembly issues that have resulted from the change over to lead free solder pastes Solder paste (or solder cream) is a mix of small solder particles and flux. It is used extensively in the automated soldering processes wave soldering and reflow soldering.  and wave soldering Applying liquid solder to the underside of printed circuit boards in order to bond the chips and discrete components that are placed on top of the board and whose metal leads (pins) extend through the board. . The program includes an introduction to lead-free design by Gary Ferrari. This overview will provide the attendee with an understanding of the manufacturing and assembly challenges that have resulted from RoHs and lead-free PCB assembly. Doug Sober will cover material selection for RoHS. One of the most difficult areas for the designer as well as the fabricator has been RoHs compatible material selection. With the increased soldering soldering

Process that uses metal alloys with low melting points to join metallic surfaces without melting them. Tin-lead solders, once widely used in the electrical and plumbing industries, are now replaced by lead-free alloys.
 temperatures and extending contact times, the materials do not behave as expected according to according to
1. As stated or indicated by; on the authority of: according to historians.

2. In keeping with: according to instructions.

 the slash sheets. This session will provide practical guidelines for the selection and qualification of laminate materials used in RoHs compliant PCBs. The session on final finish compatibility for RoHs assembly by Jo Wynschenk will provide insight into the commonly used final finishes and their typical application based on board type and assembly specifics. The final finishes will be compared for their compatibility with RoHs assembly. The attendee will learn what can be expected from the various final finishes based on design complexity, material type, board thickness and the specific assembly process. The workshop will conclude with information on the assembly view of RoHS by Rick Love. Topics to be covered include the impact of lead free on the assembly process, assembly considerations for thick panels and high layer counts, ways to improve hole fill and reduce solder solder (sŏd`ər), metal alloy used in the molten state as a metallic binder. The type of solder to be used is determined by the metals to be united. Soft solders are commonly composed of lead and tin and have low melting points. Hard solders (i.  bridging. A key element to successful RoHS assembly is following revised DfA protocols. The session will provide the attendees with useful design guidelines to help prevent and reduce defects in the assembly process will be highlighted.

T4--Design Challenges with HDI/Microvias, Including Hands-On Design

Speakers: Happy Holden, Mentor Graphics, and Mike Fitts, Plexus Plexus - A modular World-Wide Web server written in Perl by Tony Sanders <>. Comes with interfaces to allow many other information services to be served via the Web.

Version 3.0m 1994-07-22.

Attendees: PCB engineers, designers, managers and others interested in using HDI/microvias.

Part 1 of this course will examine design techniques for the interconnection of area array components from ASIC (Application Specific Integrated Circuit) Pronounced "a-sick." A chip that is custom designed for a specific application rather than a general-purpose chip such as a microprocessor.  packaging, portable products, high-performance computing High-speed computing, which typically refers to supercomputers used in scientific research.  and telecom to dense multichip modules See MCM. . PCB design rules, materials and selection of PWB (Printed Wiring Board) An alternate term for printed circuit board. See printed circuit board.  structures (blind, buried and microvias) will be examined and compared. The tutorial will define the buried passive technologies, distributed capacitance, HDI technologies, circuit routing guidelines and materials required to permit the use of widely accepted fine-pitch and BGA components. One millimeter, 0.8 mm, 0.65 mm and 0.5 mm fine-pitch components are the focus of pad, spacing and layer assignments. Channel routing techniques using blind vias will show how layers can be reduced by as much as 3X, with the associated cost reductions. Examples will be the 1,247 and 2,577 I/O (Input/Output) The transfer of data between the CPU and a peripheral device. Every transfer is an output from one device and an input to another. See PC input/output.

I/O - Input/Output
 1.0 mm CCGAs. Participants are encouraged to bring technical questions for discussion. Part 2 of this course is a hands-on session. It will take the principles learned in earlier in the course and apply them to real-world designs. Part 2 will begin with a discussion of CAD tool sets and include the use of an actual tool set to strengthen the understanding of how HDI can be used to solve everyday design challenges. Previous tool set experience is required, and the ability to work as part of a team is mandatory.

FRI MAR 30 | 9 AM-5 PM

T5--The ADCs of Grounding, Including Analog/Digital Planes

Speaker: Robert Hanson Robert Hanson or ... Hansen or ... Hanssen may be:
  • Robert Hanson (Air Forces) (1920-2005), American Army flier
  • Robert M. Hanson (1920-1944), American flier in Marines
  • Robert Hanssen (born 1944), American security officer and spy
, Americom Seminars

Attendees: PCB designers, design engineers and others with an understanding of basic design techniques.

This tutorial will discuss the properties behind grounding. The concept that high-speed current follows the path of least inductance will be analyzed, as well as how this causes crosstalk in solid and slotted ground planes. This tutorial will address the following questions and more: Which should be used for your design--single ground, modified or multipoint ground A Multipoint Ground is an alternate type of electrical installation that attempts to solve the Ground Loop and Mains hum problem by creating many alternate paths for electrical energy to find its way back to ground. ? Do guard traces really stop crosstalk, and can they resonate res·o·nate  
v. res·o·nat·ed, res·o·nat·ing, res·o·nates

1. To exhibit or produce resonance or resonant effects.

? What causes near-end and far-end crosstalk and how is it measured and simulated? What's the best way to separate analog from ECL/PECL and TTL/CMOS? What are picket fences This article is about the television series. For the fence variety, see Picket fence. For the radio/telephony term, see Picket fencing.

Picket Fences
 and the 20H rule, and what can they do to suppress emissions? How should shields be tied to ground to minimize radiation and circulation current? Why does the loss of the ground plane in cables cause crosstalk, radiation, reflections and propagation delay The time it takes to transmit a signal from one place to another. Propagation delay is dependent solely on distance and two thirds the speed of light. Signals going through a wire or fiber generally travel at two thirds the speed of light. Contrast with nodal processing delay. ? Is earthground an equal potential? Why are solid ground planes best? What is intelligent parts placement, and what is its effect on ground return current? Attendees will learn about the concept of moats/floats/drawbridges, how to layout split planes--CMOS/TTL, PECL PECL PEAR (PHP Extension and Application Repository) Extended Code Language
PECL Principles of European Contract Law
PECL Positive Emitter Coupled Logic
PECL Pseudo-Emitter Coupled Logic
PECL Positive-Referenced Emitter Coupled Logic
, and analog--using the same bias voltage See bias. . Discussion will focus on how to stack PCB layers (e.g., 4, 6 and 10 layers) for characteristic impedance and crosstalk control.

T6--DFM for Lead-Free Manufacturing

Speaker: Gary Ferrari, Firan Technology Group

Attendees: PCB designers, layout technicians and anyone interested in learning DFM techniques for the lead-free manufacture of PCBs.

Lead-free assembly is the latest technological change to affect the PCB designer. Cost-effective design and manufacture in leaded and lead-free environments form the fundamental building blocks for this full-day session. The class will be broken into separate interactive discussion groups to look at material issues such as lead-free laminates, high performance, HDI and surface finishes for lead-free assembly. The groups will explore further the challenges that the Restrictions of Hazardous Substances directive pose for the fabrication and assembly processes. Last, the groups will look at new and innovative ways to test and verify a product's integrity in both leaded and lead-free products. There will be ample time allocated to look at individual challenges faced by the attendees. The attendee should come out of this session with a clear understanding of overall DFM issues and how they relate to the RoHs directive.

T7--Placement and Routing of Complex PCBs

Speakers: Rick Hartley, L-3 Communications, Avionics Systems; and Susy Webb, Fairfield Industries

Attendees: PCB designers, design engineers and others wishing to gain an understanding of the concepts behind parts placement and routing of complex PCBs.

Everything you ever wanted to know about placement and routing! The concepts behind parts placement and trace routing always seem to pique the interest of PCB designers. The reality is, there is seldom perfect way to place parts on a PCB. And once parts are placed, there are hundreds of possibilities for routing the many transmission lines of the circuit. Determining which placement and routing schemes optimize the design is a matter of physics, fit and opinion. This tutorial will focus on both the science behind placement and routing and the opinions of the two instructors. Attendees will learn about placement for optimum routing, placement "rooms" (several views), and placement's effects on the schematic, EMI, board stack-up, fabrication, testability, repair and assembly. It will also cover a typical design flow, routing plans, routing for best signal integrity, what's most important when routing, signals of greatest concern, I/O structures, differential pairs Differential pair is a pair of conductors with special characteristics, used for differential signaling.

Examples of the differential pair include:
  • twisted-pair cables, shielded and unshielded
, analog vs. digital, and much more.

T8--SMT and Microehctronic Design Principles and Lead-Free Assembly Process Development

Speaker: Vern Solberg

Attendees: Specifically for board-level design professionals, assembly and test engineering specialists.

Many new IC device families have more leads and a finer contact pitch than their predecessors, dramatically affecting board design and assembly methodology. When adapting the QFP (Quad FlatPack) A square, surface mount chip package that has leads on all four sides and comes in several varieties. PQFP (Plastic QFP) may refer to all of the following QFP types. All quad flatpacks use gull-wing leads, except for the CQFP, which stick straight out. , BGA and CSP (1) (Certified Systems Professional) An earlier award for successful completion of an ICCP examination in systems development. See ICCP.

(2) (Commerce Service P
 families in particular, one must consider board fabrication tolerances and assembly machine accuracy. Land pattern geometry too, is directly related to process control and solder attachment uniformity. The most successful SMT (1) (Surface Mount Technology) See surface mount.

(2) (Station ManagemenT) An FDDI network management protocol that provides direct management. Only one node requires the software.

SMT - Station Management
 programs are those that have implemented process proven circuit board design rules and these rules specifically define the geometry and spacing of the land patterns for surface mount devices, influencing manufacturing efficiency, quality and reliability. Only when PCB design related disciplines are properly defined and implemented can maximum assembly process efficiency and yield be achieved. This workshop covers implementation of the more complex fine-pitch quad flatpack ICs, high-density BGA and fine-pitch chip-scale BGA device families. When adapting these newer, and often higher I/O package families, the designer and process engineer must recognize disciplines, capabilities and limitations within each other's realm. Topics covered include product design principles, preparing for lead-free assembly, land patterns for SMT and microelectronics, and PCB fabrication and layout guidelines. It also explores a number of alternative package methodologies, and reviews manufacturers design guidelines and the international requirements for RoHS and WEEE WEEE Waste from Electric and Electronic Equipment (directive)
WEEE Waste Electrical and Electronics Equipment
WEEE Waste Electrical and Electronic Equipment
 compliant lead-free assembly processing.

Technical Conference

3-Day Technical Conference Program

MON MAR 26 | 9-11 AM

010--Current Flow in PCB Traces

Speaker: Doug Brooks, UltraCAD

Attendees: PCB designers and anyone interested in the flow of currents in PCB traces.

We have heard the definition "the current is the flow of electrons." But there is considerable confusion over flow as a drift velocity The drift velocity is the average velocity (not speed) that a particle, such as an electron, attains due to an electric field. In general, an electron will rattle around in a conductor at the Fermi velocity randomly.  of electrons and flow at the speed of light. Also, people wonder how electrons can flow across a capacitor or out through space (EMI). Attendees will learn what is meant by the "flow of electrons" and why that definition (which has been around for 150 years) is still valid. How can there be a propagation delay as current flows, while current is also constant everywhere along a trace, simultaneously? Learn how currents flow down transmission lines, terminated and unterminated, and down differential traces.


011--Hands-On Embedded Passive Design for Experienced Designers

Speaker: Mike Fitts, Plexus

Attendees: Experienced designers with previous toolset experience.

How to use a high-end CAD system for parametrically designing with embedded passives. This hands-on experience is with a very specialized tool set provided by Mentor Graphics. The hands-on experience will be instructed using workstations for each participant to go through the design processes. (Depending on the number of attendees, you may be working in teams.) This course will provide attendees with the use of an actual toolset to strengthen their understanding of how buried passives can be used to solve everyday design challenges. This is an advanced class.

012--Designing For Asian Fabrication

Speaker: Happy Holden, Mentor Graphics

Attendees: PCB designers, design managers, layout technicians and others interested in this topic.

If there were ever a time to have a full understanding of DFM, then having your boards built in China is that time! This workshop will highlight the issues, choices, alternatives and conditions that designers need to consider in order to make a printed circuit board manufacturable in Asia, especially China. Attendees will learn how to determine if a fabricator is capable of handling an order; how to use IPC-9151 capability benchmarking to select fabricators; when to control impedance; plating, finishes and thickness distribution; mechanical and image tolerances; materials, multilayer stackup and hole plugging; thieving, plating concerns and why plating thickness varies; calculations vs. 2D field solvers; and much more.


013--Are You Ready to Embed Resistors and Capacitors in Your PCBs?

Speaker: Richard Snogren, Bristlecone LLC (Logical Link Control) See "LANs" under data link protocol.

LLC - Logical Link Control

Attendees: Anyone interested in embedded passives, but unfamiliar with EP technology.

This half-day course is a review of the state-of-the-art of today's commercially available embedded passive component materials technology. The course starts with passive component functions and performance drivers to embed passives. This leads into an in-depth discussion of today's commercial material sets; their electrical and physical characteristics; a useable selection rationale; design, test, and trim tools; and DFM guidelines for implementation. The presentation includes discussion of the relative costs of the various technologies and a methodology for cost analysis. The class concludes with a review of industry initiatives on embedded passive components. What you will learn: Why and when to embed resistor resistor, two-terminal electric circuit component that offers opposition to an electric current. Resistors are normally designed and operated so that, with varying levels of current, variations of their resistance values are negligible (see resistance).  and capacitors; commercially available material sets; design guidelines and manufacturing processes; and embedded passive component industry initiatives.

MON MAR 26 | 1:30-5 PM

020--EMI and Crosstalk: Theory, Simulation and Control

Speaker: Doug Brooks, UltraCAD

Attendees: Attendees of this session should have a basic familiarity with PCB design. Engineers who have not had formal training in crosstalk will find this course useful.

Crosstalk is one of the more difficult noise problems for designers to understand and control. And many engineers use rules of thumb that they really don't understand. This course will first look at forwards and backwards crosstalk to help attendees understand the sources and differences between the two. Then results from an analysis tool will be used to show the strengths and weaknesses behind such tools, and to help the student visualize the crosstalk effects. Finally, some design considerations will be reviewed to show how crosstalk can be managed, minimized, and perhaps even eliminated!


021--Intro to Hands-on Embedded Passives Design

Speaker: Happy Holden, Mentor Graphics

Attendees: PCB designers and others with previous toolset experience who are interested in learning how to design embedded passives. It is recommended, but not required, that attendees of this course have also attended "013--Are You Ready to Embed Resistors and Capacitors in Your PCBs?"

This course is in many ways a continuation of course 013. It will provide attendees with instructions on how to use a high end CAD system for parametrically designing with embedded passives. This hands-on introduction to embedded passives design utilizes a very specialized tool set provided by Mentor Graphics. The hands-on experience will be instructed using workstations for each participant to go through the design processes. (Depending on the number of attendees, you may be working in teams.) This will provide attendees with using an actual toolset to strengthen their understanding of how buried passives can be used to solve everyday design challenges.


022--The Routing Workshop

Speaker: Andy Kowalewski, Sychip

Attendees: PCB designers and anyone else with basic PCB physical design knowledge.

This workshop is for anyone wishing to learn hand-routing skills or improve their existing routing skills. This presentation will cover designing single-sided assemblies with four-layer board construction and multilayer assemblies with higher layer counts. An abbreviated overall design flow will be followed by a detailed placement and routing strategy Many specific routing examples will be shown for discussion. General placement and routing tips will be covered throughout the presentation and listed at the end for easy review.


023--Flexible Circuit Design

Speaker: Joe Fjelstad, SiliconPipe

Attendees: PCB designers, IC packaging specialists, systems and hardward engineers, and assembly and test engineers.

This course reviews design guidelines, including land patterns, via hole layout and routing, flexible laminate materials (polyimide Pronounced "poly-ih-mid." A type of plastic (a synthetic polymeric resin) originally developed by DuPont that is very durable, easy to machine and can handle very high temperatures. Polyimide is also highly insulative and does not contaminate its surroundings (does not outgas).  and polyester), fabrication (including metalization and plating), and assembly, plus special situations that require stiffeners. It will also review major flex standards.

FREE Tuesday Sessions

All Tuesday sessions are FREE to all conference and exhibition attendees. They are not part of the 3-Day Technical Conference.

TUE Tu´e

n. 1. (Zool.) The parson bird.

Tue, Tues abbr (= Tuesday) → ma 
 MAR 27 | 9-10 AM


030--A Spreadsheet-Based Solution for Capturing Today's Designs

Speakers: Vikas Kohli, Cadence Design Systems (company) Cadence Design Systems - A company that sells electronic design automation software and services.

See also Verilog.
, and Ken Holman, Motorola

Attendees: Design engineers, managers, R&D engineers, electrical engineers This is a list of electrical engineers, people who made contributions to electrical engineering or computer engineering.

It is recommended that proposed additions or deletions be discussed on the article's before being implemented.

Designers struggle to quickly and accurately use these devices in schematics. Designers of highly constrained motherboards, backplanes, and SiPs consistently see a number of problems during schematic design capture including: symbol creation for large pin-count devices, logical function representation with graphical symbols, and limited scope of page editors. To circumvent these issues, design engineers have resorted to spreadsheets, like Excel, for capturing the connectivity of the large devices. They have created custom utilities to create physical netlist from the spreadsheets to drive the layout. However, this approach has problems of no support for associated circuitry, lack of connectivity knowledge, and no mechanism for capturing constraints. This paper will discuss a methodology and a tool for addressing these issues. A use model will be described for a new design capture paradigm using spreadsheets. A Motorola case study will demonstrate the benefits of this approach over the traditional schematic based design capture.


031--Team Collaboration Methodology for the Future PCD PCD

polycystic disease.

Speakers: Glenn Torrance and Peter Cerbonne, Cisco

Attendees: PCB designers and design engineers, design team and program managers and anyone interested in better collaboration in the design process.

This paper will discuss the methodology which allows a team of PCB designers to work concurrently on a design. Partitioning enables the sharing of access to a single database regardless of team proximity. With time to market and team environments becoming more important, today's PCB designer roles are changing drastically. A case study and a live demonstration will be given so each attendee will have a clear understanding of the benefits of team collaboration and the impact of concurrent design engineering.


032--Thermo-Mechanical Benefits of Carbon Composite Laminates Embedded in PCB and IC Substrates

Speakers: Alex Mangrolia and Kris Vasoya, ThermalWorks

Attendees: PCB and IC designers looking for new materials to address thermal management.

A discussion of a composite laminate that can handle thermal, CTE (Coefficient of Thermal Expansion) The difference between the way two materials expand when heat is applied. This is very critical when chips are mounted to printed circuit boards, because the silicon chip expands at a different rate than the plastic board. , rigidity and weight issues present in PCBs. This talk covers the novel material's thermal conductivity, density, tensile modulus of elasticity modulus of elasticity

The ratio of the stress applied to a body to the strain that results in the body in response to it. The modulus of elasticity of a material is a measure of its stiffness and for most materials remains constant over a range of stress.
 and dielectric constant dielectric constant
See permittivity.

TUE MAR 27 | 9-11 AM

033--Lead-Free Panel: The Designer Toolkit for RoHs and WEEE Compliance

Moderator: Greg Roberts, EMA (1) (Enterprise Management Architecture) An earlier strategic plan from Digital for integrating network, system and application management. It provided the operating environment for managing a multi-vendor network.  Design Automation

Attendees: PCB designers, design managers and other executive and departmental managers.

Waiting until the end of the design cycle to ensure RoHS compliance might be acceptable for designs currently in production, but for new designs, companies must consider RoHs compliance at the very beginning of the design phase. The panel agenda will include RoHS and WEEE implications on the design process; managing the impact of RoHS and WEEE on the supply chain, PCB design infrastructure and data management; the practical impact of the directives; and achieving compliance of the electronics and mechanicals under RollS and WEEE--is declaring self-compliance an option? The panel discussion will be followed by a Q&A session and a networking opportunity to meet each panelist, other experts, and attendees.


034--How to Design with Flex in Mind

Speakers: Mark Finstad and Mark Verbrugge, Minco Products Minco is a multimillion-dollar privately owned company with 1,000 employees worldwide. Based in Fridley, Minnesota, the company manufactures and sells, among other things, flexible printed circuit board and interconnects, RTD based temperature sensors and assemblies, flat flexible  

Attendees: PCB designers, and mechanical or electrical engineers, who would like to incorporate flexible circuitry as a comprehensive interconnect method.

Flexible circuitry is more than just an electrical interconnect. Since a flexible circuit is required to bend and flex during and after installation, it becomes as much a mechanical device as an electrical device. A robust flexible circuit design goes much deeper than just connecting the nets. Small variations in materials selection, materials stackup, and routing features can dictate whether a flex circuit See flexible circuit.  will function for years, or fail within minutes. This course will examine the electrical and mechanical features that must be incorporated into the design, and how those features will interact. Course content will include manufacturing and material differences between flex and rigid PCBs, and how those differences affect the design process. Also covered will be how to select the proper materials and stack up, routing techniques, termination variety, and ruggedizing options. Attendees will also participate in a hands-on design exercise to use skills acquired during the training session.

TUE MAR 27 | 10-11 AM


035--The Secret of Accelerated NPI

Speaker: Max Clark, Valor valor

a rodenticide no longer marketed because of toxicity in horses causing dehydration, abdominal pain, hindlimb weakness, inappetence, fishy smell in urine. Called also N-3-pyridyl methyl N1-p-nitrophenyl urea.
 Computerized Systems

Attendees: PCB design and manufacturing professionals, including PCB designers/managers, engineering managers, project managers, PCB manufacturers and process engineers.

Design for Assembly (DfA) is the best way to accelerate any NPI process. Find out how manufacturing defects are quickly discovered and can be easily re-worked during the design stage, before the product even goes to the production floor. Learn how DfA is enabling designers to accurately evaluate the design at any stage--from component placement through manufacturing output. DfA gives you design statistical data to assist in quoting, planning and resource allocation resource allocation Managed care The constellation of activities and decisions which form the basis for prioritizing health care needs . DfA for an improved manufacturing process and right-first-time assembly comes with hundreds of assembly and test checks to improve end-product quality and accelerate design-to-manufacture. Cut costs downstream in NPI and manufacturing in a virtual prototyping environment. A powerful online parts and package database (VPL 1. VPL - visual programming language.

["VPL: An Active, Declarative Visual Programming System, D. Lau-Kee et al, 1991 IEEE Workshop on Vis Langs, Oct 1991, pp. 40-46].
2. VPL - A dataflow language for interactive image processing.
) delivers CAD/CAM-ready physical models of component packages to support all DFM operations. The parts library aids searches through paper or electronic catalogs by providing physical package information on-line with fully automatic input, verification and crosschecks between BOM/AVL and engineering data--with the single push of a button. The result--preproduction analysis and optimization processes that correctly simulate and predict the fabrication, assembly and test stages of manufacturing your product.


036--Innovative Process for Fabricating HDI Vias Using Modified Conventional PCB Manufacturing Systems

Speaker: Dr. Barry Johnson, Innalabs Holding

Attendees: PCB designers, design, manufacturing and packaging engineers, and others interested in HDI.

An important factor of advanced printed circuit boards is high-density interconnects (HDI). As the need for higher-speed logic and more compact PCBs continues to evolve, HDI affords utilization of finer pitch components and higher wiring densities than conventional PCBS. HDI have < 75 [micro]m lines and spaces, 400 [micro]m capture pads, and 150 [micro]m vias. Innalabs Holding Inc. has developed an innovative process for construction of HDI vias that can be readily integrated into many conventional PBC PBC 1 Peripheral blood cells 2 Primary biliary cirrhosis, see there  manufacturing systems using commonly available processing materials, assuming the existing system has adequate resolution. This process allows the realization of (a) significantly decreasing the bonding pads diameter when compared to conventional PCB technology, (b) precise bonding pad alignment with hole centers without using an alignment system, and automatic accommodation of drilled hole drift. Double-sided and multilayer PCBs can be fabricated fab·ri·cate  
tr.v. fab·ri·cat·ed, fab·ri·cat·ing, fab·ri·cates
1. To make; create.

2. To construct by combining or assembling diverse, typically standardized parts:
 using this process. The integration of this process into an existing conventional PCB will be discussed and results presented.


037--Separating Myth from Reality in Signal Integrity

Attendees: Electrical engineers, PCB designers and design engineers interested in solving signal integrity problems in their designs.

Speaker: Eric Bogatin, Bogatin Enterprises This session introduces the idea of a myth and the principle that "putting in the numbers" is the way to separate myth from reality. The speaker will apply this method to four myths: speed of electrons in a wire is the speed of the signal, return current in a diff pair is in the second line, corners should be avoided in transmission lines, and FR-4 won't work at GHz speeds.

038--Layer Count Reduction Through Microelectronics

Speakers: Robert Tarzwell and Ken Bahl, Sierra Proto Express

Attendees: PCB engineers, engineering managers, designers and others.

Microelectronics printed circuits are very small very fine line circuits to miniaturize min·i·a·tur·ize  
tr.v. min·i·a·tur·ized, min·i·a·tur·iz·ing, min·i·a·tur·iz·es
To plan or make on a greatly reduced scale.

 your products. With line widths as fine as 10 microns (1/3 mil) and vias of only 25 microns (1 mil), the micro circuit greatly increases the density of the package with less layers. With the addition of buried real micro resistors and capacitors, the future density of tomorrow's electronic products will he reduced even further. Using post pad technology, a unique method of manufacturing extremely small circuit boards has been invented. This session will cover the future design possibilities of new microcircuits (both rigid and flexible), line width, design and use, via hole design, multilayer construction, micro flex circuits, and a new technology of real buried resistors. The advantages of new micro HDI circuits, including significant layer count reduction, will be revealed. A microelectronics booklet will be handed out to all attendees.

TUE MAR 27 | 11 AM-12 PM


040--Autorouting Highly Constrained PCB Designs

Speaker: Greg Horlick, Cadence Design Systems Attendees: PCB designers, design layout and design engineers who work with autorouting tools in the design process.

In the world of state-of-the-art, highly-constrained, high-density designs, it can take significant time to route a design. This is because autorouting technology has not kept pace with the technology used on these designs nor is it able to adhere to adhere to
verb 1. follow, keep, maintain, respect, observe, be true, fulfil, obey, heed, keep to, abide by, be loyal, mind, be constant, be faithful

 a designer's intent. Consequently, simply placing and autorouting these designs more often than not, fails to produce the desired routing results. In order to effectively route these type of designs, the designers must begin interacting with the routing engine during placement and SI analysis and continue to interact with the route engine throughout the design cycle--not simply to route the board manually as is often done today. To achieve the desired results, guidance needs to be provided to the router so it not only follows the design constraints and but also follows good design practices.


041--Handling the New Lead-Free World

Speakers: Robert Tarzwell and Ken Bahl, Sierra Proto Express

Attendees: PCB engineers, engineering managers, designers and others.

This session will use a number of real world examples to show how high-reliability lead-free printed circuit boards handle all of the needs of our new lead free world. Attendees will learn about this new technology, which is not only lead-free but also virtually indestructible in·de·struc·ti·ble  
Impossible to destroy: indestructible furniture; indestructible faith.

[Late Latin ind
. It is possible to fabricate lead-free PCBs that will not only meet but actually exceed the much more strenuous demands of lead-free assembly. A lead-free booklet will be handed out to all attendees.


042--IDF Process: Love/Hate Relationship

Speakers: Glenn Torrance and Peter Cerbonne, Cisco

Attendees: PCB designers, PCB mangers and others.

Intermediate Data Format (IDF (Intermediate Distribution Frame) A wiring rack located between the MDF (main distribution frame) and the intended end user devices (telephones, routers, PCs, etc.). Cables run from the outside world to the MDF and then to the IDFs. See MDF and wiring rack. ) allows the exchange of 23 and 33 PCB assembly data between MCAD MCAD Microsoft Certified Application Developer
MCAD Mechanical Computer Aided Design
MCAD Medium-Chain Acyl-CoA Dehydrogenase (inherited metabolic disease)
MCAD Minneapolis College of Art and Design
 and ECAD ECAD Electronic Computer-Aided Design
ECAD European Cities Against Drugs
ECAD European Center for Aviation Development
ECAD external carotid artery dysplasia
 systems. Reliable and efficient process that accurately places critical components can prevent errors and reduce board spins. Attendees will learn the steps to effectively exchange data between CAD disciplines using the IDF process as well as learning the advantages over DXF DXF - Drawing Exchange Format .


043--Gigahit Serpentine with Maxwell

Speaker: Joseoph Socha, Maxwell

Attendees: PCB designers, engineers, technicians and managers.

This paper explores several common differential pair launch and routing techniques from a simulation (Maxwell's equations Maxwell's equations

Four equations, formulated by James Clerk Maxwell, that together form a complete description of the production and interrelation of electric and magnetic fields.
) point of view. Of particular interest is intra-pair (P and N) matching. There are many techniques used to escape from adjacent and distant pin fields in BGA type packages to a differential pair. In addition this is where the signal transitions from a loosely coupled See loose coupling.  to a tightly coupled See tight coupling.  region. It is common to use this launch area to add length to a trace for matching purposes, hut is it worth the effort? The attendees will leave with an understanding of various routing techniques, and their impact on transmission line characteristics and signal integrity.


044--What Really is Characteristic Impedance?

Speaker: Eric Bogatin, Bogatin Enterprises

Attendees: PCB designers, engineers, technicians and managers.

This session introduces the concept of the instantaneous impedance and describes an intuitive way of thinking about the characteristic impedance of a transmission line. It relates the geometry and material properties so that you can tie your intuition of capacitance to characteristic impedance.

WED MAR 28 | 9-11 AM

050--Grounding to Control Noise and EMI

Speaker: Rick Hartley, L-3 Communications, Avionics Systems

Attendees: PCB designers, circuit design engineers and managers interested in learning proper circuit grounding techniques.

This new short course is an introduction to the concepts needed in high-speed circuits and printed circuit design regarding grounding a circuit for proper Operation, to minimize noise and EMI. The course will cover why we call it ground, the many different "things" known as ground, circuit parasitics, high-frequency currents, basic transmission line concepts, partner planes, successful PCB stackups, grounding to help eliminate EMI, splitting vs. not splitting ground (the pros and cons pros and cons
Noun, pl

the advantages and disadvantages of a situation [Latin pro for + con(tra) against]
 of each), islands in ground, ground in IC packages and connectors, grounded guard traces (the pros and cons), and RF shielding A material that prohibits electromagnetic radiation from penetrating it. Computers and electronic devices used in the home must meet U.S. government standards for electromagnetic interference.  techniques.


051--Laminate Material Selection for RoHS

Speaker: Doug Sober, Kaneka Texas Corp.

Attendees: PCB designers and electrical engineers, who are interested in learning about base materials properties This is a list of materials properties. A materials property is an intensive, often quantitative property of a material, usually with a unit that may be used as a metric of value to compare the benefits of one material versus another to aid in materials selection.  and material selection for RoHs manufacturing.

With the arrival of RoHS one of the most difficult areas for designers has been the selection of laminate materials. In many cases even the PCB fabricator has had a difficult time selecting RollS compatible materials that are both cost-effective and perform in a variety of assembly situations. The increased soldering temperatures and extending contact times of RoHS assembly have lead to problems with materials performance. On some cases the materials are not behaving as expect according to the slash sheets. This session will provide practical guidelines for the selection and qualification of laminate materials used in RoHS compliant PCBs. The trade offs of material cost and potential assembly performance and long- term reliability will be explored.


052--Ten Questions, Ten Observations and Ten Insights to Measure Confidence in a PCB Manufacturing Facility--One Negative May Send You Walking Away

Speaker: Richard Snogren, Bristlecone LLC Attendees: PCB designers, engineers, technicians and managers.

If you are a really good PCB designer, but don't know Don't know (DK, DKed)

"Don't know the trade." A Street expression used whenever one party lacks knowledge of a trade or receives conflicting instructions from the other party.
 much about evaluating PCB manufacturers and are tasked with recommending one should take this course. You can sit in a conference room and listen to sales presentations. You can be given a guided tour guided tour guide nvisite guidée;
what time does the guided tour start? → la visite guidée commence à quelle heure? 
 through the shop. But, if you don't know what's important to you the customer, you won't know what to ask, or what to look for. You may not learn what you need to. Take this course and feel confidant that you can effectively evaluate a PCB manufacturers' ability to satisfy your requirements and assure a future positive relationship. What you will learn: Ten questions to ask that will clarify the critical issues you need to know for your future satisfaction; Ten things to look for and find to assure your future satisfaction; Ten insights on how to ensure a successful future relationship with your manufacturer.


053--Next-Generation Component Packages

Speaker: Joe Fjelstad, SiliconPipe

Attendees: PCB designers, fabricators and assemblers This is a list of assemblers. Hundreds of assemblers have been written; some notable examples are:
  • ASEM-51 - for the Intel MCS-51 family of microcontrollers; runs on DOS, Win32, and Linux.
 interested in learning about new component packages and their effect on design, fabrication and assembly.

From the DIP and PGA (1) (Professional Graphics Adapter) An early IBM PC display standard for 3D processing with 640x480x256 resolution. It was not widely used.

(2) (Programmable Gate Array) See gate array and FPGA.
 packages of the 1970s to the rise of QFP in the 80s to ball grid arrays “BGA” redirects here. For other uses, see BGA (disambiguation).

A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits.
 and finally chip-scale packages in the 90s, each decade is characterized by the introduction of unique--and useful--packaging. What package styles are OEMs dreaming up next, and what will be the implications for board level design and fabrication?

WED MAR 28 | 1:30-5 PM

060--RF and Microwave PER Design and Base Materials

Speaker: Rick Hartley, L-3 Communications, Avionics Systems

Attendees: PCB designers, engineers, technicians and managers.

Ultra-high signal integrity and noise control are the keys to full functionality when designing very high frequency analog applications. This workshop is geared to help better understand the "whats" and "whys" of PCB layout and the effect of the PCB materials in high-frequency analog circuits. The course will cover impedance matching Impedance matching

The use of electric circuits and devices to establish the condition in which the impedance of a load is equal to the internal impedance of the source.
 and balance, signal wavelength, propagation delay, critical trace length, noise, reflections, skin effect, loss tangent tangent, in mathematics.

1 In geometry, the tangent to a circle or sphere is a straight line that intersects the circle or sphere in one and only one point.
, waveguides and other RF transmission lines, and microstrip vs. stripline vs. co-planar waveguides. Other highlights include PCB stackups for RF circuits, shields and shielding, RF PCB base material properties, choosing RF base materials, RF PCB fabrication, and RF PCB assembly.


061--Land Pattern Creation and RollS

Speaker: James C. Blankenhorn, SMT Plus

Attendees: CAD designers, librarians, manufacturing engineers.

The world of land patterns can at times be a very confusing one. In this session we will explore what the needs are of a land pattern and how many of the patterns for assorted packages are created without compromising manufacturing's needs. Old mid new components will all be discussed. Also learn how land patterns have migrated to smaller sizes over the years. A partial list of packages to be discussed include: 0201, 0402, QFN QFN Quad Flat No-Lead
QFN Queen Fan Newsletter (rock band)
QFN Quad Flat No Leads
, MLF MLF Malolactic Fermentation (winemaking)
MLF Medial Longitudinal Fasciculus
MLF Micro Lead-Frame
MLF Multilateral Force
MLF Mouvement de Libération de la Femme
, QFP, Transistors, Power components, LCN LCN La Cosa Nostra
LCN London Cycle Network (UK)
LCN Logical Channel Number
LCN Low Copy Number (DNA or RNA quantity)
LCN Local Computer Network
LCN Logical Cluster Number
LCN Load Classification Number
, SON, BGA plus many more. In the past couple of years changes in the SMT process have led to the elimination of lead from solder. The affects this has had on land patterns will be a key point of discussion during the session. Some old problems such as tombstoning and solder bailing are once again showing up. We will discuss how land patterns can affect such items.

062--Fundamentals of BIT

Speaker: Gary Ferrari, Firan Technology Group

Attendees: PCB designers, design managers, layout technicians and others.

The term "DfT" (design for test) has a different meaning depending on whether you are dealing with a bare printed board, a final assembly or a board in the field. This course will help you define DfT issues as they relate to design and cost in the fabrication and assembly processes. The discussions will focus on fabrication and assembly issues that affect the design of a product. These "snapshots" will fortify for·ti·fy  
v. for·ti·fied, for·ti·fy·ing, for·ti·fies
To make strong, as:
a. To strengthen and secure (a position) with fortifications.

b. To reinforce by adding material.
 the discussion, as well as provide you with guidelines for applying IPC (1) (InterProcess Communication) The exchange of data between one program and another either within the same computer or over a network. It implies a protocol that guarantees a response to a request.  standards to your designs in order to more easily produce cost effective, right-the-first-time PCBs.

063--Advanced HDI Engineering

Speaker: Happy Holden, Mentor Graphics

Attendees: PCB designers, design and packaging engineers and others interested in HDI.

As finer pitch devices all come into common use higher speed logic, the need for advanced PCBs is essential--both as the board and ms the package. Attendees will investigate advanced technologies for the interconnection of area array components, from ASIC packaging, portable products, high-performance computing, and telecom to dense multichip modules. PCB wiring modeling, design rules, materials and selection of PCB structures (blind, buried and microvias) will be examined and compared. The overview of HDI technology is particularly useful for those not familiar with this technology.


064--Designing With BGA Packages

Speaker: Andy Kowalewski, Sychip

Attendees: All PCB interconnect designers currently using or planning to use BGA packages.

This presentation will cover footprint construction and placing and routing of BGAs. Attendees will learn how to calculate layer requirements for BGAs based on package information and design rules. Attendees will also learn about general design concerns and pitfalls to be avoided, including tips on placement, general routing, power distribution and assembly. A design checklist is included in the presentation for easy review of the material. This is a must for anyone wanting to design low-cost, low layer-coutu PCBs with BGAs.

THU THU Thursday
THU Tsinghua University (Beijing, China)
THU Tony Hawks' Underground (video game)
THU Pituffik, Greenland - Thule Airport (Airport Code) 
 MAR 29 | 9-11 AM

070--Vias and Their Effects on High-Speed Digital Signals

Speaker: Robert Hanson, Americom Seminars

Attendees: PCB designers, design managers and others interested in the properties behind vies.

Vias are much more than holes; they can have a profound effect on your digital signal. This course will cover the mechanical properties of vias--from drilling and plating, to lamination lamination

a laminar structure or arrangement.
, electrolysis electrolysis (ĭlĕktrŏl`əsĭs), passage of an electric current through a conducting solution or molten salt that is decomposed in the process.  and electroplating electroplating: see plating.

Process of coating with metal by means of an electric current. Plating metal may be transferred to conductive surfaces (e.g., metals) or to nonconductive surfaces (e.g.
. Attendees will learn more about the capacitance and inductance of vias; return current and its relation to vias; through-hole, blind, buried and microvias; methods for drilling; aspect ratios; and cost tradeoffs. Discussion will focus on whether vias and autorouters are HDI compatible, via discontinuity' and via resonance concerns, capacitance and inductance of vias (through-hole, blind, buried), eliminating reflections of vias, and return current and intelligent via placement.


071--The IPC-7351A CAD Library Standard

Speaker: Tom Hausherr, PCB Libraries

All PCB designers, CAD librarians, EE engineers who want to expand their basic knowledge of PCB layout, CAD managers and engineering managers.

This course is about the principles of land pattern design using IPC-7351. Material covered includes the mathematical modeling of solder joint analysis and tolerances, component families new to IPC-7351, new lead-free data, BGA layout considerations, and SMT via fanout and routing techniques. Also covered are basic elements of IPC-7351: naming conventions, placement courtyards, 3-tier environment, zero component orientations, I and pattern origins, post-assembly inspection dots, and more. Discussion include transitioning to metric. Attendees get a IPC-7351 LP calculator CD-ROM.


072--Designing High Density While Not Sacrificing DFM

Speaker: James C. Blankenhorn, SMT Plus

Attendees: CAD designers, librarians, manufacturing engineers.

Packing components ms close as possible on boards requires an understanding of the assorted issues affecting DFM so the product will run smoothly through manufacturing. To achieve high density requires a close working relationship between design and manufacturing. What helps designers is knowing what questions to get answers to so meetings and time spent together with manufacturing is meaningful and productive. Examples will be provided in this class of products that have been built in high volume with very tight component spacings while using very small land patterns. These work hand in hand to accomplish a very high density on boards heretofore thought of as unachievable. Learn what the manufacturing issues and problems are and how they affect the design rules you might choose to use. Some of the topics to be presented include component tolerances, minimum spacing guidelines, rework re·work  
tr.v. re·worked, re·work·ing, re·works
1. To work over again; revise.

2. To subject to a repeated or new process.

 issues, minimal fillets trends, IPC standards, board tolerances, manufacturing tolerances, use of 0402 and 0201 components plus much more.

073--Standards and Resources

Speaker: Susy Webb, Fairfield Industries

Attendees: PCB designers, design managers and others interested in standards and documentation.

This course offers ideas and resources for designers to use in setting up company standards and documentation. It offers tips for organizing the input, output, and checking procedures; naming and saving conventions; and working with specifications and reference materials. It will also offer a listing of softwares and websites that may be helpful throughout the design process.

THU MAR 29 | 1:30-5 PM

080--Practical Guidelines for Signal Integrity and Board Layout

Speaker: Susy Webb, Fairfield Industries

Attendees. PCB designers and layout professionals.

This class is an introduction to the basic concepts used to lay out PCBs with good signal integrity and EMI control. We will discuss some basic electronic information (without math), why the issues are important to board designers, and practical ways to implement them into our PCBs. We will also discuss and illustrate good practices for general board layout, including placement, stackup, planes, routing and more to achieve successful designs. This class is a rework of the "Designing with your Thumbs" class with lots of new illustrations.

081--The Lead-Free Mandate and the Production Line

Speaker: Robert Hanson, Americom Seminars

Attendees: PCB designers, fabricators and anyone worried about the move to lead-free PCB assembly.

With the advent of the EU's RoHS and WEEE directives, the PCB industry must address the legal and technical ramifications ramifications nplAuswirkungen pl  of non-compliance. Legally, the main questions are: Who will catch violators and what type of penalty will they face? On the technical side, what type of failures can you expect on the production line because of printing or components? What are the recommended solder paste formulas for reflow (1) The process of heating and melting the solder that has been screen printed onto a printed circuit board in order to bond chips and other components to the board. Surface mount chips (SMT) use the reflow method. Contrast with wave soldering. See also reflowable text.  and wave? Attendees will learn the facts about issues such as high-temperature reflow and wave soldering reliability, quality, and aesthetics. The dilemma of tin whiskers See metal whiskers.  (including real-world tragedy case studies) will also be addressed.


082--PCB Design With Flip Chip Components

Speaker: Andy Kowalewski, Sychip

Attendees: Board designers who want an understanding of the special issues involved in design with flip-chip components This workshop will present a practical guide to the many issues facing the modern PCB designer, at a level suitable for the competent designer facing design miniaturization min·i·a·tur·ize  
tr.v. min·i·a·tur·ized, min·i·a·tur·iz·ing, min·i·a·tur·iz·es
To plan or make on a greatly reduced scale.

 challenges. It will cover critical tradeoffs related to boards using flip chips. Advantages and disadvantages of different types of packaging will be discussed and compared to flip-chip technology. Known good die and underfill issues will be covered, together with a detailed look at die rebumping for board mounting. Detailed consideration of board design, assembly and fabrication will be presented. Also covered will be lead-free and reliability issues.


083--The Fabrication Process and What the Designer Needs to Know

Speaker: Gary Ferrari, Firan Technology Group

Attendees: Anyone wishing to understand the fabrication process and the limitation it places on printed board design. Recommended for all levels.

Printed board design has evolved into a complex process, encroaching more into the engineering domain. There is greater concern for laminate electrical properties, smaller components and smaller board conductive conductive

having the quality of readily conducting electric current.

conductive flooring
flooring or floor covering made specially conductive to electrical current, usually by the inclusion of copper wiring that is earthed
 geometries. These factors have challenged the printed board fabricator to produce products with very tight registration, difficult to work with laminate materials, and almost impossible areas to test. The fabrication process has basically remained the same. However, designers need to be aware of the general process steps, new and old, and those areas where designs challenges the manufacturability of the board. This highly interactive session will cover the basic manufacturing steps and highlight those areas of most concern for the designer. Covered processes include double sided, multilayer, HDI, blind and buried vias, to name a few.

084--Materials for Lead-Free, High-Speed and High-Frequency Applications

Speaker: Rick Hartley, L-3 Communications, Avionics Systems

Attendees: PC designers, circuit design engineers, systems engineers and managers.

In a high-speed or high-frequency circuit, performance is dependent upon a number of characteristics and variables. Several of these issues are driven from the PCB's base material characteristics. At high frequencies materials can and do have a profound impact on performance. This course will discuss all of the base materials commonly used in high-speed digital and high-frequency analog circuits (including FR-4), looking at their advantages and disadvantages, and will detail how to calculate their impact on circuit performance, hence how to choose a cost-effective material for any specific application. Attendees will also learn how each of these materials fits into today's lead-free products.

speaker Biographies

KENNETH BAHL is president/owner of Sierra Proto Express. After working as an engineer for a number of companies, including Simmonds Precision and Honeywell, Bahl founded Sierra Proto Express in 1987, which has since become an industry leader in research and development and in creating bleeding-edge innovative PCB products.

JAMES C. BLANKENHORN is the founder and president of SMT Plus Inc and cofounder co·found  
tr.v. co·found·ed, co·found·ing, co·founds
To establish or found in concert with another or others.

 of the SMTA SMTA Surface Mount Technology Association
SMTA Standard Material Transfer Agreement
SMTA Subordinate Message Transfer Agent
SMTA Sewing Machine Trade Association (UK)
SMTA Sekolah Menengah Tingkat Atas
 organization in 1984. He has setup and managed assorted design centers and manufacturing plants and was the VP of design & prototypes for Jabil Circuit Jabil NYSE: JBL is a provider of electronic manufacturing services. Jabil designs and manufactures electronic circuit boards for major OEMs in a diverse group of industries including automotive, computing and storage, consumer products, medical, networking, peripherals and  Inc.

DR. ERIC BOGATIN is president of Bogatin Enterprises, LLC. He received his B.S. in physics from MIT MIT - Massachusetts Institute of Technology  and M.S. and Ph.D. in physics from the University of Arizona (body, education) University of Arizona - The University was founded in 1885 as a Land Grant institution with a three-fold mission of teaching, research and public service.  in Tucson. He has held senior engineering and management positions at Bell Labs, Raychem, Sun Microsystems Sun Microsystems, Inc. (NASDAQ: JAVA[3]) is an American vendor of computers, computer components, computer software, and information-technology services, founded on 24 February 1982. , Ansoft and Interconnect Devices.

DOUGLAS BROOKS Douglas Brooks is a professor of religion at the University of Rochester. External links
  • Looking for a Way Home for the Holidays New York Times - Looking for a Way Home for the Holidays
  • Karma and Creativity Journal of the American Academy of Religion
 has a BSEE BSEE
Bachelor of Science in Electrical Engineering
 and MSEE MSEE Master of Science in Electrical Engineering
MSEE Mean Square Estimation Error
MSEE Major Source Enforcement Effort
MSEE Materials Science and Electrical Engineering (Purdue University building) 
 from Stanford University Stanford University, at Stanford, Calif.; coeducational; chartered 1885, opened 1891 as Leland Stanford Junior Univ. (still the legal name). The original campus was designed by Frederick Law Olmsted. David Starr Jordan was its first president.  and a Ph.D. from the University of Washington. He has held positions in engineering, marketing and general management with Hughes Aircraft Hughes Aircraft Company was a major aerospace and defense company founded by Howard Hughes. The group was based near Ballona Creek, in Culver City, California, USA, on the Pacific Coast.

Hughes Aircraft was acquired by General Motors in 1985.
, Texas Instruments and ELDEC. In 1992 he formed UltraCAD Design Inc., a service bureau in Bellevue, WA.

MAX CLARK, vice president of engineering and customer service with Valor, holds a B.S. in electronic engineering from California Stale University at Fullerton and an MBA MBA
Master of Business Administration

Noun 1. MBA - a master's degree in business
Master in Business, Master in Business Administration
 in technology management from the University of Phoenix. Clark has 17 years of experience in the PCB industry, where he has held various assignments including application engineer, software developer, project consultant, and several management level positions.

GARY FERRARI is the owner of FTG FTG Fairchild Tropical Garden (Coral Gables, FL, USA)
FTG Firan Technology Group (Toronto, ON, Canada)
FTG Ferntree Gully (suburb, Australia)
FTG Free to Guest
 Circuits, a consulting firm Noun 1. consulting firm - a firm of experts providing professional advice to an organization for a fee
consulting company

business firm, firm, house - the members of a business organization that owns or operates one or more establishments; "he worked for a
 specializing in technical support and customized training. He is the past executive director and cofounder of the IPC Designers Council. He has over 38 years of experience in electronic packaging with an emphasis on PCB design and manufacturing.

MARK FINSTAD is principal applications engineer for Minco Products Inc. He has over 24 years of experience designing and manufacturing flexible printed circuits. He serves as the co-chair of IPC-2223 Design Standard for Flexible Printed Boards subcommittee.

MICHAEL FITTS is manager of customer development for Plexus' PCB Deisgn Services division. He has been involved in the design of HDI substrates since 1992. An EDA industry veteran, he worked for or distributed products from Mentor Graphics, Zuken, Innoveda and Veribest, and also owned an electronic engineering consulting company Noun 1. consulting company - a firm of experts providing professional advice to an organization for a fee
consulting firm

business firm, firm, house - the members of a business organization that owns or operates one or more establishments; "he worked for a

JOSEPH FJELSTAD, co-founder of SiliconPipe, has more than 33 years of experience in electronic interconnection and packaging technology. He is the author, co-author and editor of several books.

ROBERT HANSON, MSEE, is president of Americom Seminars. As a digital design engineer at Boeing, Rockwell, Honeywell and Loral, Hanson designed and provided prototype operational analysis on many high-speed designs, including PCBs, for the AWACS AWACS (Airborne Warning and Control System)

Mobile, long-range radar surveillance-and-control centre for air defense. Used by the U.S. Air Force since 1977, AWACS is mounted in a specially modified Boeing 707 aircraft, with its main radar antenna affixed to a rotating dome.
, B1-B, 747-400, missiles and ground support test equipment.

RICK HARTLEY is a senior design engineer and PCB specialist at L-3 Communication, Avionics Systems. He has 39 years of experience in the electronics industry and has dedicated the past 29 years to PCB and circuit development with emphasis on control of signal integrity and control of EMI, in both digital and RF PCBs.

TOM HAUSHERR is CEO and director of technology for PCB Libraries Inc. and an IPC Advanced Certified Designer CID Cid or Cid Campeador (sĭd, Span. thēth kämpāäthōr`) [Span.,=lord conqueror], d. 1099, Spanish soldier and national hero, whose real name was Rodrigo (or Ruy) Díaz de Vivar. +. He helped IPC develop the IPC-7351 land pattern calculator. He owned and operated a PCB layout service bureau for 12 years and developed of over 2,000 PCB products for RF, analog, digital, front panel, power supply, back panel, test fixture
This article is about the programming concept. For other uses, see Fixture (disambiguation).

Test fixture refers to the fixed state used as a baseline for running tests in software testing.
 and mixed technology boards.

HAPPY HOLDEN is senior technologist at Mentor Graphics Corp. He previously worked at Asian Pacific Materials Westwood Associates, at TechLead Corp. and Merix. He retired from Hewlett-Packard in 1996. He holds a B.S. in chemical engineering and an M.S. in computer science from Oregon State University Oregon State University, at Corvallis; land-grant and state supported; coeducational; chartered 1858 as Corvallis College, opened 1865. In 1868 it was designated Oregon's land-grant agricultural college and was taken over completely by the state in 1885. .

KEN HOLMAN is a principal staff engineer with Motorola in Boxborough Massachusetts working on DRAM based Video On Demand servers. His role in board design is primarily in the analysis of high speed effects and constraint management. He holds a bachelor of science Noun 1. Bachelor of Science - a bachelor's degree in science

bachelor's degree, baccalaureate - an academic degree conferred on someone who has successfully completed undergraduate studies
 degree from Union College in Schenectady, NY.

GREG HORLICK is a product engineer with Cadence Design Systems. He has 20+ years of experience using and developing autorouters for Cadence, Mentor, Interconnectix, Zuken Visula, and PCAD PCAD Pennsylvania College of Art & Design (Lancaster, PA)
PCAD Parents of Children of African Descent
PCAD Palliative Care for Advanced Disease
PCAD Pointing Control and Attitude Determination
PCAD Premature Coronary Artery Disease

DR. BARRY JOHNSON is a member of the board of directors of Innalabs Holding Inc. of Reston, VA. He has almost 40 years experience in the electronics and electro-optics industry, including serving for some years as a professor of electrical engineering at the University of Alabama The University of Alabama (also known as Alabama, UA or colloquially as 'Bama) is a public coeducational university located in Tuscaloosa, Alabama, USA. Founded in 1831, UA is the flagship campus of the University of Alabama System.  in Huntsville. Johnson is also the chief technology officer of the affiliated company CyberAir Technologies Inc. and president of its subsidiary PanTechne Corp.

VIKAS KOHLI is working as an architect, Silicon Package Board Division, Cadence Design Systems, Noida. He has worked on tools for schematic capture schematic capture - The process of entering the logical design of an electronic circuit into a CAE system by creating a schematic representation of components and interconnections. , design rule checking, and schematic synthesis. He is the architect for the Allegro (operating system) Allegro - The code name for the major Mac OS release due in mid-1998.
 Design Editor, multi-design capture environment offering in PCB. He holds a B.S. in Computer Engineering from NSIT NSIT Networking Services and Information Technologies (University of Chicago)
NSIT Nova Scotia Institute of Technology
NSIT Not Safe In Taxis
NSIT Netaji Subash Institute of Technology
NSIT Network Systems and Information Technology
, Delhi and a M.S. in Computer Science, University of California The University of California has a combined student body of more than 191,000 students, over 1,340,000 living alumni, and a combined systemwide and campus endowment of just over $7.3 billion (8th largest in the United States). .

ANDY KOWALEWSKI is a senior engineer with SyChip Inc. He has 35 years experience in electronics, particularly avionics, and is the former owner of a PCB design bureau. He is a member of the IPC Designers Council executive board and education committee and helped establish the advanced designer certification course. He is certified at the advanced CID+ level and is a certified master instructor.

RICK LOVE has worked with Alpha Metals since 1980. In 2003, he began an intense focus on the lead-free initiatives coming out of the EU (RoHS), and has led the responsibility for technical support for lead-free transition in the Western Region. Love is one of a core team within Cookson Electronics that has received training across technologies to integrate and capitalize on Cap´i`tal`ize on`   

v. t. 1. To turn (an opportunity) to one's advantage; to take advantage of (a situation); to profit from; as, to capitalize on an opponent's mistakes s>.
 Cookson's expertise in laminates surface finishes, and assembly materials. Love is a graduate of San Jose San Jose, city, United States
San Jose (sănəzā`, săn hōzā`), city (1990 pop. 782,248), seat of Santa Clara co., W central Calif.; founded 1777, inc. 1850.
 State University.

GREG ROBERTS is the director of marketing at EMA Design Automation where he is responsible for all marketing activities for the company. He has over 15 years of experience in the EDA industry, including both marketing and software development roles at EMA, Cadence, OrCAD and MicroSim. Roberts holds a B.S. in information and computer science from the University of California, Irvine.

RICHARD SNOGREN holds a B.S. in chemistry and biology from Western Michigan University Western Michigan University, at Kalamazoo, Mich.; coeducational; founded in 1903 as Western State Normal School, became accredited in 1927 as a college, gained university status in 1957. . He was an aerospace materials engineer, managed the electronic packaging and PCB design groups for Martin Marietta Martin Marietta Corporation was founded in 1961 through the merger of The Martin Company and American-Marietta Corporation. The combined company became a leader in aggregates, cement, chemicals, aerospace, and electronics.  Astronautics astronautics: see space science.
Flash Gordon

space-traveling hero. [Am. Comics and Cin.: Halliwell]

From the Earth to the Moon
, and spent 25 years in the aerospace sector of the PCB industry. He was co-founder of SAS (1) (SAS Institute Inc., Cary, NC, A software company that specializes in data warehousing and decision support software based on the SAS System. Founded in 1976, SAS is one of the world's largest privately held software companies. See SAS System.  Circuits, now Coretec Denver. Snogrea is an active participant in the embedded passives test bed project of NSWC Noun 1. NSWC - the agency that provides scientific and engineering and technical support for all aspects of surface warfare
Naval Surface Warfare Center
 Crane's Emerging Critical Interconnect Technology Program (ECIT ECIT Enhanced Combat Information Terminal
ECIT Essential Care in Theater
ECIT Enhanced Communication Interface Terminal

DOUG SOBER has over 27 years experience in formulating epoxy epoxy

Any of a class of thermosetting polymers, polyethers built up from monomers with an ether group that takes the form of a three-membered epoxide ring. The familiar two-part epoxy adhesives consist of a resin with epoxide rings at the ends of its molecules and a curing
 systems for composites primarily in base materials for printed board applications. He is currently a marketing specialist--epoxy with Kaneka Texas Corp. Previously, Sober was the North American North American

named after North America.

North American blastomycosis
see North American blastomycosis.

North American cattle tick
see boophilusannulatus.
 Sales Manager sales manager ngerente m/f de ventas

sales manager ndirecteur commercial

sales manager sale n
 for Bakelite Epoxy Polymers. He has been the Base Materials General Chairman for the IPC since 1992. He is currently the vice-chairman of the Laminate and Prepreg Materials Subcommittee and the chairman of the Halogen halogen (hăl`əjĕn) [Gr.,=salt-bearing], any of the chemically active elements found in Group 17 of the periodic table; the name applies especially to fluorine (symbol F), chlorine (Cl), bromine (Br), and iodine (I).  Free Task Group.

JOSEPH SOCHA is CTO (Chief Technical Officer) The executive responsible for the technical direction of an organization. See CIO and salary survey.  and technical lead for Sedona International. He graduated from Merrimack College Merrimack College is a small private, liberal arts, Catholic college in North Andover, Massachusetts, located on Route 114. It was founded in 1947 by Augustinians. Approximately 2,100 full-time and 300 evening students from more than 26 states and 17 countries are enrolled at  with a BSEE in 1980. As an engineer, Socha designed equipment for computer systems, robotics, oceanography oceanography, study of the seas and oceans. The major divisions of oceanography include the geological study of the ocean floor (see plate tectonics) and features; physical oceanography, which is concerned with the physical attributes of the ocean water, such as , and control systems. Over the last 15 years, he has specialized in signal integrity, timing analysis and high-speed design. Prior to becoming a principle in Sedona International, He managed the Signal Integrity group for Plexus.

VERN SOLBERG is an independent consultant specializing in surface-mount and microelectronic design and assembly. Formerly with Tessera tessera: see mosaic. , the company that developed the [micro]BGA, Solberg holds several patents for IC packaging innovations (including folded-flex 3D package technology). Solberg has more than 35 years of experience in areas related to design and manufacturing for both commercial and aerospace electronic products.

ROBERT TARZWELL is chief technology officer of Sierra Proto Express. Tarzwell has owned a number of PCB facilities in his career. Considered to be the industry's foremost technology inventor, Tarzwell has produced a number of bleeding-edge products, including heavy copper PCBs and flex boards and high-reliability lead-free boards that are virtually indestructible.

MARK VERBRUGGE is an applications engineer for Minco Products Inc. He has over 20 years experience designing and manufacturing flexible printed circuits.

SUSY WEBB is a senior PCB designer with 28 years of design experience. She has worked in a variety of fields, including point-to-point microwave network systems, oceanographic oil exploration equipment, and CPCI See CompactPCI.  and ATX See ATX motherboard.

(hardware, standard) ATX - An open PC motherboard specification by Intel.

ATX is a development of the Baby AT specification with the motherboard rotated 90 degrees in the chassis.
 computer motherhnards. She is CID certified, and is an active member of the IPC Designers Council, currently working as a member of its national executive board, high-speed and education committees.

JO WYNSCHENK is an electronics industry specialist with over 40 years experience in PCB fabrication and chemical processes. He has owned his own printed circuit facility and worked for a number of PCB materials suppliers over the past 30 years. He currently consults on special projects related to RoHS.

Headquarters Hotel

Hyatt Regency Santa Clara

5101 Great America Great America is a name shared by two American amusement parks opened by the Marriott Corporation in 1976.

Both parks are now under different ownership and are known as:
  • Great America (California) - Santa Clara, California, now owned by Cedar Fair.

Santa Clara, CA 95054

T 800-233-1234 or


PCB West 2007 single/double room rate: $179.00 *

* When booking this hotel, you must use the telephone number listed above. Be sure to mention the group name "PCB West" to receive the group rate, which is subject to prevailing state and local taxes at the time of your arrival. The group rate is guaranteed, based upon room availability, until March 5, 2007, at 5 pm PT. Check-in time is 3 pm. The Hyatt Regency Santa Clara is connected to the Santa Clara Convention Center.

Located in the center of SiliconValley, the Hyatt Regency Santa Clara offers the utmost in convenience to the business traveler. Guest services include high-speed Internet See broadband. , cable-TV with on-demand movies, valet parking valet parking
Parking arrangements provided by a commercial establishment, such as a restaurant, whereby patrons leave their cars at the entrance and attendants park and retrieve them.

Noun 1.
, concierge services, a swimming pool, an indoor exercise facility and guest privileges The rights and permissions given to a non-registered user of a system or service. See guest.  at the adjacent Santa Clara Golf & Tennis Club. For more information, visit the hotel Web site.

Exhibition & Conference Center

The Santa Clara Convention Center

5001 Great America Parkway

Santa Clara, CA 95054

T 408-748-7000

Parking: FREE for show attendees


Car Rental Information

Avis is the official car rental agency for PCB West. Call 800-331-1600 or visit to rent a car. Refer to Avis Worldwide Discount (AWD AWD Alive with–disseminated and/or metastatic disease ) #D900888 when making your reservation to receive our special meeting rate.

Driving Directions

Mineta San Jose International Airport For the Costa Rican airport, see .

Norman Y. Mineta San Jose International Airport (IATA: SJC, ICAO: KSJC, FAA LID: SJC) is a medium-sized airport in San Jose, California.
 is located a short cab ride from the hotel and convention center. For driving directions from Mineta San Jose International Airport, San Francisco International Airport Coordinates:

“SFO” redirects here. For other uses, see SFO (disambiguation).

For the television series, see .
 or Oakland International Airport
OAK redirects here. You may have been looking for Oak, the species of trees and shrubs. See also Oak (disambiguation).

Oakland International Airport (IATA: OAK, ICAO: KOAK, FAA LID: OAK), also known as
, visit For information about alternate transportation--including local light rail--visit

Registration Information


PCB West 2007 is pleased to offer the following discounts to qualifying attendees, depending on the package purchased. Except for the Early-Bird Discount, all other discounts are only available by phone. Call the registration desk at 918-496-1476 for more information or to register using these discounts.

Early-Bird Discount--Anyone who registers by March 5, 2007, for the Registration Packages shown at right will automatically receive $100 off regular tuition pricing.

Alumni and Association/User Group Discount--Alumni of a previous PCB Design Conference (West or East) or members of IPC Designers Council and/ or another recognized industry user group are eligible for a discount of $50 US on 3, 4 or 5-day packages only.

Group Discount--Companies registering 3 or more attendees at the same time for 4-Day or 5-Day Special Value Passports are eligible to receive a $100 discount per attendee, deducted from the applicable package pricing (Early-Bird or regular). All three (or more) registration forms must be received or called in together. This discount may not be used in conjunction with the Alumni and Association/User Group discount. Please note: group discounts are not available through online registration. Call 918-496-1476 for more information.


Registration--Complete one Registration Form for each registrant An individual or organization that signs up (registers) for a training class or service. See domain name registrar. . All 5 sections must be completed.

Payment--Payment must be made by credit card, check or Purchase Order. Registrations without complete payment information will not be processed. Credit Card payments will show a charge from UP Media Group. If paying by PO, please include a $25 US processing fee per PO in addition to the registration package fees. A signed and dated PO (complete with a PO#) and/or full payment must be received prior to the conference in order for the attendee to be admitted into classes. For more information about our payment policies, call 918-496-1476.

Refunds and Cancellations--All refund requests must be made in writing by fax or mail to PCB Design Conference West no later than February 26, 2007. Mail refund requests to: PCB West, Attn. AS, 2400 Lake Park Drive, Suite 440, Smyrna, GA 30080. Fax to 678-589-8850 or e-mail your refund or cancellation request to "No shows" who have not made a written request by Feb. 26, 2007, are fully liable for conference tuition/fees. Registrations made after Feb. 26 are considered confirmed and no refund requests will be accepted; registrants will be fully liable for conference tuition/fees and will be invoiced accordingly. Program Changes--The technical program of PCB West 2007 is subject to change should unforeseeable Un`fore`see´a`ble

a. 1. Incapable of being foreseen.

Adj. 1. unforeseeable - incapable of being anticipated; "unforeseeable consequences"
unpredictable - not capable of being foretold

 circumstances arise with respect to individual speakers. Check the PCB West Web site for the latest updates on sessions and speakers

ADA Ada, city, United States
Ada (ā`ə), city (1990 pop. 15,820), seat of Pontotoc co., S central Okla.; inc. 1904. It is a large cattle market and the center of a rich oil and ranch area.
 Accommodations--If you require special accommodations as outlined under the ADA, please contact Alyson Skarbek, Show Manager, at 678-589-8865 by Feb. 26, 2007.


After you look through the list of Professional Development and Technical Conference courses on pages 6-11, you'll need to decide which registration package best fits your needs and your budget. You'll also have to register for specific courses. To help you make this decision, each package is described in detail below. For pricing, see the Registration Form on page 15. If you have questions about our packages, discounts or policies, please contact the Registration Desk at 918-496-1476.


* One-Day Tutorial Only Passport--Includes a one-day tutorial, course handouts, lunch and Certificate of Completion, plus admission to the, Wine and Cheese Mixer (if attending Monday), FREE Tuesday sessions, two-day exhibition, and the Opening Night Networking Extravaganza, which includes Happy Hour, Casino Night and the Dawg House Lounge. See page 15 for pricing. Note: Alumni and Association/User Group, and Group discounts do not apply for this package.

* Two-Day DEC Only Passport--Includes a two-day Design Excellence Curriculum (DEC) course, course handouts, lunch (both days) and Certificate of Completion, plus admission to the Wine and Cheese Mixer, FREE Tuesday sessions, two-day exhibition and the Opening Night Networking Extravaganza, which includes Happy Hour, Casino Night and the Dawg House Lounge. See page 15 for pricing. Note: Alumni and Association/User Group, and Group discounts do not apply for this package.


* 1-Day Technical Conference Passport--Includes your choice of morning and afternoon sessions during a single day of the Monday, Wednesday and Thursday Technical Conference, plus FREE Tuesday sessions and admission to the two-day exhibition and the Opening Night Networking Extravaganza, which includes Happy Hour, Casino Night and the Dawg House Lounge. See page 15 for pricing. Note: Alumni and Association/User Group, and Group discounts do not apply for this package.

* 3-Day Technical Conference Passport--Includes your choice of sessions during the entire Monday, Wednesday and Thursday Technical Conference, Wine and Cheese Mixer, plus FREE Tuesday sessions and admission to the two-day exhibition and the Opening Night Networking Extravaganza, which includes Happy Hour, Casino Night and the Dawg House Lounge. See page 15 for pricing.


* 4-Day Special Value Passport (a terrific education value)--Includes any combination of Professional Development courses and Technical Conference sessions taken during five days (choose from SUN/MON/WED/THU or MON/WED/THU/FRI), Wine and Cheese Mixer, plus FREE sessions on Tuesday and admission to the two-day exhibition and the Opening Night Networking Extravaganza, which includes Happy Hour, Casino Night and the Dawg House Lounge. (Note: Professional Development Tutorials and DEC courses include lunch.) See page 15 for pricing.

* 5-Day Special Value Passport (the most bang for your buck)--Includes any combination of Professional Development courses and Technical Conference sessions (SUN/MON/WED/THU/FRI)--you decide--Wine and Cheese Mixer, plus FREE Tuesday sessions and admission to the to the Welcome Luncheon, two-day exhibition and the Opening Night Networking Extravaganza, which includes Happy Hour, Casino Night and the Dawg House Lounge. (Note: Professional Development Tutorials and DEC courses include lunch.) See page 15 for pricing.


* Exhibition Only Package--Includes admission to the FREE Tuesday sessions, twoday exhibition on Tuesday and Wednesday and the Opening Night Networking Extravaganza, which includes Happy Hour, Casino Night and the Dawg House Lounge.
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Publication:Printed Circuit Design & Manufacture
Date:Jan 1, 2007
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