Optimal Corporation Expands System-in-Package Analysis With Chip-Package-PCB Co-Design Capabilities.New Features Include Enhanced Chip-Package Models, Unified SiP, Package-PCB Modeling, Dynamic IR Visualization SAN JOSE San Jose, city, United States San Jose (sănəzā`, săn hōzā`), city (1990 pop. 782,248), seat of Santa Clara co., W central Calif.; founded 1777, inc. 1850. , Calif. -- Optimal Corporation, a leader in IC package and PCB PCB: see polychlorinated biphenyl. PCB in full polychlorinated biphenyl Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound. signal, power and thermal integrity analysis, announced enhanced capabilities to its Optimal SiP Analysis Suite, software for System-in-Package (SiP) design, with the addition of chip-package-PCB co-design support. Among the latest features are improved SiP and package models for automatic port mapping See port forwarding. between chip and package analysis, the ability to combine SiP, package and PCB models with a common meshing approach and dynamic IR visualization. Introduced earlier this year, the Optimal SiP Analysis Suite models complex structures, including mixed flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done and wirebond assemblies, die stacks with interposers and spacers, double-sided assemblies and perforated per·fo·ra·ted adj. Pierced with one or more holes. power planes. Complexity is driving the move to SiP design as more I/Os are switching at higher frequencies and the availability of new 3D physical structures. Additionally, designs need to offer better functional density -- that is, more chips in a package operating at lower voltages while consuming more power. "SiP design demands that chip, package and PCB designers collaborate effectively if they are to satisfy market requirements," says Dave DeMaria, chief executive officer of Optimal Corporation. "Through co-design, our latest capabilities enable unified 3D signal and power integrity analysis of the integrated system for lower costs while meeting performance targets." Chips, SiPs, IC Packages Don't Float in Space Today's chips are assembled onto packages or SiPs. While delivering clean power to a chip's core and I/O (Input/Output) The transfer of data between the CPU and a peripheral device. Every transfer is an output from one device and an input to another. See PC input/output. I/O - Input/Output ring is critical for timing, most IC power analysis is done with component models that do not accurately reflect the complex interaction of the SiP, package and PCB system. Optimal's SiP and package models represent real-world boundary conditions for IC power analysis and the models streamline integration with IC power analysis thanks to the automatic mapping of ports between the chip and package. Used with IC power analysis and optimization tools such as Apache's RedHawk-EV, the capability gives engineers added confidence in simulation accuracy and subsequent correlation between simulation and measurement. A common approach to SiP design is to stack packaged die -- package-on-package (PoP) or package-in-package (PiP) -- because the "Known Good Die" problem is caused by an inability to test a bare die See bare chip. completely before assembly. The final component is assembled onto a PCB but, at high frequencies, different physical component boundaries don't always equate to good electrical model boundaries. The Optimal SiP Analysis Suite merges geometry from package, SiP and PCB designs and then uses a common meshing approach across all fabrics for unified signal, power and simultaneous switching noise (SSN SSN abbr. Social Security Number ) model generation. System designers struggle over where to place decoupling capacitors (decaps) for optimized circuit performance. The traditional approach of throwing decaps across a wide frequency spectrum is costly and wasteful. And, modeling the board, package and die as separate structures, with independent decap requirements, is impractical for a cost-conscious product plan. Optimal's dynamic IR visualization analyzes the power delivery system, locates resonances and identifies appropriate capacitance values for the optimal number and placement of capacitors for the design. Pricing and availability The Optimal SiP Analysis Suite, integrated into all the major SiP design flows, is priced starting at $65,000 (U.S.) per seat for a perpetual license and runs on the Windows operating system operating system (OS) Software that controls the operation of a computer, directs the input and output of data, keeps track of files, and controls the processing of computer programs. . About Optimal Corporation Optimal Corporation is the leader in 3D power, signal and thermal integrity analysis for IC Package, System-in-Package (SiP) and PCB design. Its innovative solutions enable design teams to concurrently analyze and optimize the IC with the package and the packaged IC on the PCB. By providing high-performance, ease-of-use and pinpoint accuracy, Optimal's solutions allow engineers to quickly create designs optimized for power and signal integrity. Through seamless integration An addition of a new application, routine or device that works smoothly with the existing system. It implies that the new feature or program can be installed and used without problems. Contrast with "transparent," which implies that there is no discernible change after installation. with all of the major CAD design flows, its solutions help customers achieve fast and efficient design time. Optimal's technology is embedded within the Cadence Allegro (operating system) Allegro - The code name for the major Mac OS release due in mid-1998. http://devworld.apple.com/mkt/informed/appledirections/mar97/roadmap.html. design flow and endorsed in the TSMC TSMC Taiwan Semiconductor Manufacturing Company, Ltd TSMC Taiwan Semiconductor Manufacturing Corporation TSMC Traffic Systems Management Center TSMC Toll Station Management Controller TSMC Transportation Supply Maintenance Command TSMC Technical Services Manager Code Reference Flow. Optimal, founded in 1995, is a TSMC Technology Alliance Partner and a member of the Cadence Connections Emerging Solutions Program. Optimal Corporation is located at: 6980 Santa Teresa Santa Teresa may refer to:
Optimal Corporation and the Optimal logo are trademarks of Optimal Corporation. Optimal Corporation acknowledges trademarks or registered trademarks of other organizations for their respective products and services. |
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