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Oki Group, World's First to Launch Thin-Film-Bonding Technology in Volume; Technology to Bond Dissimilar Materials Accelerates Fabrication of High-Density Compound Circuit Devices.


TOKYO -- Oki Electric Industry Co., Ltd. (TOKYO:6703) and OKI Printing Solutions (the brand name for Oki Data Corporation), today announced that they have developed "Epi Film Bonding" (EFB EFB Electronic Flight Bag (aircraft/crew computing device)
EFB European Federation of Biotechnology
EFB English for Business
EFB Esbjerg Forenede Boldklubber (Esbjerg, Denmark soccer club) 
) technology in which thin films are released and bonded on dissimilar materials. Oki Group is the world's first to succeed in high volume production of LED printheads using the EFB technology.

OKI Printing Solutions developed its unique LED array chips for LED printer printheads. In conventional LED printheads, LED array chips and integrated circuit integrated circuit (IC), electronic circuit built on a semiconductor substrate, usually one of single-crystal silicon. The circuit, often called a chip, is packaged in a hermetically sealed case or a nonhermetic plastic capsule, with leads extending from it for  (IC) driver chips are mounted on a printed circuit board and are connected by bonding wires. However, high-density wire bonding Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication.

The wire is generally made up of one of the following:
  • Gold
  • Aluminum
  • Copper
 and large bonding pads limit the density of LED arrays and printing resolutions.

In the newly developed EFB technology, epifilm LED array chips are bonded with the Si IC wafer by utilizing the intermolecular Adj. 1. intermolecular - existing or acting between molecules; "intermolecular forces"; "intermolecular condensation"  bonding force. This allows us to produce higher-density and higher-layer semiconductor devices, leading to various high-speed and low-power compound devices. Oki Group also made efforts in shrinking the size of driver IC chips and LED array chips, reducing the density of bonding wires, and reducing the number of chips. The EFB technology also leads to reduced fabrication fabrication (fab´rikā´shn),
n the construction or making of a restoration.
 cost and material cost.

The C3400n, OKI Printing Solutions' high-speed and compact color LED printer adopts the new LED head printheads.

"Epi Film Bonding is a promising technology for the integration of dissimilar materials," said Mikihiko Maeno, President and CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board.  of Oki Data Corporation. "The volume of the new 600dpi LED printhead printhead ncabeza impresora

printhead ntĂȘte f d'impression

printhead print nDruckkopf m
 is half of that of the conventional LED printheads, and will be equipped in our color and monochrome LED printers that are planned for shipment. By developing this technology further, OKI Printing Solutions plans to develop ultra small printheads of 1200dpi or more to enable higher resolution printing."

Oki Electric, on the other hand, will continue to research this technology to provide smaller, lower power consumption and lower cost semiconductor ICs. Employing the EFB technology eliminates the wire bonding and die-bonding processes, which enable Oki to manufacture higher density compound devices using only photolithography A lithographic technique used to transfer the design of circuit paths onto printed circuit boards as well as the circuit paths and electronic elements of a chip onto a wafer's surface.

A photomask is created with the design for each layer of the board or wafer (chip).
 processes. In addition, Oki plans to research super small LED displays.

"EFB technology enables us to make higher density, multi-layered, faster speed, and lower power consumption semiconductors, which brings possibilities in developing various compound circuit ICs," said Harushige Sugimoto, Senior Vice President and Chief Technology Officer at Oki Electric. "Because this technology has so much potential, we will apply this technology beyond semiconductors. We have launched a research unit that includes our R&D team and other affiliated companies Affiliated Companies

A situation that occurs when one company owns a minority interest (less than 50%) in another company.

Also refers to companies that are related to each other in some way.

Notes:
An affiliated company is sometimes referred to as a subsidiary.
 to look into adopting this technology to bond dissimilar materials."

Oki Group will announce this technology at the International Conference on Solid State Devices and Materials (SSDM SSDM South Sinai Association for Diving and Marine Activities (South Sinai, Egypt)
SSDM Soft System Dynamics Methodology
SSDM International Symposium on Semiconductor Devices and Materials
SSDM Structured System Development Methodology
 2006) in Yokohama Japan, starting from September 13, and at the 22nd International Conference on Digital Printing Technologies, and Digital Fabrication 2006 in Denver, Colorado, starting from September 17, 2006. Oki's paper on the EFB technology was published in Electronics Letters Electronics Letters is a journal of the Institution of Engineering and Technology, specializing in short communications on optical electronics. External links
  • http://scitation.aip.org/dbt/dbt.jsp?KEY=ELLEAK
 Vol. 42, issue 15, on July 20, 2006.

About Oki Electric Industry Co., Ltd.

Founded in 1881, Oki Electric Industry Co., Ltd. is Japan's first telecommunications manufacturer, with its headquarters in Tokyo, Japan. With the corporate vision, "Oki, Network Solutions for a Global Society," Oki provides top-quality products, technologies and solutions to its customers through its info-telecom system business, semiconductor business and printer business. All three businesses function as a collective force to create exciting new products and technologies that satisfy a spectrum of customer needs in various markets. Visit Oki's global web site at http://www.oki.com/.

About OKI Printing Solutions (Brand name for Oki Data Corporation)

Founded in 1994, Oki Data Corporation is Japan's printer/MFP manufacturer, with its headquarters in Tokyo, Japan. Oki Data Corporation provides top-quality products, technologies and solutions to its customers through its printers and Multi-Function-Peripherals. Through its business activities, Oki Data Corporation satisfies a spectrum of customer needs in various markets. Visit OKI Printing Solutions' website at www.okiprintingsolutions.com.

Notes:

--Part of this research has been conducted by the Research Center for Nanodevices and Systems at Hiroshima University Hiroshima University (広島大学 Hiroshima Daigaku , which was supported by The Ministry of Education, Culture, Sports, Science and Technology's Nano Technology Support Project.

--All names of companies and products are trademarks or registered trademarks of the respective companies and organizations.
COPYRIGHT 2006 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2006, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Comment:Oki Group, World's First to Launch Thin-Film-Bonding Technology in Volume; Technology to Bond Dissimilar Materials Accelerates Fabrication of High-Density Compound Circuit Devices.
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Date:Sep 7, 2006
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