Novel Front-end Manufacturing Technologies to Support Advances in the Semiconductor Industry.PALO ALTO Palo Alto, city, California Palo Alto (păl`ō ăl`tō), city (1990 pop. 55,900), Santa Clara co., W Calif.; inc. 1894. Although primarily residential, Palo Alto has aerospace, electronics, and advanced research industries. , Calif. -- Demand for new and improved front-end semiconductor manufacturing technologies such as wafer cleaning and thin layer deposition is expected to stem from the rapid advancements in the integrated chip (IC) industry. "Innovative wafer cleaning technologies, in particular, are crucial to meet the needs for finer fabrication fabrication (fab´rikā´sh  n),n the construction or making of a restoration. , higher integration densities, and faster speeds of shrinking device features that support greater functionalities," observes Frost & Sullivan Research Analyst Sivakumar Muthuramalingam. If you are interested in a virtual brochure, which provides manufacturers, end-users and other industry participants an overview of the latest analysis of the World Front-end Semiconductor Manufacturing Technologies - then send an email to Melina Gonzalez- Corporate Communications Corporate communications is the process of facilitating information and knowledge exchanges with internal and key external groups and individuals that have a direct relationship with an enterprise. at melina.gonzalez@frost.com with the following information: your full name, company name, title, telephone number, fax number and email. Upon receipt of the above information, an overview will be sent to you via e-mail. Moreover, new processes and technology solutions in wafer cleaning have become essential to meet the International Technology Roadmap for Semiconductors The International Technology Roadmap for Semiconductors is a set of documents produced by a group of semiconductor industry experts. These experts are representative of the sponsoring organisations which include the Semiconductor Industry Associations of the US, Europe, Japan, (ITRS ITRS International Technology Roadmap for Semiconductors ITRS International Terrestrial Reference System ITRS International Transaction Reporting System (EU) ITRS International Technical Rescue Symposium ) requirement for reduced surface contamination in the form of foreign metals, micro-roughness, watermarks, and silicon loss. "Presence of these foreign objects and contaminants degrade the device quality and reliability - ultimately affecting the overall device yield," says Muthuramalingam. While silicon wafer wet cleaning  This article or section needs copy editing for grammar, style, cohesion, tone and/or spelling.You can assist by [ editing it] now. is the most widely accepted solution for mainstream chip manufacturing due to its robustness and its feature of being a risk-free process, sub-100nm technologies require non-etching and damage-free techniques for precise interface control. Novel wafer cleaning techniques such as supercritical Adj. 1. supercritical - (especially of fissionable material) able to sustain a chain reaction in such a manner that the rate of reaction increases critical - at or of a point at which a property or phenomenon suffers an abrupt change especially having enough mass CO2 (ScCO2) are under development and show great promise as mainstream cleaning processes due to their high density, low viscosity, and negligible surface tension. ScCO2 technology is likely to enable the semiconductor industry with an integrated solution for the post-etch residue cleaning and the drying of porous low-k materials. It is flexible since it uses specialty additives to target specific applications such as photo resist image collapse prevention, next-generation lithography Next-Generation Lithography (NGL) is a term used in integrated circuit manufacturing to describe the lithography technologies slated to replace photolithography beyond the 32 nm node. photo mask cleaning, and particle removal. In the deposition industry, advances in separation by implantation of oxygen (SIMOX See SOI. ), atomic layer deposition A semiconductor manufacturing technique that deposits a single layer on a chip that is only one atom or one molecule thick. As elements on a chip decreased to below 100 nm, this essential technology for making the chip ever smaller became commercial after the turn of the 21st century. (ALD ALD abbr. adrenoleukodystrophy ALD, n.pr See adrenoleukodystrophy. ALD aldolase. ) for advanced nodes, and plasma source Plasma sources generate plasmas. Excitation of a plasma requires partial ionisation of neutral atoms and/or molecules of a medium. There are several ways to cause ionisation: collisions of energetic particles, strong electric fields acting on bond electrons, or ionising ion implantation Ion implantation A process that utilizes accelerated ions to penetrate a solid surface. The implanted ions can be used to modify the surface composition, structure, or property of the solid material. (PSII PSII Plasma Source Ion Implantation ) are expected for meeting the specific needs of sub-100 nm devices. With regard to the SIMOX technology, the relatively immature state of modeling silicon-on-insulator (SOI (Silicon On Insulator) A chip architecture that increases transistor switching speed by reducing capacitance (build-up of electrical charges in the transistor's elements), and thus reducing the discharge time. The power requirement is also reduced in some designs. ) devices poses a significant challenge. Researchers are currently developing refined metrology tools to address this issue. While there have been significant advancements in wafer cleaning and thin layer deposition, these techniques must demonstrate tangible advantages over the prevalent competing technologies for quicker acceptance in the market. Proper cooperation with material suppliers, manufacturing equipment suppliers and semiconductor manufacturers is critical to select the appropriate applications that fully exploit the uniqueness of the technology. Further, the success of commercializing these next-generation manufacturing equipment and technologies depends on the quantum of applied and product-oriented research. "The continual advancements in front-end semiconductor manufacturing depends not only on equipment design and improvements, but also on the development of innovative materials and associated processing that defines the overall device circuitry," concludes Muthuramalingam. World Front-end Semiconductor Manufacturing Technologies is part of the Semiconductor vertical subscription service (D918), and examines the global trends and developments in next-generation front-end semiconductor manufacturing technologies. It provides an industry-wide perspective on promising areas of front-end semiconductor manufacturing such as etching/wafer wet processing and thin-film deposition. The study also analyzes the key technology drivers and evaluates the challenges that must be overcome for each novel manufacturing technology to realize its potential. Apart from key technology drivers, it also provides an evaluation of the challenges facing various packaging technologies. Executive summaries and interviews are available to the press. Technical Insights is an international technology analysis business that produces a variety of technical news alerts, newsletters, and research services. Frost & Sullivan, a global growth consulting company founded in 1961, partners with clients to create value through innovative growth strategies. The foundation of this partnership approach is our Growth Partnership Services platform, whereby we provide industry research, marketing strategies, consulting and training to our clients to help grow their business. A key benefit that Frost & Sullivan brings to its clients is a global perspective on a broad range of industries, markets, technologies, econometrics, and demographics. With a client list that includes Global 1000 companies, emerging companies, as well as the investment community, Frost & Sullivan has evolved into one of the premier growth consulting companies in the world. For more information please visit www.frost.com World Front-end Semiconductor Manufacturing Technologies D327 Keywords in this release: front-end semiconductor manufacturing technologies, wafer cleaning, thin layer deposition, integrated chip, IC, International Technology Roadmap for Semiconductors, ITRS, surface contamination, silicon wafer/substrate wafer cleaning, sub-100nm technologies, non-liquid wafer cleaning techniques, supercritical CO2, ScCO2, post-etch residue cleaning, photo resist image collapse prevention, next-generation lithography photo mask cleaning, separation by implantation of oxygen, SIMOX, atomic layer deposition, ALD, plasma source ion implantation, PSII, silicon-on-insulator, SOI, metrology tools |
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