New Ultra Low-k SPEEDFILM BX IC Dielectric Now Available from Gore; New BX Material Offers Enhanced Properties, Lowering IC Production Costs.EAU CLAIRE Eau Claire (ō klâr), city (1990 pop. 56,856), seat of Eau Claire co., W central Wis., on the Chippewa at the mouth of the Eau Claire River, in a hilly lake region; inc. 1872. , Wis.--(BUSINESS WIRE)--Sept. 7, 1999-- W. L. Gore and Associates W. L. Gore and Associates is the maker of Gore-Tex fabrics. The company was founded in 1958 by Bill Gore and his wife Genevieve in Newark, Delaware. Gore had been a research scientist working with fluoropolymers at DuPont. announced today prototype availability of its new SPEEDFILM(TM) BX IC Dielectric, an ultra low-k dielectric material for logic chips with the lowest dielectric constant dielectric constant n. See permittivity. of any thermally stable, non-porous material. The new material is thermomechanically stable with an effective glass-transition temperature (Tge) of over 400 C. Gore's SPEEDFILM BX has a nominal dielectric constant of 2.1 with a very low effective dielectric constant, allowing for production of high performance logic wafers using the fewest metalization layers than with any other dielectric. The low effective dielectric constant is achieved by using much thinner capping layers than those used with brittle, porous dielectric materials Dielectric materials Materials which are electrical insulators or in which an electric field can be sustained with a minimal dissipation of power. Dielectrics are employed as insulation for wires, cables, and electrical equipment, as polarizable media for . Gore's ultra low-k spin-on dielectric (SOD) can be processed using conventional back-end processes and equipment. By reducing the number of metalization layers required and utilizing existing resources, manufacturers can decrease their production cost per wafer. SPEEDFILM BX is a water-based polytetrafluoroethylene polytetrafluoroethylene a synthetic material commonly used as a nonstick lining in domestic cooking utensils (frypans); abbreviated PTFE; called also Teflon. Overheating produces toxic fumes that cause an acute hemorrhagic pneumonitis and death in small caged birds, which are (PTFE PTFE polytetrafluoroethylene. )/siloxane nanocomposite and is the only solid ultra low-k IC dielectric available. It is chemically inert with respect to all known semiconductor processor chemicals - it presents no known diffusion problems when used with aluminum, and is highly compatible with copper when titanium nitride is used as a barrier material. With these common IC materials, PTFE is extremely stable and the fluorine fluorine (fl `ərēn, –rĭn), gaseous chemical element; symbol F; at. no. 9; at. wt. 18.998403; m.p. −219.6°C;; b.p. −188.14°C;; density 1. presents no known diffusion problems. Thermomechanically stable at 400 C, SPEEDFILM BX is easy to process and exhibits high fracture toughness. It presents an excellent profile for trench and via structures, eliminating any significant etching concerns. To support its SPEEDFILM program, Gore has process engineers available to assist with developmental work. Coated 200mm wafers as well as partially processed wafers with dielectric, hardmask and patterned photoresist, ready for dielectric etch processing, are available from Gore. For more information on Gore SPEEDFILM IC Dielectric, call Buck Bakhru at 800-689-0701 or visit www.gore.com. W. L. Gore & Associates, Inc., is an innovative, high technology manufacturing company based in Newark, Del. Gore has pioneered the use of expanded polytetrafluoroethylene expanded polytetrafluoroethylene (ePTFE) (ekspan´did pol´ētet´r SPEEDFILM is a trademark of W. L. Gore and Associates. GORE-TEX is a registered trademark of W. L. Gore and Associates. |
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