New TC203 series ASIC family from Toshiba offers mixed 3/5V operation.SAN JOSE, Calif.--(BUSINESS WIRE)--Aug. 28, 1995--Toshiba America Electronics Components Inc. (TAEC TAEC Toshiba America Electronic Components, Inc. TAEC Thailand Atomic Energy Commission ) Monday announced its new mixed 3/5 volt (V) deep submicron CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes. TC203 series application specific integrated circuits (ASIC (Application Specific Integrated Circuit) Pronounced "a-sick." A chip that is custom designed for a specific application rather than a general-purpose chip such as a microprocessor. ). The TC203 family is based on a true thin oxide, high density, 0.4 micron (um) technology that provides reduced power consumption. "This is a no compromise solution for mixed 3/5V applications. It is achieved by advanced technology, not by any circuit design trade offs," stated Frank Ramsay, director of technical marketing for Toshiba's System Integrated Circuit Division (SID). "The TC203 series employs an inexpensive dual oxide extra technology step for the 5V I/O (Input/Output) The transfer of data between the CPU and a peripheral device. Every transfer is an output from one device and an input to another. See PC input/output. I/O - Input/Output that does not make concessions to the full deep sub-micron core performance." The TC203 series technology allows designers to efficiently bridge the 3/5V world. It is geared towards such applications as PC chipsets, including the P6(tm), 5V PC graphics, notebook PCs and PDA (Personal Digital Assistant) A handheld computer for managing contacts, appointments and tasks. It typically includes a name and address database, calendar, to-do list and note taker, which are the functions in a personal information manager (see PIM). , telecommunication and multimedia. High gate count, 5V designs benefit by using a 3V core for performance gains and power savings. TC203 series supports the R3900 microprocessor core for such applications as laser printers, fax/modems and handheld computers. TC203 series uses double layer metal and triple layer metal on 14 gate array masters to provide from 11,000 to 700,000 usable gates. Typical loaded gate delay is 190 picoseconds (ps) for the gate array and 170ps for the standard cell implementation, a 20 percent improvement over 0.5 um technologies. Maximum I/O pads are 512. In order to provide optimum solutions for pad limited designs, the TC203 series is designed to use Toshiba high density, 62 um inner lead TAB bonding package technology. This approximately doubles the pad density on a given size die. It is supported by an extensive range of packages including a wide series of BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. options. The TC203 series is available in gate array, embedded array and standard cell methodologies. TC203G samples will be available first quarter, 1996, with full production starting second quarter, 1996. Pricing for the TC203G gate array ranges from $53 with 78,000 usable gates in 225-pin packaging in quantities of 10,000 units. The associated NRE (Non-Recurring Engineering) Refers to the cost of creating a new product, which is paid up front. Contrast with "production cost," which is ongoing and based on the quantity of material produced. ranges from $30,000 to $110,000. Toshiba announced its System ASIC methodology in May of this year which concentrates on advanced deep sub-micron technologies, reduced instruction set computing Noun 1. reduced instruction set computing - (computer science) a kind of computer architecture that has a relatively small set of computer instructions that it can perform reduced instruction set computer, RISC (RISC RISC in full Reduced Instruction Set Computing Computer architecture that uses a limited number of instructions. RISC became popular in microprocessors in the 1980s. ) cores and high performance I/Os. The ASIC family members include the TC203, TC200, TC190, TC180 and TC170 series and are available in gate array, cell based and embedded array methodologies. The high performance I/Os include 3.3V, 5V and universal PCI (1) (Payment Card Industry) See PCI DSS. (2) (Peripheral Component Interconnect) The most widely used I/O bus (peripheral bus). buffers as well as analog phase lock loops and high performance GTL GTL - Gunning Transceiver Logic buffers.
Product Summary -- TC203 Master Lineup:
Usable Gates I/O Pads
Double-layer Triple-layer Wirebond TAB 62um
Reference Metal Metal Pads
TC203G02/52 11K 20K 80 152 TC203G04/54 20K 35K 104 200 TC203G05/56 29K 50K 128 248 TC203G08/58 37K 64K 144 288 TC203G10/60 44K 77K 160 316 TC203G12/62 54K 94K 176 348 TC203G14/64 64K 112K 192 380 TC203G16/66 78K 137K 208 420 TC203G20/70 95K 165K 240 - TC203G24/74 122K 211K 272 - TC203G32/82 171K 300K 336 - TC203G36/86 224K 390K 384 - TC203G40/90 284K 494K 432 - TC203G42/92 398K 694K 512 - TAEC is the North American North American named after North America. North American blastomycosis see North American blastomycosis. North American cattle tick see boophilusannulatus. engineering, manufacturing, sales and marketing arm of one of the world's largest suppliers of semiconductors, integrated circuits and electronic components for industrial and consumer applications. The company is the recognized leader in CMOS technology and has one of the broadest IC product lines in the industry. In addition, Toshiba is a leading manufacturer of technologically advanced electron tubes and solid state devices, including color pictures tubes, display monitor tubes, liquid crystal displays, medical tubes, rechargable lithium ion batteries, microwave components, laser diodes and optical transmission devices. The ASIC unit is located at 1060 Rincon Circle, San Jose, Calif., 95131. Note To Editors: Reader inquiries please publish 800/879-4963. Color slides and data sheet available upon request, please call Christine Kim at 714/863-3261. The P6 is a trademark of Intel Corporation. CONTACT: Toshiba America Electronic Components Inc. Jim Lucas, 408/526-2535 or Shafer Public Relations public relations, activities and policies used to create public interest in a person, idea, product, institution, or business establishment. By its nature, public relations is devoted to serving particular interests by presenting them to the public in the most , Irvine Pam Sloane or Judith G. Kahn, 800/503-1177 |
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