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New LVC Family of Logic From QSI; QSI Now Offers 19 New 3.3-Volt LVC/LVCH Devices to Round Out Its Other Logic Product Lines.

SANTA CLARA, Calif.--(BUSINESS WIRE)--Nov. 17, 1998--Quality Semiconductor Inc. (QSI)(Nasdaq:QUAL QUAL Quality
QUAL Qualitative
QUAL Qualification
) announced today the availability of 19 new 3.3-volt high-performance LVC/LVCH devices.

These new devices are the latest in a series of advanced logic devices that have been introduced by QSI. LVC logic is the industry standard 3.3-volt logic family.

QSI plans to add 25 additional devices to the family over the next year. The current offering consists of octal and 16-bit bus interface functions such as buffers, transceivers, and registers. The LVC family is a natural addition to the current LCX, LCXPlus and FCT logic families offered by QSI.

The LVC devices are ideally suited for 3.3-volt applications such as laptop computers and portable equipment. The 5-volt tolerant inputs and outputs allow interfacing in a mixed-voltage environment, such as data processing, telecommunications, networking and mass storage applications. All of the LVC devices offered by QSI are also ideal for hot-docking and hot-swapping applications.

Outstanding Value

"As equipment is designed to operate at lower voltages, the 3.3-volt logic market continues to grow faster than other logic markets," according to Richard Nedinsky, QSI's logic marketing manager. "LVC offers the design engineer the best price/performance advantage in today's cost driven market."

The 8-bit functions are available in SOIC (Small Outline IC) A small-dimension, plastic, rectangular, surface mount chip package that uses gull-wing pins extending outward. See gull-wing lead, SOJ and chip package. , space saving QSOP QSOP Quarter Size Outline Package
QSOP Quarter Small Outline Package
QSOP Quad Small Outline Package
QSOP Quadripartite Standing Operating Procedures
QSOP Quarterly Standing Order Plan
QSOP Quality Standard Operating Procedure
QSOP Quarter Sized Outline Package
 and TSSOP TSSOP Thin Shrink Small Outline Package
TSSOP Thin Scale Small Outline Package
 packages. The 16-bit functions are available in SSOP SSOP Shrink Small Outline Package
SSOP Sanitation Standard Operating Procedures (USDA)
SSOP Sanitary Standard Operating Procedures
SSOP Sharescan-Open Platform (Ecopy)
SSOP Site Security Operational Procedures
 and TSSOP packages.

Price and Availability

The complete LVC logic family is available from stock, and through a worldwide network of stocking representatives and distributors. Typical 1000-piece pricing for the family begins at $0.69 for the QS74LVC245AQ and $1.24 for the QS74LVCH62244PV.

Quality Semiconductor Inc. manufactures a complete line of 3.3-volt LVC, LCX, LCXPlus and LCV CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes.  logic devices, 5-volt FCT logic devices, clock management devices, QuickSwitch devices, analog switches, JTAG devices, content-addressable memory devices, and advanced networking products. These products are used in today's most sophisticated data communications, networking, image processing, and digital signal processing See DSP.

Digital Signal Processing - (DSP) Computer manipulation of analog signals (commonly sound or image) which have been converted to digital form (sampled).
 applications.

In addition to innovative product development, QSI has been instrumental in the development of today's smallest packaging such as the QSOP, HQSOP HQSOP Hermetic Qsop , and MillipaQ.

QSI, QuickSwitch, HQSOP, and the Q logo are registered trademarks of Quality Semiconductor Inc. MillipaQ and LCXPlus are trademarks of Quality Semiconductor Inc.
COPYRIGHT 1998 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 1998, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Publication:Business Wire
Geographic Code:1USA
Date:Nov 17, 1998
Words:374
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