New Isolated TO-247 Power Package Features 2500V Internal Isolation; IXYS Revolutionary Approach Improves Thermal Conductance and Reliability.

SANTA CLARA, Calif.--(BUSINESS WIRE)--Feb. 8, 1999--IXYS Corporation, a leader in power semiconductors for power conversion and motion control applications, announced today the introduction of a new, revolutionary, plastic encapsulated package in the `hole-less' TO-247 outline with an electrically isolated mounting tab.

In the new IXYS package, called ISOPLUS247(TM), the standard copper lead frame has been replaced by Direct-Copper-Bonded alumina to which any discrete semiconductors, from diodes to MOSFETs to thyristors, can be soldered.

The ISOPLUS247 dramatically simplifies power semiconductor device assembly and may be mounted directly onto a heatsink with no isolation interface material because the isolation voltage rating of mounting tab to the chip and its leads is 2500V(rms). The use of a DCB ceramic substrate in place of a copper lead frame has the following additional advantages.

For the same chip area, the package will have the industry's lowest isolated thermal resistance junction-to-heatsink because the power dissipated in the chip flows to the heatsink through only one non-soldered interface. Temperature and power cycling capability is improved due to the chip being soldered to a ceramic substrate with a matching thermal expansion coefficient. Stray junction-to-heatsink capacitance is reduced, thereby reducing radiated EMI.

Finally the DCB lead frame will make possible additional circuit configurations, e.g. common anode connected FRED diodes, MOSFET plus Schottky diode, etc. UL recognition is being applied for, which will add to its advantages in meeting safety requirements.

The first products to be introduced are HiPerFET(TM) MOSFETs, spanning the range from 70V/180A to 500V/55A types. Additionally IGBTs, Schottky Rectifiers, and Ultra fast switching diodes are planned.

IXYS Corporation offers a broad line of Power Semiconductors, including Power MOSFETs, IGBTs, Ultra-fast Reverse Recovery Diodes, Thyristors, Schottky and Standard Recovery Diodes, Multi-chip Modules and Power Interface Integrated Circuits. For further information, contact IXYS Corporation at 408-982-0700, via fax at 408-496-0670, e-mail at [e-mail] or at www.ixys.com.

Statements in this press release regarding IXYS' business that are not historical facts are "forward-looking statements" that involve risks and uncertainties, including, but not limited to demand for the Company's products, the ability of the company to develop, manufacture, and market new products, demand by end-users for the products produced by the Company's customers, and the other risks detailed from time to time in the Company's reports filed with the Securities and Exchange Commission.