NEPCON West offers manufacturing solutions.
NEPCON West will feature Emerging Interconnection Technologies, a symposium on solutions that will serve and stimulate the electronics industry. The session will feature a panel of industry experts to help identify the technologies and companies that are likely to have the most significant impact on the future of electronics packaging. Demonstrations on the show floor will bring such innovations to life and afford an opportunity to discuss technology advancements with participating companies.
The symposium will focus on several areas: embedded passives; backplane/connector systems; high-density interconnect substrate enablers; and low inductance, low insertion force connection systems.
The SMTA (Minneapolis, MN, www.smta.org) has also announced the preliminary technical programs to be held during the event. Technical sessions for NEPCON West are arranged by tracks and include: advanced packaging and substrates; test, inspection and reliability; process control; business issues; emerging technologies; and manufacturing and assembly. Technical sessions for the Fiberoptic Automation Expo include: photonic materials and processing; discrete devices; optoelectronics; fiber fusion/connectors; photonic packages; testing and reliability; manufacturing; and business issues.
Michael Mace, chief competitive officer of PalmSource, Inc. (Sunnyvale, CA), will present insights into the future of the mobile device market. In his keynote address, which is free to all registered NEPCON West attendees and exhibitors, Mace will provide a look ahead--forecasting the ways people will use mobile devices in the future and technology's role in initiating such changes. He will also examine the convergence of wireless phones and handheld computers.
Jeff Montgomery, founder and chairman of ElectroniCast, Inc. (San Mateo, CA), will present a free keynote address for the Fiberoptic Automation Expo. He will overview the fiberoptics industry and define the factors impelling change--including the automation of assembly and test; the evolution toward high-volume/low-cost production; the transition to outsourced manufacturing; the resurgence of regulation in the telecommunications industry; the consolidation of networks; and the disintegration of fiberoptic communication equipment vendors. He will also discuss the challenges and rewards of evolving to the appropriate automation of assembly and test, concluding with a review of the evolution in fiberoptic automation equipment vendors.
For more information about this event, visit www.nepcon.com.
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|Title Annotation:||Industry News|
|Author:||Collins, Holly E.|
|Date:||Nov 1, 2002|
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