NEC Adopts Sigrity's Chip-Package Co-Design Solutions for Dynamic Power Analysis; CoDesign Studio and XcitePI Solutions Chosen to Identify Critical Package Effects and Prevent Costly Respins.SANTA CLARA Santa Clara, city, Cuba Santa Clara (sän`tä klä`rä), city (1994 est. pop. 217,000), capital of Villa Clara prov., central Cuba. , Calif. -- Sigrity, Inc. today announced that NEC (NEC Corporation, Tokyo, www.nec.com, www.necus.com) An electronics conglomerate known in the U.S. for its monitors. In Japan, it had the lion's share of the PC market until the late 1990s (see PC 98). NEC was founded in Tokyo in 1899 as Nippon Electric Company, Ltd. Corporation has adopted Sigrity's XcitePI(TM) and CoDesign Studio(TM) solutions for power integrity analysis of NEC's next generation of supercomputer supercomputer, a state-of-the-art, extremely powerful computer capable of manipulating massive amounts of data in a relatively short time. Supercomputers are very expensive and are employed for specialized scientific and engineering applications that must handle very products. XcitePI performs full-chip, dynamic simulation Dynamic Simulation is similar to a physics engine, the technology used in many powerful computer graphics software programs, like 3ds Max, Maya, Lightwave, and many others to simulate physical characteristics. of the complete power grid to determine the severity of on-chip power integrity issues. CoDesign Studio is the only EDA (1) (Electronic Design Automation) Using the computer to design, lay out, verify and simulate the performance of electronic circuits on a chip or printed circuit board. solution that simultaneously co-simulates the complete chip and entire package in an integrated design The introduction to this article provides insufficient context for those unfamiliar with the subject matter. Please help [ improve the introduction] to meet Wikipedia's layout standards. You can discuss the issue on the talk page. environment, identifying all distributed package effects that impact the correct operation of the chip to ensure ICs work as expected when placed into actual packages. Sigrity's unique chip-package co-design analysis approach provides fast and accurate results, potentially saving millions of dollars by preventing costly respins. According to according to prep. 1. As stated or indicated by; on the authority of: according to historians. 2. In keeping with: according to instructions. 3. Takeshi Nishikawa, general manager of the Computer Division at NEC Corporation, "Electrical power modeling of our very complex chip and its entire package is a very complex process, and we believe that the package effects will have a significant impact on the correct operation of the chip. Sigrity's CoDesign Studio solution with XcitePI and SPEED 2000 quickly and effectively addresses our concerns in a comprehensive manner. It identifies critical chip-package interactions during power integrity analysis that we need to address in order to meet our commitment to operational excellence." Jiayuan Fang, president of Sigrity said, "We're pleased that NEC, like several other leading electronic companies, is using CoDesign Studio and XcitePI for fast and accurate full-system power analysis. This solution set delivers comprehensive analysis of both the chip and package effects to ensure correct design operation and to help reduce expensive design iterations." Simultaneous chip-package co-simulation Unlike other EDA tools, CoDesign Studio performs simultaneous chip-package co-simulation, analyzing power integrity of the entire chip and package power delivery system to quickly achieve accurate results. It combines Sigrity's SPEED2000(TM) solution, the industry's defacto-standard for electrical analysis of packages, with the company's XcitePI(TM) solution for IC power grid analysis. CoDesign Studio takes into account the complete self and mutual parasitics of the chip and all electromagnetic interactions Noun 1. electromagnetic interaction - an interaction between charged elementary particles that is intermediate in strength between the strong and weak interactions; mediated by photons within the package. Its intelligent "what-if" analysis in the chip-package co-design environment provides multiple design choices, including chip and package decoupling capacitor A decoupling capacitor is a capacitor used to decouple one part of an electrical network (circuit) from another. Noise caused by other circuit elements is shunted through the capacitor reducing the effect they have on the rest of the circuit. selection and placement, flip-chip or wirebond package selection, IC floorplan modification, and C4 bump and IC power grid reconfiguration. About Sigrity Sigrity, Inc., a privately held U.S. company incorporated in 1998, delivers advanced software solutions for package physical design and for analyzing power and signal integrity in chips, packages and printed circuit boards. Sigrity's patented electrical analysis methodologies run orders of magnitude faster than general-purpose electromagnetic electromagnetic /elec·tro·mag·net·ic/ (-mag-net´ik) involving both electricity and magnetism. electromagnetic pertaining to or emanating from electromagnetism. tools, helping leading companies in the semiconductor, computer, graphics, communications and networking industries ensure high performance and reduce time to market. The company is headquartered in Santa Clara, Calif., with direct sales and global distribution through worldwide representatives. For more information about how to ensure operational designs by using Sigrity's package physical design and power and signal integrity analysis solutions, please visit: http://www.sigrity.com. Sigrity, the Sigrity logo, CoDesign Studio, SPEED2000, and XcitePI are trademarks of Sigrity, Inc. |
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