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Multimedia Available: Applied Materials' Breakthrough 300mm Copper Electroplating System Drives Interconnect Technology Beyond the 90nm Barrier.


Business Editors/High-Tech Writers

ADVISORY...for Wednesday (June 18)

NOTE TO EDITORS: Multimedia Assets Available With This Story

Include Logos, Photos, Text News Releases

--(BUSINESS WIRE)

Applied Materials Applied Materials, Inc. NASDAQ: AMAT (HKSE: 4336 ) is the global leader in nanomanufacturing technology solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel solar displays, solar , Inc. introduces its 300mm SlimCell(TM) electrochemical electrochemical /elec·tro·chem·i·cal/ (-kem´i-k'l) pertaining to interaction or interconversion of chemical and electrical energies.

e·lec·tro·chem·i·cal
adj.
 plating (ECP (Enhanced Capabilities Port) See IEEE 1284.

1. ECP - Engineering Change Proposal.
2. ECP - Enhanced Capabilities Port.
3. ECP - Extended Capabilities Port.
4. ECP - Extended Concurrent Prolog.
) system that overcomes the limitations of existing plating technology to deliver a cost-effective, production-worthy tool for current generation manufacturing and groundbreaking capability for 65nm and beyond copper chip development. Key to the SlimCell system is its unique individual-cell chemistry that enables multi-step ECP processing while setting benchmarks in gapfill and defect defect - bug  performance, and cost of ownership.

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Publication:Business Wire
Geographic Code:1USA
Date:Jun 18, 2003
Words:165
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